中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.018 seconds)

    SYSTEMS AND METHODS FOR PREPARING BONE VOIDS TO RECEIVE A PROSTHESIS
    5.
    发明申请
    SYSTEMS AND METHODS FOR PREPARING BONE VOIDS TO RECEIVE A PROSTHESIS 有权
    用于准备骨质疏松接受预防的系统和方法

    公开(公告)号：US20130172892A1

    公开(公告)日：2013-07-04

    申请号：US13730082

    申请日：2012-12-28

    Applicant: Howmedica Osteonics Corp.

    Inventor： Damon J. Servidio ,  Carlos E. Collazo ,  Sujit Sivadas

    IPC: A61B17/16 ,  A61F2/38

    CPC classification number: A61B17/1662 ,  A61B17/1615 ,  A61B17/164 ,  A61B17/1668 ,  A61B17/1675 ,  A61B17/1717 ,  A61B17/1739 ,  A61B17/175 ,  A61B17/1764 ,  A61F2/38 ,  A61F2/3859 ,  A61F2/389 ,  A61F2002/30604 ,  A61F2002/30736 ,  A61F2002/30884

    Abstract: Systems and methods for shaping and filling offset bone voids during revision procedures of total knee replacements are disclosed. The systems disclosed herein generally include an intramedullary reamer, an offset driver, a cylindrical reaming tool, an offset reaming guide, and a conical reamer. An alternate embodiment of the system may also generally include an IM reamer, an offset driver, an offset broaching tool, and a second stage broaching tool. Yet another embodiment may generally include an elongate IM reamer, a cone reamer, a reamer guide shaft, a cone trial, a sizing template, a template guide, an offset lobe reamer, and offset lobe reamer retainer. Metaphyseal reconstruction devices and void filling cones can be used to fill the bone voids in conjunction with the systems and methods disclosed herein.

    Abstract translation: 公开了在全膝关节置换术的修复程序期间用于成形和填充抵消骨空隙的系统和方法。 本文公开的系统通常包括髓内铰刀，偏移驱动器，圆柱形扩孔工具，偏移铰孔引导件和锥形铰刀。 系统的替代实施例还可以通常包括IM扩孔器，偏移驱动器，偏移拉削工具和第二阶段拉削工具。 另一个实施例通常可以包括细长IM铰刀，锥形铰刀，扩孔器引导轴，锥形试件，尺寸模板，模板引导件，偏置凸角铰刀和偏置凸角铰刀保持器。 结合本文所公开的系统和方法，可以使用干al端重建装置和空隙填充锥来填充骨空隙。

    Systems and methods for preparing bone voids to receive a prosthesis
    10.
    发明授权
    Systems and methods for preparing bone voids to receive a prosthesis 有权

    公开(公告)号：US10213215B2

    公开(公告)日：2019-02-26

    申请号：US14837437

    申请日：2015-08-27

    Applicant: Howmedica Osteonics Corp.

    Inventor： Damon J. Servidio ,  Carlos E. Collazo ,  Sujit Sivadas

    IPC: A61B17/16 ,  A61F2/38 ,  A61B17/17 ,  A61F2/30

    Abstract: A surgical method for forming a void in bone includes the steps of positioning a support member securely within an intramedullary canal of a bone; attaching a guide member having a longitudinal axis to the support member in a fixed and offset relation to the intramedullary canal; connecting a cutting member having a cutting head to the guide member in a slidable arrangement along the longitudinal axis of the guide member such that the cutting head faces a first bone segment; and cutting the first bone segment along the longitudinal axis of the guide member, thereby forming a first offset bone void.

Patent Agency Ranking