公开(公告)号：US08014162B2

公开(公告)日：2011-09-06

申请号：US11905913

申请日：2007-10-05

Applicant: Hideki Kusamitsu

Inventor： Hideki Kusamitsu

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K3/281 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0393 ,  H05K2201/0116 ,  H05K2201/029 ,  H05K2201/0715

Abstract: A flexible printed circuit board wherein the insulative substrate 34 having a plurality of conductive layers 36b covered with a protective layer 38 is encircled by a mesh-cloth member 32.

Abstract translation: 柔性印刷电路板，其中具有覆盖有保护层38的多个导电层36b的绝缘基板34被网状布构件32包围。

公开(公告)号：US5450046A

公开(公告)日：1995-09-12

申请号：US142099

申请日：1993-10-28

Applicant: Yuhei Kosugi ,  Osamu Yamamoto ,  Hiroaki Izumi ,  Hideki Kusamitsu ,  Shin-ichi Omagari ,  Hideo Watanabe ,  Yoshio Minowa

Inventor： Yuhei Kosugi ,  Osamu Yamamoto ,  Hiroaki Izumi ,  Hideki Kusamitsu ,  Shin-ichi Omagari ,  Hideo Watanabe ,  Yoshio Minowa

IPC: H01L23/552 ,  H01P1/00 ,  H01P5/107 ,  H03H11/02

CPC classification number: H01P1/00 ,  H01L23/552 ,  H01P5/107 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01068 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3025

Abstract: A composite microwave circuit module assembly has a dielectric substrate which is formed by a lower layer, an intermediate layer and an upper layer. The lower layer and the upper layer include a lower ground surface and an upper ground surface, respectively, and the intermediate layer includes a radio frequency signal circuit formed by an active circuit element and a passive circuit element. A number of via-holes filled with metal are arranged along the radio frequency signal circuit to short-circuit the upper ground surface and the lower ground surface so as to shield the radio frequency signal circuit. An element mounting cavity is disposed on the intermediate layer with a portion of dielectric above the intermediate layer being removed, and the active circuit element is mounted on an element mounting land in the cavity. The cavity is covered by a conductor plate member. A connection terminal connected with the radio frequency signal circuit is provided in a surface of the dielectric substrate without projecting from the surface thereof and allows external electrical connection thereat from outside by a microwave circuit connection structure having a contact member resiliently urged toward said connection terminal.

Abstract translation: 复合微波电路模块组件具有由下层，中间层和上层形成的电介质基板。 下层和上层分别包括下地面和上地面，中间层包括由有源电路元件和无源电路元件形成的射频信号电路。 沿着射频信号电路布置了多个充满金属的通孔，以使上地表和下地面短路，从而屏蔽射频信号电路。 元件安装腔设置在中间层上，中间层上方的电介质部分被去除，有源电路元件安装在空腔中的元件安装台面上。 空腔被导体板构件覆盖。 与该射频信号电路连接的连接端子设置在电介质基板的表面，而不会从其表面突出，并且通过具有向所述连接端子弹性推压的接触构件的微波电路连接结构从外部进行外部电连接。

公开(公告)号：US4745381A

公开(公告)日：1988-05-17

申请号：US918547

申请日：1986-10-10

Applicant: Yuhei Kosugi ,  Hirohisa Ozawa ,  Hideki Kusamitsu ,  Yoshio Minowa

Inventor： Yuhei Kosugi ,  Hirohisa Ozawa ,  Hideki Kusamitsu ,  Yoshio Minowa

IPC: H01R4/48 ,  H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01P5/00

CPC classification number: H05K1/0243 ,  H01R4/4809 ,  H05K1/0237 ,  H05K1/18 ,  H05K2201/10189 ,  H05K2201/1053 ,  H05K3/325 ,  H05K3/3447

Abstract: In a microwave connector assembly for electrical connection of adjacent ones of microwave circuit components, an internal conductor is accommodated in a cavity formed by an external conductor member and is supported by an insulator support member within the cavity. The internal conductor is operable as a leaf spring and elastically brought into contact with a pair of contacts fixed to radio frequency terminals of the adjacent microwave circuit components. The external conductor member may be formed either by a base plate for mounting the circuit components or by a conductive case which is covered with a conductive cap and which is located in an opening of the base plate. A print board may mechanically be attached to the base plate so as to supply a bias voltage to each circuit component through bias terminals thereof.

