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公开(公告)号:US11238895B2
公开(公告)日:2022-02-01
申请号:US17111068
申请日:2020-12-03
Applicant: HOYA CORPORATION
Inventor: Masao Takano
IPC: G11B17/028 , G11B17/038 , G11B25/04
Abstract: A ring-shaped spacer is to be arranged in contact with a magnetic disk in a hard disk drive apparatus. A maximum height surface roughness Rz of an outer circumferential edge surface of the spacer is at least 1.5 μm, and the spacer is made of amorphous glass.
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公开(公告)号:US10783921B2
公开(公告)日:2020-09-22
申请号:US16634128
申请日:2018-10-01
Applicant: HOYA CORPORATION
Inventor: Masao Takano , Shinji Eda
IPC: G11B17/02 , G11B17/038
Abstract: In order to suppress the occurrence of adhesion between magnetic disks and spacers when the magnetic disks and the spacers are removed from a hard disk drive apparatus in which the magnetic disks and the spacers are installed, a surface roughness Ra of a main surface of a ring-shaped glass spacer to be arranged in contact with a magnetic disk is set to be not larger than 1.0 μm, and an average inclination RΔa of the main surface is set to be at least 0.02.
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公开(公告)号:US11705158B2
公开(公告)日:2023-07-18
申请号:US17589824
申请日:2022-01-31
Applicant: HOYA CORPORATION
Inventor: Masao Takano , Shinji Eda
IPC: G11B17/02 , G11B17/038
CPC classification number: G11B17/021 , G11B17/038
Abstract: A method for manufacturing the ring-shaped glass spacer to be arranged in contact with a magnetic disk in a hard disk drive apparatus, including: preparing a ring-shaped glass blank; and grinding main surfaces of the ring-shaped glass blank by using grinding pads that include diamond particles as fixed abrasive particles.
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公开(公告)号:US11471993B2
公开(公告)日:2022-10-18
申请号:US16644127
申请日:2019-03-11
Applicant: HOYA CORPORATION
Inventor: Masao Takano
IPC: B32B27/32 , B24B9/10 , B32B7/022 , G11B5/73 , B32B27/36 , B32B27/40 , B32B37/10 , B32B37/14 , B32B37/18 , B32B38/00 , C03C19/00 , G11B5/84
Abstract: The area of a spacer that is to be provided between the adjacent substrates in a laminate including a plurality of substrates to keep the adjacent substrates apart from each other is smaller than those of the stacked substrates. When pressure is released to bring the laminate obtained by providing the spacers between the substrates from a pressed state in which 0.60 MPa of pressure is applied to the laminate in the stacking direction into a non-pressed state, an amount of change ΔW in thickness per spacer that is calculated from a change in the thickness of the laminate due to the release of pressure is 30 μm or less.
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公开(公告)号:US12051442B2
公开(公告)日:2024-07-30
申请号:US18029251
申请日:2021-09-30
Applicant: HOYA CORPORATION
Inventor: Masao Takano
IPC: G11B17/038 , G11B25/04
CPC classification number: G11B17/038 , G11B25/043
Abstract: Provided is an annular spacer to be disposed such that a main surface of the spacer is in contact with a magnetic disk in a hard disk drive device, the spacer including two main surfaces; an inner circumferential surface; and an outer circumferential surface, in which a chamfered surface is present between the outer circumferential surface and each of the two main surfaces, and at least a portion of an outer circumferential region of at least one of the two main surfaces includes an inclined region that is inclined toward the other main surface side in a radial direction from a center of the spacer to the outer circumferential surface side.
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公开(公告)号:US12145238B2
公开(公告)日:2024-11-19
申请号:US18510901
申请日:2023-11-16
Applicant: HOYA CORPORATION
Inventor: Masao Takano
IPC: B32B7/022 , B24B9/10 , B32B27/32 , B32B27/36 , B32B27/40 , B32B37/10 , B32B37/14 , B32B37/18 , B32B38/00 , C03C19/00 , G11B5/73 , G11B5/84
Abstract: A method for manufacturing a substrate includes processing a side face of a laminate that includes substrates and a sheet-shaped spacer disposed between adjacent substrates. The processing of the side face includes bringing the laminate into a pressed state, first side face processing for processing a side face of the laminate in the pressed state, releasing the laminate from the pressed state after the first side face processing, intermediate processing for performing one of dividing the laminate released from the pressed state into two or more laminates, combining the laminate released from the pressed state with another laminate in a stacking direction, and leaving the laminate released from the pressed state as it is, bringing the laminate that has undergone the intermediate processing into a pressed state after the intermediate processing, and processing a side face of the laminate in the pressed state after the intermediate processing.
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公开(公告)号:US11839950B2
公开(公告)日:2023-12-12
申请号:US17947993
申请日:2022-09-19
Applicant: HOYA CORPORATION
Inventor: Masao Takano
IPC: B32B37/10 , B24B9/10 , B32B7/022 , G11B5/73 , B32B27/32 , B32B27/36 , B32B27/40 , B32B37/14 , B32B37/18 , B32B38/00 , C03C19/00 , G11B5/84
CPC classification number: B24B9/10 , B32B7/022 , B32B27/32 , B32B27/36 , B32B27/40 , B32B37/10 , B32B37/144 , B32B37/18 , B32B38/105 , C03C19/00 , G11B5/73921 , G11B5/8404 , B32B2250/42 , B32B2307/7265 , B32B2307/734 , B32B2315/08 , B32B2323/10 , B32B2367/00 , B32B2375/00 , B32B2429/02
Abstract: A sheet-like spacer to be used when a laminate of a plurality of substrates is formed for the purpose of processing end faces of the substrates is provided between the adjacent substrates in the laminate to keep the adjacent substrates apart from each other. An area of the spacer is smaller than that of the substrates. A contact angle of a surface of the spacer with respect to pure water is 50° or less.
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公开(公告)号:US11244706B2
公开(公告)日:2022-02-08
申请号:US17006733
申请日:2020-08-28
Applicant: HOYA CORPORATION
Inventor: Masao Takano , Shinji Eda
IPC: G11B17/02 , G11B17/038
Abstract: In order to suppress the occurrence of adhesion between magnetic disks and spacers when the magnetic disks and the spacers are removed from a hard disk drive apparatus in which the magnetic disks and the spacers are installed, a surface roughness Ra of a main surface of a ring-shaped glass spacer to be arranged in contact with a magnetic disk is set to be not larger than 1.0 μm, and an average inclination RΔa of the main surface is set to be at least 0.02.
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