公开(公告)号：US07825340B2

公开(公告)日：2010-11-02

申请号：US12193492

申请日：2008-08-18

Applicant: Hitoshi Kashio

Inventor： Hitoshi Kashio

IPC: H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/112 ,  H05K3/0017 ,  H05K3/064 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/0554

Abstract: In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.

Abstract translation: 在本发明的一个实施例中，双面布线板的连接装置包括由第一侧导电层和第一侧连接导电层构成的第一侧连接接地部分和第二侧连接接地部分 由第二侧导电层构成; 所述第一侧连接接地部和所述第二侧连接用接地部在各自的中央部彼此面对，并且将绝缘基板夹在其间; 与第一侧连接接地部的周缘部和第二侧连接接地部的周缘部对应地形成基板孔; 并且第一侧连接接地部分的周边端部和第二侧连接接地部分的周边端部经由基板孔相互连接。