Abstract translation: 在微波连接器组件中，用于连接相邻微波电路部件的电连接，内部导体容纳在由外部导体部件形成的空腔中，并由腔内的绝缘体支撑部件支撑。 内部导体可操作为板簧，弹性地与固定在相邻微波电路部件的射频端子上的一对触点接触。 外部导体构件可以由用于安装电路部件的基板或由导电盖覆盖并且位于基板的开口中的导电壳形成。 打印板可以机械地附接到基板，以便通过其偏置端子向每个电路部件提供偏置电压。

公开(公告)号：US20080083559A1

公开(公告)日：2008-04-10

申请号：US11905913

申请日：2007-10-05

Applicant: Hideki Kusamitsu

Inventor： Hideki Kusamitsu

IPC: H05K1/00

CPC classification number: H05K3/281 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0393 ,  H05K2201/0116 ,  H05K2201/029 ,  H05K2201/0715

Abstract: A flexible printed circuit board wherein the insulative substrate 34 having a plurality of conductive layers 36b covered with a protective layer 38 is encircled by a mesh-cloth member 32.

Abstract translation: 柔性印刷电路板，其中具有覆盖有保护层38的多个导电层36b的绝缘基板34被网状布构件32包围。

公开(公告)号：US6124636A

公开(公告)日：2000-09-26

申请号：US237349

申请日：1999-01-26

Applicant: Hideki Kusamitsu

Inventor： Hideki Kusamitsu

IPC: H01L23/12 ,  H01L23/66 ,  H01L23/34

CPC classification number: H01L23/66 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/73253 ,  H01L2224/854 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/1423 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/30107 ,  H01L2924/3011

Abstract: Disclosed herein is an MMIC package which comprises a base substrate, a composite capacitor substrate made of a ceramics plate mounted on the base substrate, an MMIC bare chip which functions as a high frequency semiconductor element and face-down bonded on the composite capacitor substrate, and an electroconductive covering which covers, together with the base substrate, the MMIC bare chip. In order to suppress the deterioration of the electrical characteristics of the above MMIC, the above components are so arranged that the interconnection length between the components is made to be minimum.

Abstract translation: 这里公开了一种MMIC封装，其包括基底基板，由安装在基底基板上的陶瓷板制成的复合电容器基板，用作高频半导体元件并面向下接合在复合电容器基板上的MMIC裸芯片， 以及与基底衬底一起覆盖MMIC裸芯片的导电覆盖层。 为了抑制上述MMIC的电特性的劣化，上述部件被布置成使得部件之间的互连长度最小。

公开(公告)号：US20130002039A1

公开(公告)日：2013-01-03

申请号：US13582586

申请日：2010-12-24

Applicant: Hideki Kusamitsu

Inventor： Hideki Kusamitsu

IPC: H01F38/14

CPC classification number: H04B5/02 ,  H04B5/0012 ,  H04B5/0056 ,  H04B5/0075

Abstract: A receiving unit portion and a transmission unit portion are brought close to each other. Then, when upper end surfaces of protrusions (18BD) are brought into contact with a surface of a reception side wiring board (30A) at a given pressure attributed to an elastic force of a flexible wiring board (18B), a gap between an electrode pad (18bi) and an electrode pad (30ai) is limited at a predetermined value by the protrusions (18BD).

Abstract translation: 接收单元部分和传输单元部分彼此靠近。 然后，当由于柔性布线基板（18B）的弹力引起的给定压力使突起（18BD）的上端面与接收侧布线板（30A）的表面接触时，电极 衬垫（18bi）和电极焊盘（30ai）通过突起（18BD）限制在预定值。

公开(公告)号：US06777771B1

公开(公告)日：2004-08-17

申请号：US09958377

申请日：2001-10-09

Applicant: Tsunehisa Marumoto ,  Ryuichi Iwata ,  Youichi Ara ,  Hideki Kusamitsu ,  Kenichiro Suzuki

Inventor： Tsunehisa Marumoto ,  Ryuichi Iwata ,  Youichi Ara ,  Hideki Kusamitsu ,  Kenichiro Suzuki

IPC: H01L2900

CPC classification number: H01Q3/26 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q3/24 ,  H01Q3/36 ,  H01Q21/0087 ,  Y10S257/921 ,  Y10S257/923

Abstract: A method of manufacturing a high-gain, high-frequency device, such as a phased-array antenna, which uses such a switch having movable parts as a micromachine switch. The high-frequency device comprises a dielectric substrate on which are formed a plurality of waveguides for carrying high-frequency signals, a phase control layer, and dielectric spacers arranged between the phase control layer and another layer to provide space in which a switch formed in the phase control layer is enclosed.

Abstract translation: 一种制造高增益高频器件的方法，例如相控阵天线，其使用具有可移动部件的这种开关作为微机械开关。 高频器件包括电介质衬底，其上形成有用于承载高频信号的多个波导，相位控制层和布置在相位控制层与另一层之间的电介质隔离层，以提供空间， 封闭相位控制层。