公开(公告)号：US20230085958A1

公开(公告)日：2023-03-23

申请号：US17942229

申请日：2022-09-12

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calarnel ,  Xiaohong Tang

IPC: C04B41/51 ,  A61N1/375 ,  C04B41/88 ,  C04B41/45 ,  C04B41/00

Abstract: A ceramic reinforced metal composite (CRMC) comprising a composition composite as an interpenetrating network of at least two interconnected composites is described. The interpenetrating networks comprise a ceramic matrix composite (CMC) and a metal matrix composite (MMC). The composition composite is particularly useful as an electrically conductive pathway extending through the ceramic body of a hermetically sealed component, for example, a feedthrough in an active implantable medical device (AIMD).

公开(公告)号：US20200030613A1

公开(公告)日：2020-01-30

申请号：US16578476

申请日：2019-09-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  A61N1/05 ,  B23K35/30 ,  A61N1/08 ,  H01R43/00 ,  H01G4/35 ,  C22C29/12 ,  H01G4/12 ,  H01G2/10 ,  H01G4/005 ,  H02G3/22 ,  H01G4/30 ,  C04B37/02 ,  C04B35/645 ,  B32B18/00

Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

公开(公告)号：US20240383816A1

公开(公告)日：2024-11-21

申请号：US18784110

申请日：2024-07-25

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong (Shawn) Tang

IPC: C04B41/51 ,  A61N1/375 ,  C04B41/00 ,  C04B41/45 ,  C04B41/88

Abstract: A ceramic reinforced metal composite (CRMC) comprising a composition composite as an interpenetrating network of at least two interconnected composites is described. The interpenetrating networks comprise a ceramic matrix composite (CMC) and a metal matrix composite (MMC). The composition composite is particularly useful as an electrically conductive pathway extending through the insulator or ceramic body of a hermetically sealed component, for example, a feedthrough in an active implantable medical device (AIMD).

公开(公告)号：US12094626B2

公开(公告)日：2024-09-17

申请号：US18117042

申请日：2023-03-03

Applicant: Greatbatch Ltd.

Inventor： Brian P. Hohl ,  Dallas J. Rensel ,  Jonathan Calamel ,  Christine A. Frysz

IPC: B33Y10/00 ,  B28B1/00 ,  B33Y40/20 ,  B33Y80/00 ,  C04B35/626 ,  C04B35/64 ,  G06F30/10 ,  H01B17/30 ,  H01B17/58 ,  H01B19/00 ,  G06F113/10

CPC classification number: H01B17/301 ,  B28B1/001 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  C04B35/6269 ,  C04B35/64 ,  G06F30/10 ,  H01B17/58 ,  H01B19/00 ,  C04B2235/6026 ,  G06F2113/10

Abstract: A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.

公开(公告)号：US10559409B2

公开(公告)日：2020-02-11

申请号：US16362862

申请日：2019-03-25

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: A61N1/375 ,  B23K1/19 ,  C04B41/51 ,  H01B17/30 ,  C04B41/45 ,  C04B41/88 ,  H01B19/02 ,  B23K1/00 ,  C04B41/00 ,  B23K1/008 ,  B23K26/32 ,  B23K26/21 ,  B22F7/04 ,  B23K101/36 ,  B23K103/14 ,  B22F7/08

Abstract: A method for manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of first forming a ceramic reinforced metal composite (CRMC) paste by mixing platinum with a ceramic material to form a CRMC material, subjecting the CRMC material to a first sintering step to thereby form a sintered CRMC material, ball-milling or grinding the sintered CRMC material to form a powdered CRMC material; and then mixing the powdered CRMC material with a solvent to form the CRMC paste. The method further includes forming an alumina ceramic body in a green state, forming at least one via hole through the alumina ceramic body, filling the via hole with the CRMC paste, drying the ceramic body including the CRMC paste to form a first CRMC material filling the via hole, forming a second via hole through the first CRMC material, providing a metal core in the second via hole, and subjecting the ceramic body including the first CRMC material and the metal core to a second sintering step to thereby form the dielectric body. The dielectric body is then sealed in a ferrule opening to form a feedthrough.

公开(公告)号：US20230223172A1

公开(公告)日：2023-07-13

申请号：US18117042

申请日：2023-03-03

Applicant: Greatbatch Ltd.

