Projector, 3D sensing module and method for fabricating the projector

    公开(公告)号:US11573485B2

    公开(公告)日:2023-02-07

    申请号:US16559564

    申请日:2019-09-03

    Abstract: A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.

    Packaging structure of laser diode

    公开(公告)号:US10270219B1

    公开(公告)日:2019-04-23

    申请号:US15894896

    申请日:2018-02-12

    Abstract: A packaging structure of a laser diode is provided. The packaging structure of the laser diode includes a laser chip, a first substrate and a second substrate. The first substrate having a first electrode and a second electrode on a first surface of the first substrate, and the laser chip is disposed on the first surface of the first substrate; and a second substrate having a third electrode and a fourth electrode on a second surface of the second substrate, wherein the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by a wireless-bonding process, respectively.

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