公开(公告)号：US10679930B2

公开(公告)日：2020-06-09

申请号：US15780189

申请日：2016-11-28

Applicant: HANA MICRON INC.

Inventor： Hyun Woo Lee ,  Jin Wook Jeong ,  Hyun Joo Kim ,  Jin Young Ock

IPC: H01L23/49 ,  H01L23/00 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H01L25/07 ,  H01L25/10 ,  H01L23/498 ,  H01L21/683 ,  H01L25/065 ,  H01L25/00 ,  H01L23/488 ,  H01L21/48 ,  H01L21/56

Abstract: A fan-out wafer level package is disclosed, which includes: a redistribution layer; a semiconductor chip electrically connected with the redistribution layer through a bump; a protective member protecting the semiconductor chip, wherein a part of the protective member is removed such that the upper surface of the semiconductor chip is exposed in order to dissipate heat and prevent warpage; and an interconnector disposed outside the semiconductor chip at substantially the same level and having a lower part electrically connected with the redistribution layer and an upper part not being covered with the protective member, wherein the interconnector includes a metal core solder ball, the metal core solder ball includes a metal core and a solder buffer between the metal core and the protective member, and the metal core is formed of a combination of copper (Cu), nickel (Ni), and silver (Ag).

公开(公告)号：US20150359098A1

公开(公告)日：2015-12-10

申请号：US14758195

申请日：2013-07-24

Applicant: HANA MICRON INC.

Inventor： Jin Young Ock

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/40 ,  H05K3/18 ,  H05K3/30 ,  H05K3/32 ,  H05K1/11 ,  H05K3/26

CPC classification number: H05K1/14 ,  H01L21/486 ,  H01L21/568 ,  H01L23/147 ,  H01L23/5384 ,  H01L24/19 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/181 ,  H05K3/26 ,  H05K3/303 ,  H05K3/32 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49131 ,  Y10T29/49149 ,  H01L2924/00

Abstract: The present invention relates to a circuit board having an interposer embedded therein, including: an interposer, the top side and back side of which are electrically connected by a first through-electrode; and a molding member having the interposer embedded therein and the top side and back side of the interposer exposed. According to the present invention, the molding member of an insulator and the interposer of a semiconductor can be appropriately selected and coupled according to the required fine pitch of a through-hole, and the interposer is molded on substantially the same level as a semiconductor chip, and thus no additional process for embedding the interposer needs to be added.

Abstract translation: 本发明涉及一种嵌入其中的内插器的电路板，包括：插入件，其顶侧和背面通过第一通孔电连接; 以及嵌入在其中并且插入件的顶侧和背面暴露的模制构件。 根据本发明，绝缘体的成型构件和半导体的插入件可以根据通孔的所需精细间距适当地选择和耦合，并且插入器被模制在与半导体芯片基本相同的水平上 ，因此不需要添加用于嵌入插件的附加处理。