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公开(公告)号:US20190215499A1
公开(公告)日:2019-07-11
申请号:US15866436
申请日:2018-01-09
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Han-Yi Kuo , Yin-Dong Lu , Shi-Jen Wu , Chih-Sheng Chang , Teng-Te Huang
CPC classification number: H04N9/3147 , G01J1/0477 , G02B5/04 , G02B27/1073 , G03B21/28 , H04N5/7458 , H04N9/3161
Abstract: The present invention provides a method for fabricating small right angle prism mirrors, projecting system, and small right angle prism mirrors fabricated by a semiconductor process. The method comprises: coating a reflecting layer on a top surface of a glass substrate; forming an optical glue layer on a bottom surface of the glass substrate; utilizing a mold to form a 3D shape on the optical glue layer; exposing the optical glue layer having the 3D shape to solidify the optical glue layer having the 3D shape and combine the glass substrate having the reflecting layer and the optical glue layer having the 3D shape; removing the mold to form a small prism array; and dicing the small prism array to generate a plurality of small right angle prism mirrors.
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公开(公告)号:US11137581B2
公开(公告)日:2021-10-05
申请号:US16145105
申请日:2018-09-27
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Chih-Sheng Chang , Teng-Te Huang , Shu-Hao Hsu , Jun-Yu Zhan , Jen-Hui Lai
IPC: G02B13/00 , H01L27/146 , C03B23/22
Abstract: A wafer-level homogeneous bonding optical structure includes two optical lens sets disposed on an optically transparent wafer and a spacer disposed on the optically transparent wafer and between the two optical lens sets. The spacer is homogeneously bonded to and integrated with the optically transparent wafer in the absence of a heterogeneous adhesive.
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公开(公告)号:US20250102739A1
公开(公告)日:2025-03-27
申请号:US18371249
申请日:2023-09-21
Applicant: Himax Technologies Limited
Inventor: Shi-Jen Wu , Yin-Tung Lu , Shu-Hao Hsu , Teng-Te Huang
Abstract: An optical fiber array includes a groove plate having a plurality of grooves disposed on a top surface thereof; and an optical component plate having a plurality of first optical components disposed on a first surface of the optical component plate and a plurality of second optical components disposed on a second surface of the optical component plate, the second surface being opposite the first surface.
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公开(公告)号:US11644683B2
公开(公告)日:2023-05-09
申请号:US16903397
申请日:2020-06-17
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Chih-Sheng Chang , Meng-Ko Tsai , Teng-Te Huang , Yin-Dong Lu
CPC classification number: G02B27/425 , G02B5/18 , G02B5/1814 , G02B27/4277 , G06V40/16
Abstract: The optical component includes a first substrate, a first diffractive layer formed on the first substrate, a second substrate, a second diffractive layer formed on the second substrate, and a bonding material disposed between the first substrate and the second substrate and connecting the first substrate and the second substrate. The second diffractive layer is disposed opposite to the first diffractive layer, and both the first diffractive layer and the second diffractive layer are located between the first substrate and the second substrate. A gap is formed between the first diffractive layer and the second diffractive layer.
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公开(公告)号:US20190011608A1
公开(公告)日:2019-01-10
申请号:US15642340
申请日:2017-07-06
Applicant: HIMAX TECHNOLOGIES LIMITED
Inventor: Teng-Te Huang , Jen-Hui Lai , Shu-Hao Hsu
Abstract: The present invention provides a method for fabricating a high sag lens array a high sag lens array fabricated by a semiconductor process. The method comprises: individually jetting an optical glue material into a plurality of lens mold cavities of a mold to form a plurality of lens parts independently; exposing the lens parts to harden the optical glue material in the lens mold cavities; jetting an optical glue layer on the lens parts; forming a transparent substrate on the optical glue layer; exposing the optical glue layer to harden the optical glue layer and combine the transparent substrate, the optical glue layer, and the lens parts; and removing the mold to form the high sag lens array.
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