Abstract:
An etching agent and an electronic device manufacturing method using the etching agent. The etching agent contains, in a solution, hydrofluoric acid at a concentration of 0.05 to 0.5 mol/l, and halooxoacid ions, represented by the formula (XO.sub.n).sup.p- (wherein X is a halogen element, n is 3, 4 or 6, p is 1, 2 or 3), at a concentration of at least 0.01 mol/l. An electronic device manufactured using the etching agent requires only a single etching step to etch both conductive layers (such as aluminum) as well as ohmic contact layers (a-Si).
Abstract:
A foldable floor heating panel can be folded longitudinally and laterally. The foldable floor heating panel includes several small plate-like members of a rectangular plan configuration, which are arranged longitudinally and laterally so as to be adjacent to each other. A flexible thin plate is attached to upper surfaces of the small plate-like members so as to allow longitudinal and lateral folding. Heat carrier flexible tube passages are provided in longitudinal and lateral folding portions of the panel so as to leave some play, and folding margin members are provided at the lateral folding portions. Fit-in members are attachably and detachably provided in respective heat carrier flexible tube passages with some play.
Abstract:
A process for producing a carbon fiber reinforced carbon composite material, comprising dispersing a short fibrous bundle of carbon fibers which comprises a plurality of single fibers, preparing a sheet in which fibers are in the two-dimensional random orientation, impregnating with a resin or pitch, laminating and molding, and then applying a baking and densifying treatment, a dispersion degree of the bundle of carbon fibers being controlled based on the formula (1) expressing correlation between the dispersion degree of the bundle of carbon fibers and the mechanical strength of the carbon fiber reinforced composite material:Dispersion degree=A-B.times.coefficient of friction (1)wherein A and B are constants determined experimentally, to produce a carbon fiber reinforced carbon composite material having desired mechanical characteristic.
Abstract:
A plate-shaped carbon fiber-reinforced carbon composite has a longitudinal length-to-widthwise length ratio of more than 1. The carbon fiber-reinforced carbon composite is such that at least two layers that are a first carbon fiber-reinforced carbon composite layer in which carbon fibers are placed in the carbonaceous matrix and are oriented in the longitudinal direction and a second carbon fiber-reinforced carbon composite layer different in the arrangement of the carbon fibers from the first carbon fiber-reinforced carbon composite layer are stacked, the first carbon fiber-reinforced carbon composite layer forms an outermost layer of at least one plate surface, the thickness thereof is 70% or more of the thickness of the carbon fiber-reinforced carbon composite, and the longitudinal bending elastic modulus is 150 GPa or more. The first carbon fiber-reinforced carbon composite layer in which the carbon fibers are aligned in the longitudinal direction is placed only on an outermost layer of one or both of plate surfaces and another site is a carbon fiber-reinforced carbon composite layer different in the arrangement of the carbon fibers from the first carbon fiber-reinforced carbon composite layer; hence, the longitudinal bending elastic modulus is significantly increased and warping, peeling, or cracking during usage and interlayer delamination due to gases produced during manufacture are suppressed.
Abstract:
A plate-shaped carbon fiber-reinforced carbon composite has a longitudinal length-to-widthwise length ratio of more than 1. The carbon fiber-reinforced carbon composite is such that at least two layers that are a first carbon fiber-reinforced carbon composite layer in which carbon fibers are placed in the carbonaceous matrix and are oriented in the longitudinal direction and a second carbon fiber-reinforced carbon composite layer different in the arrangement of the carbon fibers from the first carbon fiber-reinforced carbon composite layer are stacked, the first carbon fiber-reinforced carbon composite layer forms an outermost layer of at least one plate surface, the thickness thereof is 70% or more of the thickness of the carbon fiber-reinforced carbon composite, and the longitudinal bending elastic modulus is 150 GPa or more. The first carbon fiber-reinforced carbon composite layer in which the carbon fibers are aligned in the longitudinal direction is placed only on an outermost layer of one or both of plate surfaces and another site is a carbon fiber-reinforced carbon composite layer different in the arrangement of the carbon fibers from the first carbon fiber-reinforced carbon composite layer; hence, the longitudinal bending elastic modulus is significantly increased and warping, peeling, or cracking during usage and interlayer delamination due to gases produced during manufacture are suppressed.
Abstract:
A carbon fiber-reinforced carbon composite material, wherein carbon fibers are oriented substantially in the thickness direction, the ratio of the thermal conductivity in the thickness direction to the thermal conductivity in a direction perpendicular to the thickness direction is at least 2, and the thermal conductivity in the thickness direction is at least 3 W/cm..degree. C.
Abstract translation:碳纤维增强碳复合材料,其中碳纤维基本上沿厚度方向取向,厚度方向上的导热率与垂直于厚度方向的热导率之比至少为2,热 厚度方向的导电率为3W / cm以上。 DEG C.
Abstract:
An etchant which generates neither heat nor gas during the process, does not sublimate, is stable for a long period of time, requires no special pipings, and further requires no special treatment of waste water because of containing no organic solvents. The etchant is a solution containing hydrofluoric acid and an-oxoacid or oxoacid salt compound expressed by Mm(XOn)p (where M is hydrogen, one-to three-valence metal or NH.sub.4, m is 1 or 5, X is a halogen element, n is 3, 4 or 6, and p is 1, 2 or 3).
Abstract:
The present invention provides an etching agent that is able to etch a Cu film by a simple chemical etching method such as an immersion method when the low resistance Cu film is used for a wiring material, while allowing time-dependent changes of the etching rate to be small and preventing a pattern narrowing phenomenon ascribed to irregular amount of side etching of the Cu film from occurring, by providing an etching agent comprising an aqueous solution containing potassium hydrogen peroxosulfate and hydrofluoric acid, wherein masks of a give pattern is formed on the surface of a laminated film prepared by sequentially depositing a Ti or Ti alloy film and a Cu film on a substrate, and wherein a gate electrode (a laminated wiring) and a lower pad layer (a laminated wiring) with give patterns are formed by etching the laminated film using the etching agent having the foregoing construction.
Abstract:
A foldable floor heating panel can be folded longitudinally and laterally. The foldable floor heating panel includes several small plate-like members of a rectangular plan configuration, which are arranged longitudinally and laterally so as to be adjacent to each other. A flexible thin plate is attached to upper surfaces of the small plate-like members so as to allow longitudinal and lateral folding. Heat carrier flexible tube passages are provided in longitudinal and lateral folding portions of the panel so as to leave some play, and folding margin members are provided at the lateral folding portions. Fit-in members are attachably and detachably provided in respective heat carrier flexible tube passages with some play.
Abstract:
A method of fabricating a thin film transistor of an inverted stagger structure having a gate terminal, a gate insulator a semiconductor film, a source electrode and a drain electrode formed in that order; a gate terminal and a gate wiring are provided for supplying a scanning signal to the gate electrode; and a source terminal and a source wiring are provided for supplying a data signal to the source electrode, wherein the gate terminal is formed on an upper side of the gate insulating film and electrically connected to the gate wiring through a contact hole formed in the gate insulator.