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公开(公告)号：US20240275297A1
公开(公告)日：2024-08-15
申请号：US18564819
申请日：2022-03-02
Applicant: Hitachi Astemo, Ltd.
Inventor： Takahiro ARAKI , Takeshi TOKUYAMA , Akihiro NAMBA , Shigehisa AOYAGI , Noriyuki MAEKAWA
Abstract: A power conversion device includes: an inverter circuit; an AC conductor; a magnetic sensor that t detects magnetism generated when an AC current flows; a first magnetic body and a second magnetic body that face each other with the AC conductor and the magnetic sensor interposed therebetween; and a first housing and a second housing that are formed by conductive members. The first housing covers one opening of a space located between the first magnetic body and the second magnetic body, the second housing covers the other opening of the space. The end of each of the first magnetic body and the second magnetic body is formed so that the distance to the first housing or the second housing is smaller than the thickness of each of the first magnetic body and the second magnetic body in the arraying direction thereof.
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公开(公告)号：US20250112562A1
公开(公告)日：2025-04-03
申请号：US18729865
申请日：2022-12-27
Applicant: HITACHI ASTEMO, LTD.
Inventor： Junpei KUSUKAWA , Takeshi TOKUYAMA , Takahiro ARAKI , Ti CHEN
Abstract: A power conversion device is provided with: a semiconductor device, two heat spreaders, and an external terminal; a circuit board having a first insulating layer; and a cooler. The circuit board has: a recessed section for the semiconductor device; a first conductor layer that forms a bottom surface of the recessed section; and a second conductor layer that is disposed in a layer different from the first conductor layer and which is exposed in the recessed section. One of the heat spreaders is in contact with the bottom surface of the recessed section and is bonded to the first conductor layer with a first metal bonding material. The external terminal is bonded to the second conductor layer with a second metal bonding material. The cooler is in press contact with the other of the heat spreaders with a second insulating layer different from the first insulating layer interposed therebetween.
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公开(公告)号：US20240251532A1
公开(公告)日：2024-07-25
申请号：US18564139
申请日：2022-02-25
Applicant: HITACHI ASTEMO, LTD.
Inventor： Takeshi TOKUYAMA , Takahiro ARAKI , Shigehisa AOYAGI , Noriyuki MAEKAWA
CPC classification number: H05K7/20927 , H02M7/003 , H05K1/181 , H05K2201/0323
Abstract: A power conversion device includes a plurality of circuit bodies each including a semiconductor element, and a printed circuit board having the plurality of circuit bodies mounted thereon and having a relay wiring connecting the plurality of circuit bodies to each other, a DC wiring, and an AC wiring, wherein at least one of the AC wiring and the DC wiring is connected to a conductor member.
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公开(公告)号：US20240235410A9
公开(公告)日：2024-07-11
申请号：US18271497
申请日：2021-09-30
Applicant: Hitachi Astemo, Ltd.
Inventor： Akira MIMA , Takeshi TOKUYAMA , Junpei KUSUKAWA , Takashi HIRAO
CPC classification number: H02M7/003 , H02M7/48 , H05K7/2039
Abstract: Provided are a positive electrode terminal and a negative electrode terminal being terminals of a capacitor element; a positive electrode conductor plate connected to the positive electrode terminal; a negative electrode conductor plate connected to the negative electrode terminal; and a power conversion module connected to the two conductor plates. The positive electrode terminal and the negative electrode terminal are formed along an arrangement direction of the capacitor element. The positive electrode conductor plate and the negative electrode conductor plate form a laminated conductor portion in which the positive electrode conductor plate and the negative electrode conductor plate have respective main surfaces disposed, to face the main surface of the capacitor element, and are laminated to each other. The laminated conductor portion has a first laminated region laminated to face a main surface of the negative electrode terminal and a second laminated region laminated to face a main surface of the positive electrode terminal.
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公开(公告)号：US20230155456A1
公开(公告)日：2023-05-18
申请号：US17922850
申请日：2021-01-29
Applicant: Hitachi Astemo, Ltd.
Inventor： Takeshi TOKUYAMA , Takaki ITAYA , Masahiro HORI , Takashi HIRAO
Abstract: An object of the present invention is to provide an inverter integrated motor that achieves both improvement in cooling performance of a current sensor and downsizing of an entire device. An inverter integrated motor includes: a power module that converts a direct current into an alternating current; a flow path forming body that is formed so as to flow and cover a refrigerant in the power module; an inverter that installs the power module and the flow path forming body inside; a current sensor that detects the alternating current; and a motor that houses a stator and a rotor, wherein the power module is disposed at a position facing a rotation shaft of the motor via the stator and the rotor, and the current sensor 13 is disposed between the flow path forming body and a coil end of the stator when viewed from a direction perpendicular to the rotation shaft, and at least a part of the current sensor is housed in a motor housing.
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Patent Agency Ranking
公开(公告)号：US20250096079A1
公开(公告)日：2025-03-20
申请号：US18729353
申请日：2022-12-27
Applicant: Hitachi Astemo, Ltd.
