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公开(公告)号：US11442231B2
公开(公告)日：2022-09-13
申请号：US16811010
申请日：2020-03-06
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , John R. Grady
Abstract: An optical midplane includes an airframe having a first side on which first modules are disposed and a second side on which second modules are disposed. The airframe is to provide for optimized airflow through the first modules disposed on the first side. A plurality of optical connectors are disposed at respective locations on the airframe to provide optical connectivity. Optical connectivity is provided between at least one of any first module disposed on the first side of the airframe and any second module disposed on the second side of the airframe, any first modules disposed on the first side of the airframe, and any second modules disposed on the second side of the airframe.
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公开(公告)号：US20210285258A1
公开(公告)日：2021-09-16
申请号：US16819298
申请日：2020-03-16
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , Everett R. Salinas , John R. Grady
Abstract: A lock mechanism for a faceplane infrastructure coupled externally from a faceplate of a modular device includes a locking bar, a locking bar engagement element, and a securing device. When the lock mechanism is assembled and in a locked state, the locking bar is housed within the modular device. Further, when the lock mechanism is assembled and in the locked state, the locking bar engagement element is fixedly coupled to a first portion of the faceplane infrastructure and removably engaged with the locking bar through an aperture in the faceplate of the modular device. Moreover, when the lock mechanism is assembled and in the locked state, the securing device locks the first portion of the faceplane infrastructure to the faceplate of the modular device.
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公开(公告)号：US20180046230A1
公开(公告)日：2018-02-15
申请号：US15550853
申请日：2015-02-20
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Troy A. Della Fiora , John R. Grady , Joseph Allen
IPC: G06F1/18 , H01R13/629 , H01R12/70
CPC classification number: G06F1/186 , H01R12/7058 , H01R13/62983
Abstract: In one implementation, a system for a tool-less multipoint latching mechanism includes a number of adjustable cams of a bracket to interact with a number of corresponding cam surfaces located on a computing board, a number of locking locations to couple a printed circuit assembly (PCA) to the bracket, and a number of pin-in-slot joints of the bracket that interact with the number of adjustable cams to vertically lower the coupled PCA into a number of receiving connectors on the computing board.
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公开(公告)号：US20230422427A1
公开(公告)日：2023-12-28
申请号：US17848016
申请日：2022-06-23
Applicant: Hewlett Packard Enterprise Development LP
Inventor： Andrew Benjamin Potter , John R. Grady , Arthur G. Volkmann
CPC classification number: H05K7/20145 , G06F1/20
Abstract: An air baffle assembly for air cooling in computer systems is described. The air baffle assembly can include a baffle body removably installed on a printed circuit assembly deployed on a chassis. The baffle body can cover memory components. The air baffle assembly can also include an air dam removably installed on the baffle body. The baffle body has a slot positioned on a side of the baffle body, which can be substantially parallel to a wall of the chassis. The baffle body can further include alignment rails positioned in the slot to guide installation of the air dam into the slot. The installed air dam can reduce a bypass region, thereby reducing airflow through the bypass region and increasing airflow through the memory components.
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公开(公告)号：US20210278599A1
公开(公告)日：2021-09-09
申请号：US16811010
申请日：2020-03-06
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , John R. Grady
Abstract: An optical midplane includes an airframe having a first side on which first modules are disposed and a second side on which second modules are disposed. The airframe is to provide for optimized airflow through the first modules disposed on the first side. A plurality of optical connectors are disposed at respective locations on the airframe to provide optical connectivity. Optical connectivity is provided between at least one of any first module disposed on the first side of the airframe and any second module disposed on the second side of the airframe, any first modules disposed on the first side of the airframe, and any second modules disposed on the second side of the airframe.
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Patent Agency Ranking
公开(公告)号：US20180324971A1
公开(公告)日：2018-11-08
申请号：US15772292
申请日：2015-10-30
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John R. Grady , George D. Megason , Joseph Allen
CPC classification number: H05K7/1489 , G06F1/181 , G06F1/183
Abstract: In one example, a shelf includes a shelf lock positioned within a spring retention pocket of the shelf. The shelf lock includes a main body that includes a spring retention slot to accommodate a spring and an opening to accommodate a pressure component. The shelf lock includes a retractable tab to be inserted into an enclosure to prevent movement of the shelf when mounted in the enclosure. The spring to exert an outward force to insert the retractable tab into the enclosure and the retractable tab to be retracted by an inward pressure.
