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    Portable electronic device with dual displays and a hinge structure
    1.
    发明授权
    Portable electronic device with dual displays and a hinge structure 有权

    公开(公告)号：US10296048B1

    公开(公告)日：2019-05-21

    申请号：US15920566

    申请日：2018-03-14

    Applicant: HTC CORPORATION

    Inventor： Chi-Jer Wang ,  Yi Cheng Lin ,  I-Cheng Chuang ,  Chi-Hung Lin ,  Kuan-Ku Kuo

    IPC: G06F1/16

    Abstract: A portable electronic device, including a first unit, a second unit and a hinge structure, is disclosed. The first unit includes a first display portion, a first back portion and a first receiving groove disposed on the first back portion. The second unit includes a second display portion and a second back portion selectively stacked with the first back portion. The hinge structure is disposed in the first receiving groove of the first unit and includes a fixing element disposed in the first receiving groove, a sliding element slidably disposed on the fixing element and a rotary element disposed on an outer side of the sliding element, wherein the second unit is pivoted to the rotary element via the second back portion. In this way, the hinge structure will not protrude outside the first and second units when the portable electronic device is in the folded status.

    Camera module for portable device
    3.
    发明授权
    Camera module for portable device 有权
    相机模块用于便携式设备

    公开(公告)号：US09210311B2

    公开(公告)日：2015-12-08

    申请号：US13710123

    申请日：2012-12-10

    Applicant: HTC CORPORATION

    Inventor： Hsin-Chih Liu ,  Yu-Jing Liao ,  Ying-Yen Cheng ,  Yin-Chou Chen ,  I-Cheng Chuang ,  Chia-Huan Chang

    IPC: H04N5/225 ,  H04N21/4223

    CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H04N5/2253 ,  H04N21/4223

    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.

    Abstract translation: 提供相机模块。 相机模块包括相机装置和支撑环。 相机装置包括基板，基板上的图像传感器装置和用于覆盖图像传感器装置的保持器，其中保持器包括放置在图像传感器装置周围的侧部。 支撑环固定到支架的侧部并从其侧面延伸，并且附接到底架的壁部。 还公开了具有相机模块的便携式设备。

    Display unit, electronic device and assembling method for electronic device
    7.
    发明授权
    Display unit, electronic device and assembling method for electronic device 有权
    电子设备的显示单元，电子设备和组装方法

    公开(公告)号：US09565779B2

    公开(公告)日：2017-02-07

    申请号：US14848299

    申请日：2015-09-08

    Applicant: HTC Corporation

    Inventor： Chih-Kai Hu ,  Hsien-Wei Juan ,  I-Cheng Chuang ,  Yi-Ting Liu ,  Shih-Po Chien ,  Yin-Chou Chen

    IPC: G11B33/02 ,  H05K7/00 ,  H05K5/00 ,  G02F1/1333 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00

    CPC classification number: H05K5/0017 ,  G02F1/133308 ,  G02F2001/133311 ,  G02F2001/13332 ,  G02F2001/133331 ,  G02F2202/28 ,  H05K5/0217 ,  H05K5/03 ,  H05K13/00

    Abstract: A display unit, an electronic device and an assembling method are provided. The electronic device includes a case and a display unit. The case includes a holding compartment. The display unit is accommodated in the holding compartment, and includes a display module, a transparent cover layer and a transparent adhesive tape. The transparent adhesive tape is configured between the display module and the transparent adhesive tape, and the transparent adhesive tape is adhered to the transparent cover layer. The transparent adhesive tape includes a flange portion extending beyond the display module, and the flange portion can be bent to secure the display unit to the case. The second surface is leaned against a back plate. The back plate comprises at least one hole. The flange portion passes through the hole and is bent to attach to a surface of the display module that is farther away from the back plate.