Inventor： Masahiro SEO , Takeshi TOKUYAMA , Takashi ISHII
IPC: H01L23/495 , H01L25/07 , H02M7/00
Abstract: In this semiconductor device and the inverter provided with the semiconductor device, an upper arm semiconductor element on a positive electrode wiring plate and an AC wiring plate are connected to each other by a first wiring member, and a lower arm semiconductor element on the AC wiring plate and a negative electrode wiring plate are connected to each other by a second wiring member. The AC wiring plate has: a first region to which the first wiring member is to be connected; a second region in which the lower arm semiconductor element is to be provided; and a connection region that connects these two regions. The connection region is positioned opposite positive-electrode/negative-electrode terminals with a region in between where the first and second wiring members are used, and the placement order is as follows: the positive electrode wiring plate, the negative electrode wiring plate, the first region, and the second region.
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公开(公告)号：US20240413746A1
公开(公告)日：2024-12-12
申请号：US18702542
申请日：2022-10-05
Applicant: HITACHI ASTEMO, LTD.
Inventor： Takeshi TOKUYAMA , Masahiro SEO , Takahiro ARAKI , Shigehisa AOYAGI
Abstract: A power conversion device includes a substrate on which DC wiring and AC wiring are formed, and a plurality of circuit bodies that are electrically connected in parallel and have a first terminal and a second terminal each connected to the DC wiring or the AC wiring. The first terminals and the second terminals are adjacent to each other in the circuit bodies and protrude in a same direction, and the plurality of circuit bodies are disposed such that the first terminals and the second terminals are alternately arranged side by side on the substrate.
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公开(公告)号：US20240244807A1
公开(公告)日：2024-07-18
申请号：US18563667
申请日：2022-03-02
Applicant: HITACHI ASTEMO, LTD.
Inventor： Takahiro ARAKI , Takeshi TOKUYAMA , Masahiro SEO , Noriyuki MAEKAWA , Shigehisa AOYAGI
CPC classification number: H05K7/20927 , H02M7/003 , H05K7/14322
Abstract: An electric power converter includes: an inverter circuit including a plurality of switching elements; a first capacitor and a second capacitor connected in parallel with the inverter circuit; a control circuit unit that controls the inverter circuit; and a connection conductor portion that connects the first capacitor and the second capacitor, wherein a conductive member is disposed between the control circuit unit and the connection conductor portion.
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公开(公告)号：US20230395457A1
公开(公告)日：2023-12-07
申请号：US18034305
申请日：2021-09-17
Applicant: Hitachi Astemo, Ltd.
Inventor： Takahiro ARAKI , Takeshi TOKUYAMA , Shigehisa AOYAGI , Noriyuki MAEKAWA
IPC: H01L23/367 , H02M7/00 , H01L23/498 , H01L23/00 , H01L23/522 , H05K1/02
CPC classification number: H01L23/3672 , H02M7/003 , H01L23/49822 , H01L24/40 , H01L23/5223 , H05K1/0231 , H01L2224/40137 , H01L2224/40265 , H01L2924/19041 , H01L2924/13055
Abstract: A power semiconductor device includes: a substrate in which a positive electrode wiring connected to a first conductor on a high potential side and a negative electrode wiring connected to a fourth conductor on a low potential side are provided on one surface, and an output wiring connected to a second conductor and a third conductor is provided on the other surface so as to face the positive electrode wiring and the negative electrode wiring; and a first capacitor that smooths DC power supplied to a first upper-arm circuit body and a first lower-arm circuit body. The substrate is disposed between the first upper-arm circuit body and the first lower-arm circuit body. The first capacitor is disposed between the first upper-arm circuit body and the first lower-arm circuit body, and is connected to the positive electrode wiring and the negative electrode wiring on the substrate.
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公开(公告)号：US20240136936A1
公开(公告)日：2024-04-25
申请号：US18271497
申请日：2021-09-29
Applicant: Hitachi Astemo, Ltd.
Inventor： Akira MIMA , Takeshi TOKUYAMA , Junpei KUSUKAWA , Takashi HIRAO
CPC classification number: H02M7/003 , H02M7/48 , H05K7/2039
Abstract: Provided are a positive electrode terminal and a negative electrode terminal being terminals of a capacitor element; a positive electrode conductor plate connected to the positive electrode terminal; a negative electrode conductor plate connected to the negative electrode terminal; and a power conversion module connected to the two conductor plates. The positive electrode terminal and the negative electrode terminal are formed along an arrangement direction of the capacitor element. The positive electrode conductor plate and the negative electrode conductor plate form a laminated conductor portion in which the positive electrode conductor plate and the negative electrode conductor plate have respective main surfaces disposed, to face the main surface of the capacitor element, and are laminated to each other. The laminated conductor portion has a first laminated region laminated to face a main surface of the negative electrode terminal and a second laminated region laminated to face a main surface of the positive electrode terminal.
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