中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

66 records (took 0.017 seconds)

    LIGHT EMITTING DEVICE
    5.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开

    公开(公告)号：US20180049319A1

    公开(公告)日：2018-02-15

    申请号：US15790168

    申请日：2017-10-23

    Applicant: GENESIS PHOTONICS INC.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin ,  Meng-Ting Tsai

    IPC: H05K1/05

    CPC classification number: H05K1/05 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K3/3436 ,  H05K2201/10106

    Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

    LIGHT EMITTING MODULE
    6.
    发明申请
    LIGHT EMITTING MODULE 审中-公开

    公开(公告)号：US20180040594A1

    公开(公告)日：2018-02-08

    申请号：US15785399

    申请日：2017-10-16

    Applicant: Genesis Photonics Inc.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L33/64 ,  H01L33/56

    CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

    LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权
    发光二极管结构及其制造方法

    公开(公告)号：US20160276547A1

    公开(公告)日：2016-09-22

    申请号：US15073715

    申请日：2016-03-18

    Applicant: Genesis Photonics Inc.

    Inventor： Cheng-Wei Hung ,  Yu-Feng Lin

    IPC: H01L33/50 ,  H01L27/15 ,  H01L33/38 ,  H01L33/00 ,  H01L33/56 ,  H01L33/40

    CPC classification number: H01L33/502 ,  H01L27/156 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/385 ,  H01L33/40 ,  H01L33/50 ,  H01L33/505 ,  H01L33/52 ,  H01L33/56 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

    Abstract: An edge lighting light emitting diode (LED) structure and a method of manufacturing the same are provided. The edge lighting LED structure includes a substrate, an electrode pattern, a chip, an encapsulation layer and a fluorescent layer. The electrode pattern at least includes two first conducting portions separately disposed on an upper surface of the substrate, two second conducting portions separately disposed on a lower surface of the substrate, and two conducting holes separately vertically penetrating through the substrate, each conducting hole connects a first conducting portion and a second conducting portion, and the conducting holes are exposed on a lateral surface of the substrate. A second surface of the chip is disposed on the first conducting portions. A top surface of the encapsulation layer exposes and is aligned with the first surface of the chip. The fluorescent layer covers a first surface of the chip.

    Abstract translation: 提供一种边缘照明发光二极管（LED）结构及其制造方法。 边缘照明LED结构包括基板，电极图案，芯片，封装层和荧光层。 电极图案至少包括分别设置在基板的上表面上的两个第一导电部分，分别设置在基板的下表面上的两个第二导电部分和分别垂直穿过基板的两个导电孔，每个导通孔连接 第一导电部分和第二导电部分，并且导电孔暴露在基板的侧表面上。 芯片的第二表面设置在第一导电部分上。 封装层的顶表面暴露并与芯片的第一表面对准。 荧光层覆盖芯片的第一表面。

    LIGHT EMITTING MODULE
    9.
    发明申请
    LIGHT EMITTING MODULE 审中-公开
    发光模块

    公开(公告)号：US20160013166A1

    公开(公告)日：2016-01-14

    申请号：US14737503

    申请日：2015-06-12

    Applicant: Genesis Photonics Inc.

    Inventor： Hao-Chung Lee ,  Yu-Feng Lin

    IPC: H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/54 ,  H01L33/50 ,  H01L33/64 ,  H01L33/60

    CPC classification number: H01L25/0753 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

    Abstract translation: 提供了包括发光器件封装结构和散热结构的发光模块。 发光器件封装结构包括发光器件，图案化反射元件和图案化导电层。 图案化的反射元件设置在发光器件的侧表面周围并且暴露第一焊盘的第一底表面和第二焊盘的第二底表面。 图案化导电层设置在第一焊盘的第一底表面和第二焊盘的第二底表面上。 发光器件通过串联连接，并联连接或通过图案化导电层的串联并联连接彼此电连接。 散热结构设置在发光器件封装结构的下方，并且包括放热单元和布置在散热单元上的图案化电路层。

Patent Agency Ranking