    Abstract translation: 提供显示单元，电子设备和组装方法。 电子装置包括壳体和显示单元。 该情况包括一个保持室。 显示单元容纳在保持室中，并且包括显示模块，透明覆盖层和透明胶带。 透明胶带被构造在显示模块和透明胶带之间，并且透明胶带粘附到透明覆盖层。 透明胶带包括延伸超过显示模块的凸缘部分，并且凸缘部分可以弯曲以将显示单元固定到壳体上。 第二个表面靠在背板上。 后板包括至少一个孔。 凸缘部分穿过孔并被弯曲以附着到远离背板的显示模块的表面。

    Electronic assembly and electronic apparatus
    8.
    发明授权
    Electronic assembly and electronic apparatus 有权
    电子组装和电子设备

    公开(公告)号：US09411364B2

    公开(公告)日：2016-08-09

    申请号：US14064221

    申请日：2013-10-28

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Cheng-Te Chen

    IPC: H05K7/02 ,  G06F1/16 ,  H04M1/02

    CPC classification number: G06F1/16 ,  G06F1/1626 ,  G06F1/1635 ,  G06F1/1637 ,  G06F1/1658 ,  H04M1/0262 ,  H04M1/0266 ,  H05K7/023

    Abstract: An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board.

    Abstract translation: 电子设备包括后壳体，前盖和包括显示模块，主机模块，电池模块和扩展模块的电子组件。 后壳体具有前开口。 前盖位于前开口; 前盖和后壳一起构成容纳空间。 显示模块安装在住宿空间内并堆叠在前盖上。 主机模块安装在住宿空间内并堆叠在显示模块上。 电池模块安装在容纳空间内，堆叠在显示模块上，与主机模块并排布置。 扩展模块安装在容纳空间内并堆放在电池模块上。 扩展模块包括堆叠在电池模块上的扩展电路板和安装在扩展电路板上的多个卡连接器。

    Camera assembly and electronic device
    9.
    发明授权
    Camera assembly and electronic device 有权
    相机组合和电子设备

    公开(公告)号：US09313389B2

    公开(公告)日：2016-04-12

    申请号：US14074722

    申请日：2013-11-08

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Hung-Wen Lin

    IPC: H04N5/225

    CPC classification number: H04N5/2257 ,  H04N5/2252 ,  H04N5/2258

    Abstract: A camera assembly, including at least one holder, at least one camera module, and a buffer material, is provided. The holder includes at least one accommodating recess. The camera module is disposed in the accommodating recess, and a gap exists between the camera module and a sidewall of the accommodating recess. The buffer material is filled in the gap to position the camera module in the accommodating recess of the holder. Further, an electronic device including a housing and the camera assembly aforementioned is provided.

    Abstract translation: 提供了包括至少一个保持器，至少一个相机模块和缓冲材料的相机组件。 保持器包括至少一个容纳凹部。 相机模块设置在容纳凹部中，并且在相机模块和容纳凹部的侧壁之间存在间隙。 缓冲材料填充在间隙中，以将相机模块定位在保持器的容纳凹部中。 此外，提供了包括壳体和上述相机组件的电子设备。

    FRAME AND ELECTRONIC DEVICE HAVING THE SAME
    10.
    发明申请
    FRAME AND ELECTRONIC DEVICE HAVING THE SAME 有权
    具有相同功能的框架和电子设备

    公开(公告)号：US20160018862A1

    公开(公告)日：2016-01-21

    申请号：US14333517

    申请日：2014-07-17

    Applicant: HTC Corporation

    Inventor： I-Cheng Chuang ,  Yu-Jing Liao ,  Hsin-Chih Liu ,  Hung-Wen Lin

    IPC: G06F1/20

    CPC classification number: G06F1/203 ,  G06F1/1626

    Abstract: A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient. The first material portion is connected to the second material portion, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. A stiffness of the second material portion is greater than a stiffness of the first material portion. A heat generating element of the electronic device dissipates heat by the first material portion, and the heat generating element is disposed to be corresponding to the first material portion. An electronic device having said frame is also provided.

    Abstract translation: 提供要组装到电子设备的壳体的框架。 框架包括第一材料部分和第二材料部分。 第一材料部分具有第一导热系数，第二材料部分具有第二导热系数。 第一材料部分连接到第二材料部分，并且第一导热系数大于第二导热系数。 第二材料部分的刚度大于第一材料部分的刚度。 电子设备的发热元件通过第一材料部分散发热量，发热元件设置成对应于第一材料部分。 还提供了具有所述框架的电子设备。

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