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公开(公告)号:US20200014172A1
公开(公告)日:2020-01-09
申请号:US16028436
申请日:2018-07-06
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Han-Yi Kuo , Yun-Lien Hsiao , Shi-Jen Wu , Yin-Dong Lu
Abstract: The present invention provides a projector including a substrate, a laser module and a lens module. The laser module is positioned on the substrate, and a laser diode of the laser module is not packaged within a can. The lens module is arranged for receiving a laser beam from the laser diode of the laser module to generate a projected image of the projector.
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公开(公告)号:US20190215499A1
公开(公告)日:2019-07-11
申请号:US15866436
申请日:2018-01-09
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Han-Yi Kuo , Yin-Dong Lu , Shi-Jen Wu , Chih-Sheng Chang , Teng-Te Huang
CPC classification number: H04N9/3147 , G01J1/0477 , G02B5/04 , G02B27/1073 , G03B21/28 , H04N5/7458 , H04N9/3161
Abstract: The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.
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公开(公告)号:US20250102739A1
公开(公告)日:2025-03-27
申请号:US18371249
申请日:2023-09-21
Applicant: Himax Technologies Limited
Inventor: Shi-Jen Wu , Yin-Tung Lu , Shu-Hao Hsu , Teng-Te Huang
Abstract: An optical fiber array includes a groove plate having a plurality of grooves disposed on a top surface thereof; and an optical component plate having a plurality of first optical components disposed on a first surface of the optical component plate and a plurality of second optical components disposed on a second surface of the optical component plate, the second surface being opposite the first surface.
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公开(公告)号:US11573485B2
公开(公告)日:2023-02-07
申请号:US16559564
申请日:2019-09-03
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Yin-Dong Lu , Chih-Yu Chuang , Shi-Jen Wu
Abstract: A projector, a 3D sensing module and a method for fabricating the projector are provided. The 3D sensing module includes the projector and a receiver. The projector is configured to project a light beam to an object, and the receiver is configured to receive the light beam reflected from the object. The projector includes a circuit board, electronic components, a holder and a lens module. The circuit board has a plurality of first bonding pads and a plurality of second bonding pads on a top surface of the circuit board. The electronic components are bonded on the first bonding pads. The holder has a cavity and third bonding pads bonded on and electrically connected to the second bonding pads. The lens module is disposed in the cavity of the holder.
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公开(公告)号:US20240077306A1
公开(公告)日:2024-03-07
申请号:US17901469
申请日:2022-09-01
Applicant: Himax Technologies Limited
Inventor: Yin-Tung Lu , Han-Yi Kuo , Shi-Jen Wu
CPC classification number: G01B11/2513 , H01S5/042 , H01S5/423
Abstract: An image projector includes a light source capable of switchable emitting different patterns of light; and a beam shaper that shapes a light beam emitted by the light source, thereby generating a shaped pattern of light to be projected onto an object in a scene.
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公开(公告)号:US10714891B2
公开(公告)日:2020-07-14
申请号:US16028436
申请日:2018-07-06
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Han-Yi Kuo , Yun-Lien Hsiao , Shi-Jen Wu , Yin-Dong Lu
Abstract: The present invention provides a projector including a substrate, a laser module and a lens module. The laser module is positioned on the substrate, and a laser diode of the laser module is not packaged within a can. The lens module is arranged for receiving a laser beam from the laser diode of the laser module to generate a projected image of the projector.
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公开(公告)号:US10270219B1
公开(公告)日:2019-04-23
申请号:US15894896
申请日:2018-02-12
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Kuan-Ming Chen , Shi-Jen Wu , Yin-Dong Lu
Abstract: A packaging structure of a laser diode is provided. The packaging structure of the laser diode includes a laser chip, a first substrate and a second substrate. The first substrate having a first electrode and a second electrode on a first surface of the first substrate, and the laser chip is disposed on the first surface of the first substrate; and a second substrate having a third electrode and a fourth electrode on a second surface of the second substrate, wherein the first electrode and the second electrode are electrically connected to the third electrode and the fourth electrode by a wireless-bonding process, respectively.
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