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公开(公告)号：US20180167709A1
公开(公告)日：2018-06-14
申请号：US15654396
申请日：2017-07-19
Applicant: Hyundai Motor Company , Kia Motors Corporation
Inventor： Ilseon Yoo
CPC classification number: H04R1/083 , H04R1/08 , H04R1/20 , H04R1/222 , H04R1/28 , H04R1/342 , H04R1/38 , H04R3/04 , H04R7/06 , H04R19/04 , H04R2201/003 , H04R2410/01 , H04R2499/13
Abstract: A microphone having a plural porous sound delay filter is provided. The microphone includes a housing that has a first sound passage, a second sound passage and a third sound passage. A sound element is disposed in a position that corresponds to the first sound passage in the housing, and a semiconductor chip is electrically connected with the sound element in the housing. A low frequency lag filter is disposed in the second sound passage and delays low frequency sound source and a high frequency lag filter is disposed in third sound passage and delays high frequency sound source.
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公开(公告)号：US20180077498A1
公开(公告)日：2018-03-15
申请号：US15363701
申请日：2016-11-29
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H04R19/02 , H04R7/06 , H04R7/18 , H04R19/005 , H04R19/04 , H04R29/004 , H04R31/00 , H04R31/003 , H04R2201/003
Abstract: A microphone, a manufacturing method and a control method of the microphone are provided. The microphone includes an insulating layer bonded to a surface of a substrate in which a sound inlet is formed and includes a plurality of sound apertures. A diaphragm is formed at a position that corresponds to the sound inlet of the substrate on an upper surface of the insulating layer. A displacement adjusting layer is disposed in a circumference of the diaphragm on the upper surface of the insulating layer and is configured to adjust hardness of the diaphragm based on an input sound. A fixing layer is disposed on the diaphragm and the displacement adjusting layer while spaced apart from the diaphragm and the displacement adjusting layer.
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公开(公告)号：US09866970B2
公开(公告)日：2018-01-09
申请号：US14853507
申请日：2015-09-14
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo
CPC classification number: H04R19/005 , B81B2201/0257 , B81C1/00182 , H04R7/04 , H04R7/16 , H04R7/26 , H04R31/00 , H04R2231/003
Abstract: A method of manufacturing a microphone includes preparing a substrate and forming an oxide layer pattern on the substrate and an oxide layer on a rear side of the substrate. The vibration membrane is formed over the substrate by injecting conductive ions into the substrate. A sacrificial layer and a fixed electrode are sequentially formed on the substrate and the vibration membrane by removing the oxide layer pattern. A first photoresist layer pattern is formed on the fixed electrode, and an air inlet is formed by patterning the fixed electrode. A second photoresist layer pattern is formed on a rear side of the oxide layer, and a penetration hole, through which a portion of the vibration membrane is exposed, is formed by etching the oxide layer and the rear side of the substrate. An air layer is formed between the fixed electrode and the vibration membrane.
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公开(公告)号：US09749752B2
公开(公告)日：2017-08-29
申请号：US14883527
申请日：2015-10-14
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo
CPC classification number: H04R19/04 , H04R1/342 , H04R19/005 , H04R31/00 , H04R31/003 , H04R2201/003
Abstract: A microphone includes: a first substrate having one or more first penetration holes; a vibrating membrane disposed on the first substrate and covering the first penetration holes; a fixed membrane disposed at a predetermined distance over the vibration membrane and having a plurality of air intake holes; and a phase delay unit bonded by a bonding pad on the fixed membrane, having a plurality of second penetration holes connected to the one or more first penetration holes, and having a phase delay material in the second penetration holes. A method of manufacturing a microphone including a phase delay unit is also disclosed.
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公开(公告)号：US09736575B2
公开(公告)日：2017-08-15
申请号：US14970243
申请日：2015-12-15
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Hyunsoo Kim , Sang Hyeok Yang , Sang Gyu Park , Ilseon Yoo
CPC classification number: H04R1/2884 , H04R1/08 , H04R7/04 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11
Abstract: A method of manufacturing a microphone includes steps of forming a sound element; forming a semiconductor chip; coupling the sound element and the semiconductor chip to each other; inserting the sound element and the semiconductor chip into a case; and forming a sound hole in a lower portion of the case and in a lower portion of the sound element.
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Patent Agency Ranking
公开(公告)号：US09712924B2
公开(公告)日：2017-07-18
申请号：US14791449
申请日：2015-07-05
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim
CPC classification number: H04R19/005 , H04R7/04 , H04R7/26 , H04R31/00 , H04R2231/003 , H04R2410/03
Abstract: A microphone includes a substrate including a penetration hole; a vibration membrane disposed over the substrate and covering the penetration hole; a fixed electrode disposed over the vibration membrane and spaced apart from the vibration membrane; a fixed plate disposed over the fixed electrode; and a plurality of air inlets disposed in the fixed electrode and the fixed plate. The vibration membrane includes a plurality of slots positioned over the penetration hole, and an entire area of the plurality of slots is approximately 8% to approximately 19% of an entire area of the vibration membrane.