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公开(公告)号：US20240365502A1
公开(公告)日：2024-10-31
申请号：US18308814
申请日：2023-04-28
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Ching-Chun Hsu , Kai Zhang , Sung-Hsia Kuo , Hsin Chang Lu , John R. Grady
IPC: H05K7/20
CPC classification number: H05K7/20236 , H05K7/20263 , H05K7/20272 , H05K7/20772 , H05K7/20836
Abstract: disclosed. The electronic device includes a chassis, electronic components disposed within the chassis, the cooling containers, and a coolant loop. The chassis has an internal volume partly filled with coolant to form coolant pool in the internal volume. The containers are disposed within the chassis such that each container contains at least one electronic component. The coolant loop circulates the coolant from the coolant pool to the containers. For example, each container receives an inflow of the coolant from the coolant loop or from another one container and immerse the at least one electronic component in the coolant to remove heat from the at least one electronic component and output an outflow of the coolant that overflows into the coolant pool or into at least one adjacent container, where a level of the coolant in the coolant pool is lower than respective levels of the coolant in the containers.
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公开(公告)号：US20240256006A1
公开(公告)日：2024-08-01
申请号：US18159840
申请日：2023-01-26
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： John R. Grady , Kevin Frank Labbe , Keith Allen Sauer
CPC classification number: G06F1/187 , G11B33/128
Abstract: A hybrid drive carrier frame includes a front rail comprising a first end, a second end, and a body extending along a transverse direction between the first and second ends. The frame comprises a first side rail extending from the first end of the front rail perpendicular to the transverse direction and a second side rail extending from the second end of the front rail perpendicular to the transverse direction and parallel to the first side rail. The first side rail is formed from a metal material and includes a locking tab extending along the transverse direction. The front and second side rails are formed from a plastic material. The front rail includes a locking channel at the first end of the front rail and the first side rail is connected to the first end of the front rail via engagement of the locking tab within the locking channel.
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公开(公告)号：US20220244762A1
公开(公告)日：2022-08-04
申请号：US17166595
申请日：2021-02-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , Harvey J. Lunsman , John R. Grady
Abstract: A computing system includes an array of compute module racks, each compute module rack containing a plurality of compute modules and each compute module being accessible by extracting the compute module rack out of the array of compute module racks. A liquid distribution infrastructure comprising liquid coolant supply lines and return lines is arranged in a first plane adjacent to the array of compute module racks and coupled to each of the vertical racks to provide liquid cooling for the plurality of compute module racks. A power distribution infrastructure comprising power supply lines is arranged in a second plane adjacent to the array of compute module racks and coupled to each of the compute module racks. An optical interconnection infrastructure comprising optical fiber cables is arranged in a third plane adjacent to the array of compute module racks and coupled to each of the compute module racks.
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公开(公告)号：US11385418B2
公开(公告)日：2022-07-12
申请号：US17011810
申请日：2020-09-03
Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Inventor： Kevin B. Leigh , John R. Grady
Abstract: Systems and assemblies are provided for reconfigurable waveguide (RWG) blocks having fixed waveguides therein. The RWG blocks can receive multiple self-aligned simplex ferrules to achieve customized fiber shuffles that are reconfigurable. A RWG block assembly includes the RWG block with fixed waveguides, a parallel-fiber ferrule interface to install a parallel-fiber ferrule, a plurality of simplex ferrule interfaces to install one or more simplex ferrules which allows the simplex ferrules to be positioned modularly within the RWG block assembly. The fixed waveguides allow optically coupling between the parallel-fiber ferrule and the one or more simplex ferrules via the RWG block. An assembly can also include a RWG block housing with the RWG block installed therein, and a carrier bracket coupled to the RWG block housing that receives a plurality of simplex ferrules such that each of the plurality of simplex ferrules can be positioned modularly and self-aligned within the carrier bracket.
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