Inventor： Brian P. Hohl ,  Dallas J. Rensel ,  Jonathan Calamel ,  Christine Frysz

IPC: H01B17/30 ,  B28B1/00 ,  H01B17/58 ,  B33Y10/00 ,  G06F30/10 ,  C04B35/626 ,  B33Y40/20 ,  C04B35/64 ,  B33Y80/00 ,  H01B19/00 ,  G06F113/10

CPC classification number: H01B17/301 ,  B28B1/001 ,  H01B17/58 ,  B33Y10/00 ,  G06F30/10 ,  C04B35/6269 ,  B33Y40/20 ,  C04B35/64 ,  B33Y80/00 ,  H01B19/00 ,  C04B2235/6026 ,  G06F2113/10

Abstract: A method for manufacturing a ceramic substrate by a 3D-printing process is described. The method comprises operating a 3D-printer to print a green-state ceramic body having a height extending to spaced apart first and second end surfaces and at least one via extending at least part-way along the height of the green-state ceramic body from the first end surface toward the second end surface. Then, the green-state ceramic body is sintered to provide the ceramic substrate with the at least one via. In cross-section, the at least one via has a square-shaped via with rounded corners.

公开(公告)号：US20220415545A1

公开(公告)日：2022-12-29

申请号：US17848545

申请日：2022-06-24

Applicant: Greatbatch Ltd.

Inventor： Brian P. Hohl ,  Dallas J. Rensel ,  Jonathan Calamel ,  Christine A. Frysz

IPC: H01B17/30 ,  H01B19/00 ,  H01B17/58 ,  G06F30/10 ,  B28B1/00 ,  B33Y10/00 ,  B33Y80/00 ,  B33Y40/20 ,  C04B35/626 ,  C04B35/64

Abstract: A ceramic subassembly manufactured by a 3D-printing process is described. The ceramic subassembly comprises a ceramic substrate having a sidewall extending to spaced apart first and second end surfaces. At least one via extends through the substrate from the ceramic substrate first end surface to the ceramic substrate second end surface. In cross-section, the via has a square-shape with rounded corners.

公开(公告)号：US11351387B2

公开(公告)日：2022-06-07

申请号：US16578476

申请日：2019-09-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/37 ,  A61N1/375 ,  A61N1/05 ,  B23K35/30 ,  A61N1/08 ,  H01R43/00 ,  H01G4/35 ,  C22C29/12 ,  H01G4/12 ,  H01G2/10 ,  H01G4/005 ,  H02G3/22 ,  H01G4/30 ,  C04B37/02 ,  C04B35/645 ,  B32B18/00 ,  H01G4/40 ,  A61N1/372 ,  B22F7/04 ,  B22F3/04 ,  B22F3/02 ,  B22F3/15 ,  C04B35/00 ,  C22C1/04

Abstract: A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.

公开(公告)号：US20180361164A1

公开(公告)日：2018-12-20

申请号：US16101639

申请日：2018-08-13

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Christine A. Frysz ,  Dallas J. Rensel ,  Brian P. Hohl

IPC: A61N1/375 ,  H02G3/22 ,  H01R43/00 ,  A61N1/05 ,  A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/10 ,  C22C29/12 ,  B23K35/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B22F3/02 ,  B22F3/04 ,  B22F3/15 ,  B22F2007/042 ,  B22F2999/00 ,  B23K35/3013 ,  B32B18/00 ,  C04B35/00 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/403 ,  C04B2237/72 ,  C22C1/0466 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.

公开(公告)号：US11651873B2

公开(公告)日：2023-05-16

申请号：US17848545

申请日：2022-06-24

Applicant: Greatbatch Ltd.

Inventor： Brian P. Hohl ,  Dallas J. Rensel ,  Jonathan Calamel ,  Christine A. Frysz

IPC: H01B17/30 ,  B33Y10/00 ,  B33Y80/00 ,  G06F30/10 ,  B33Y40/20 ,  B28B1/00 ,  C04B35/626 ,  C04B35/64 ,  H01B17/58 ,  H01B19/00 ,  G06F113/10

CPC classification number: H01B17/301 ,  B28B1/001 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00 ,  C04B35/6269 ,  C04B35/64 ,  G06F30/10 ,  H01B17/58 ,  H01B19/00 ,  C04B2235/6026 ,  G06F2113/10

Abstract: A ceramic subassembly manufactured by a 3D-printing process is described. The ceramic subassembly comprises a ceramic substrate having a sidewall extending to spaced apart first and second end surfaces. At least one via extends through the substrate from the ceramic substrate first end surface to the ceramic substrate second end surface. In cross-section, the via has a square-shape with rounded corners.