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公开(公告)号：US20160157012A1
公开(公告)日：2016-06-02
申请号：US14798716
申请日：2015-07-14
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo
CPC classification number: H04R3/00 , H04R1/20 , H04R31/00 , H04R2201/003
Abstract: A method of manufacturing a microphone, a microphone, and a method of controlling the microphone are provided. The method includes forming a sound sensing module on a mainboard having a first sound aperture, to be connected with the first sound aperature and forming a cover having a second sound aperature that corresponds to the first sound aperature, mounted on the mainboard, and housing the sound sensing module. A first and second sound delay filters are formed in a space defined by the cover, to be connected with the second sound hole and thermal actuators are disposed at both sides of the first sound delay filter and move the first sound delay filter based on whether power is supplied. A semiconductor chip is electrically connected with the sound sensing module in the space and selectively operates the thermal actuators in response to signals from the sound sensing module.
Abstract translation: 提供一种麦克风的制造方法，麦克风和麦克风的控制方法。 该方法包括在具有第一声孔的主板上形成声音传感模块，以与第一声音温度相连，并形成具有安装在主板上的具有对应于第一声音的第二声音的盖子，并且将 声音传感模块。 第一和第二声音延迟滤波器形成在由盖限定的空间中，以与第二声孔连接，并且热致动器设置在第一声音延迟滤波器的两侧，并且基于电源是否移动第一声音延迟滤波器 被提供。 半导体芯片与空间中的声音传感模块电连接，响应于来自声音传感模块的信号选择性地操作热致动器。
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公开(公告)号：US20160112785A1
公开(公告)日：2016-04-21
申请号：US14791449
申请日：2015-07-05
Applicant: Hyundai Motor Company
Inventor： Ilseon Yoo , Hyunsoo Kim
CPC classification number: H04R19/005 , H04R7/04 , H04R7/26 , H04R31/00 , H04R2231/003 , H04R2410/03
Abstract: A microphone includes a substrate including a penetration hole; a vibration membrane disposed over the substrate and covering the penetration hole; a fixed electrode disposed over the vibration membrane and spaced apart from the vibration membrane; a fixed plate disposed over the fixed electrode; and a plurality of air inlets disposed in the fixed electrode and the fixed plate. The vibration membrane includes a plurality of slots positioned over the penetration hole, and an entire area of the plurality of slots is approximately 8% to approximately 19% of an entire area of the vibration membrane.
Abstract translation: 麦克风包括：基底，包括穿透孔; 设置在所述基板上并覆盖所述贯通孔的振动膜; 固定电极，设置在振动膜上方并与振膜隔开; 设置在固定电极上的固定板; 以及设置在固定电极和固定板中的多个空气入口。 振动膜包括位于穿透孔上方的多个槽，并且多个槽的整个区域是振动膜的整个面积的约8％至约19％。
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公开(公告)号：US20150187604A1
公开(公告)日：2015-07-02
申请号：US14319324
申请日：2014-06-30
Applicant: HYUNDAI MOTOR COMPANY
Inventor： Ilseon Yoo , Hiwon Lee , Soon-myung Kwon , Hyunsoo Kim
IPC: H01L21/50 , H01L21/308 , H01L21/306
CPC classification number: H01L21/50 , H01L21/185 , H01L21/30604 , H01L21/308
Abstract: A method of joining semiconductor substrates includes: forming an alignment key on a first semiconductor substrate; forming a first protrusion and a second protrusion, and an alignment recess positioned between the first protrusion and the second protrusion on a second semiconductor substrate; forming a first metal layer and a second metal layer on the first protrusion and the second protrusion, respectively; and joining the first semiconductor substrate and the second semiconductor substrate, in which the alignment key is positioned at the alignment recess when the first semiconductor substrate and the second semiconductor substrate are joined.
Abstract translation: 一种接合半导体衬底的方法包括：在第一半导体衬底上形成对准键; 形成第一突起和第二突起，以及位于第二半导体衬底上的第一突起和第二突起之间的对准凹槽; 在所述第一突起和所述第二突起上分别形成第一金属层和第二金属层; 并且当所述第一半导体衬底和所述第二半导体衬底接合时，所述第一半导体衬底和所述第二半导体衬底接合所述对准键位于所述对准凹槽处。
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公开(公告)号：US10313799B2
公开(公告)日：2019-06-04
申请号：US15824321
申请日：2017-11-28
Applicant: HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
Inventor： Ilseon Yoo
Abstract: A microphone includes: a vibration electrode disposed in an upper portion of a substrate which has an acoustic hole; a fixed electrode separated from the upper portion of the vibration electrode by a reference distance and having an insulation membrane on each of an upper surface and a lower surface of the fixed electrode; and a piezoelectric electrode having a plurality of beams disposed in a radial direction outwards from a center of an upper portion of the fixed electrode and uniformly maintaining a space between the vibration electrode and the fixed electrode by bending the fixed electrode in one direction according to an input voltage.
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