Power Conversion Device
    1.
    发明公开

    公开(公告)号:US20240275297A1

    公开(公告)日:2024-08-15

    申请号:US18564819

    申请日:2022-03-02

    CPC classification number: H02M7/003 H02M1/44

    Abstract: A power conversion device includes: an inverter circuit; an AC conductor; a magnetic sensor that t detects magnetism generated when an AC current flows; a first magnetic body and a second magnetic body that face each other with the AC conductor and the magnetic sensor interposed therebetween; and a first housing and a second housing that are formed by conductive members. The first housing covers one opening of a space located between the first magnetic body and the second magnetic body, the second housing covers the other opening of the space. The end of each of the first magnetic body and the second magnetic body is formed so that the distance to the first housing or the second housing is smaller than the thickness of each of the first magnetic body and the second magnetic body in the arraying direction thereof.

    SEMICONDUCTOR DEVICE
    2.
    发明申请

    公开(公告)号:US20250112562A1

    公开(公告)日:2025-04-03

    申请号:US18729865

    申请日:2022-12-27

    Abstract: A power conversion device is provided with: a semiconductor device, two heat spreaders, and an external terminal; a circuit board having a first insulating layer; and a cooler. The circuit board has: a recessed section for the semiconductor device; a first conductor layer that forms a bottom surface of the recessed section; and a second conductor layer that is disposed in a layer different from the first conductor layer and which is exposed in the recessed section. One of the heat spreaders is in contact with the bottom surface of the recessed section and is bonded to the first conductor layer with a first metal bonding material. The external terminal is bonded to the second conductor layer with a second metal bonding material. The cooler is in press contact with the other of the heat spreaders with a second insulating layer different from the first insulating layer interposed therebetween.

    POWER CONVERSION DEVICE
    4.
    发明申请

    公开(公告)号:US20240413746A1

    公开(公告)日:2024-12-12

    申请号:US18702542

    申请日:2022-10-05

    Abstract: A power conversion device includes a substrate on which DC wiring and AC wiring are formed, and a plurality of circuit bodies that are electrically connected in parallel and have a first terminal and a second terminal each connected to the DC wiring or the AC wiring. The first terminals and the second terminals are adjacent to each other in the circuit bodies and protrude in a same direction, and the plurality of circuit bodies are disposed such that the first terminals and the second terminals are alternately arranged side by side on the substrate.

    Semiconductor Device, Power Module, Inverter Device, and Electric Vehicle

    公开(公告)号:US20230148137A1

    公开(公告)日:2023-05-11

    申请号:US17911962

    申请日:2021-01-15

    CPC classification number: H01L27/0255 H01L29/866

    Abstract: There has been a problem that when a value of a current flowing through a thermistor increases, a voltage drop generated in the thermistor increases, and variations occur in a clamp voltage. A semiconductor device includes: a switching element that is on-off controlled; and a surge voltage protection circuit connected between a positive electrode side terminal of the switching element and a control terminal of the switching element. The surge voltage protection circuit includes a first Zener diode, a second Zener diode connected in series with the first Zener diode, and a temperature characteristic compensating element having a temperature coefficient different in polarity from the first Zener diode and the second Zener diode and connected in parallel with the second Zener diode.

    POWER CONVERSION DEVICE
    9.
    发明申请

    公开(公告)号:US20250157937A1

    公开(公告)日:2025-05-15

    申请号:US18840588

    申请日:2023-03-16

    Abstract: This power conversion device comprises a plurality of circuit bodies, a wiring board, and a smoothing capacitor, wherein: the wiring board has a plurality of stacked wiring parts to which the plurality of circuit bodies and the plurality of smoothing capacitors are respectively connected; and inter-phase wiring parts respectively formed between the plurality of stacked wiring parts; in the stacked wiring parts, positive electrode wires and negative electrode wires are stacked to overlap each other; in the inter-phase wiring parts, a plurality of the positive electrode wires and a plurality of the negative electrode wires are stacked to be separated from each other on a plane of the wiring board; and the inter-phase wiring parts have a via passing therethrough in the thickness direction of the wiring board.

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