THRESHOLD VOLTAGE-PROGRAMMABLE FIELD EFFECT TRANSISTOR-BASED MEMORY CELLS AND LOOK-UP TABLE IMPLEMENTED USING THE MEMORY CELLS

    公开(公告)号:US20240221810A1

    公开(公告)日:2024-07-04

    申请号:US18607725

    申请日:2024-03-18

    CPC classification number: G11C11/223 G11C11/2273 G11C11/2275

    Abstract: Disclosed is threshold voltage (VT)-programmable field effect transistor (FET)-based memory cell including a first transistor and a second transistor (which has an electric-field based programmable VT) connected in series between two voltage source lines. The gates of the transistors are connected to different wordlines and a sense node is at the junction between the two transistors. In preferred embodiments, the first transistor is a PFET and the second transistor is an NFET. Different operating modes (e.g., write 0 or 1 and read) are achieved using specific combinations of voltage pulses on the wordlines and voltage source lines. The memory cell is non-volatile, exhibits relatively low leakage, and has a relatively small footprint as compared to a conventional memory cell. Also disclosed are a look-up table (LUT) incorporating multiple threshold voltage (VT)-programmable field effect transistor (FET)-based memory cells and associated methods.

    Calibration methods and structures for partitioned memory architecture with single resistor or dual resistor memory elements

    公开(公告)号:US12136468B2

    公开(公告)日:2024-11-05

    申请号:US18045529

    申请日:2022-10-11

    Abstract: Disclosed structures include a partitioned memory architecture, which includes single resistor or dual resistor memory elements, which is configured for in-memory pipeline processing with minimal local IR drops, and which further includes additional circuitry to facilitate calibration processing. In some embodiments, the additional circuitry enables calibration processing when in-memory pipeline processing is paused. In these embodiments, the same bitlines and data sensing elements used for in-memory pipeline processing are also used for calibration processing. In other embodiments, the additional circuitry enables calibration processing concurrent with in-memory pipeline processing. In these embodiments, the additional circuitry includes duplicate pairs of memory elements with programmable resistors that can be connected to the operational circuitry for in-memory pipeline processing, to the calibration circuitry (including calibration-specific sense lines and sensing elements) for calibration processing, or to neither such that one memory element of the duplicate pair always remains operational allowing the other to undergo calibration.

    PARTITIONED MEMORY ARCHITECTURE WITH SINGLE RESISTOR MEMORY ELEMENTS FOR IN-MEMORY SERIAL PROCESSING

    公开(公告)号:US20240119977A1

    公开(公告)日:2024-04-11

    申请号:US18045520

    申请日:2022-10-11

    CPC classification number: G11C7/1096 G11C7/067 G11C7/1063 G11C7/12

    Abstract: A structure for in-memory serial processing includes a memory bank array. Each bank includes memory elements connected between input nodes and a bitline. Each memory element includes a programmable resistor with an input connected to an input node and an output connected to the bitline. Each bank includes a feedback buffer connected to the bitline and an output node. Output nodes of banks in the same column are connected to the same column interconnect line. The initial bank in each row includes amplifiers connected between the input nodes and the memory elements, respectively. Outputs of these amplifiers are also connected by row interconnect lines to memory elements in downstream banks in the same row. Optionally, voltage buffers are connected to row interconnect lines and integrated into at least some banks. The amplifiers, feedback buffers, and voltage buffers minimize local IR drops and thereby processing errors.

    Partitioned memory architecture and method for repeatedly using the architecture for multiple in-memory processing layers

    公开(公告)号:US12159685B2

    公开(公告)日:2024-12-03

    申请号:US18045545

    申请日:2022-10-11

    Abstract: A structure for in-memory processing includes memory banks arranged in columns and rows, each bank having bank input nodes, at least one bitline, and cells arranged in a column and connected to corresponding bank input nodes, respectively, and to the bitline(s). Each cell includes layer-specific memory elements, which are individually programmable to store layer-specific weight values and individually connectable (e.g., by switches) to the corresponding bank input node and the bitline(s). The initial memory banks in each row also include track-and-hold devices (THs) connected to the bank input nodes. For each iteration of in-memory processing, the outputs from one processing layer are feedback to pre-designated THs for use as inputs for the next processing layer, the appropriate layer-specific memory elements in the cells are connected to the corresponding bank input nodes and bitline(s), and output(s) for the next processing layer are generated.

    PARTITIONED MEMORY ARCHITECTURE AND METHOD FOR REPEATEDLY USING THE ARCHITECTURE  FOR MULTIPLE IN-MEMORY PROCESSING LAYERS

    公开(公告)号:US20240119975A1

    公开(公告)日:2024-04-11

    申请号:US18045545

    申请日:2022-10-11

    CPC classification number: G11C7/1039 G11C7/1012 G11C7/1084 G11C7/1096

    Abstract: A structure for in-memory processing includes memory banks arranged in columns and rows, each bank having bank input nodes, at least one bitline, and cells arranged in a column and connected to corresponding bank input nodes, respectively, and to the bitline(s). Each cell includes layer-specific memory elements, which are individually programmable to store layer-specific weight values and individually connectable (e.g., by switches) to the corresponding bank input node and the bitline(s). The initial memory banks in each row also include track-and-hold devices (THs) connected to the bank input nodes. For each iteration of in-memory processing, the outputs from one processing layer are feedback to pre-designated THs for use as inputs for the next processing layer, the appropriate layer-specific memory elements in the cells are connected to the corresponding bank input nodes and bitline(s), and output(s) for the next processing layer are generated.

    PHYSICAL UNCLONABLE FUNCTIONS BASED ON A CIRCUIT INCLUDING RESISTIVE MEMORY ELEMENTS

    公开(公告)号:US20230267998A1

    公开(公告)日:2023-08-24

    申请号:US17679207

    申请日:2022-02-24

    CPC classification number: G11C13/0059 G11C13/004 G11C13/0069 H04L9/3278

    Abstract: Circuits that include resistive memory elements and methods of using such circuits to generate a physical unclonable function. The circuit includes a first resistive memory element, a second resistive memory element, a first transistor having a source/drain region connected to the first resistive memory element, and a second transistor having a source/drain region connected to the second resistive memory element. The circuit further includes a first inverter having an input connected to a first node between the first transistor and the first resistive memory element, and a second inverter having an input connected to a second node between the second transistor and the second resistive memory element.

    Partitioned memory architecture with single resistor memory elements for in-memory serial processing

    公开(公告)号:US12211585B2

    公开(公告)日:2025-01-28

    申请号:US18045520

    申请日:2022-10-11

    Abstract: A structure for in-memory serial processing includes a memory bank array. Each bank includes memory elements connected between input nodes and a bitline. Each memory element includes a programmable resistor with an input connected to an input node and an output connected to the bitline. Each bank includes a feedback buffer connected to the bitline and an output node. Output nodes of banks in the same column are connected to the same column interconnect line. The initial bank in each row includes amplifiers connected between the input nodes and the memory elements, respectively. Outputs of these amplifiers are also connected by row interconnect lines to memory elements in downstream banks in the same row. Optionally, voltage buffers are connected to row interconnect lines and integrated into at least some banks. The amplifiers, feedback buffers, and voltage buffers minimize local IR drops and thereby processing errors.

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