公开(公告)号：US10072830B2

公开(公告)日：2018-09-11

申请号：US15148236

申请日：2016-05-06

Applicant: Hung Lin

Inventor： Hung Lin

IPC: F21V1/00 ,  F21V23/00 ,  F21V23/02 ,  H05K1/02 ,  H05K1/18 ,  F21Y103/00 ,  F21Y105/00

CPC classification number: F21V23/001 ,  F21V23/005 ,  F21V23/02 ,  F21Y2103/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H05B33/0803 ,  H05K1/0296 ,  H05K1/181 ,  H05K2201/10106

Abstract: A uniform luminance light-emitting diode (LED) circuit board includes a first primary trace and a second primary trace mounted on a substrate along a direction and are spaced apart, multiple LED strings mounted on the substrate along the direction and parallelly connected between the first primary trace and the second primary trace, a first power trace and a second power trace respectively connected to the first primary trace and the second primary trace, and a first auxiliary trace with two ends respectively connected to the second primary trace and the second power trace. By adjusting trace widths of the first primary trace and the second primary trace to limit current passing through each LED string and using the first auxiliary trace to provide an additional current path, identical current flowing through all the LED strings results in uniform luminance of the LED strings.

公开(公告)号：US20060040047A1

公开(公告)日：2006-02-23

申请号：US10991523

申请日：2004-11-19

Applicant: Kuang Lee ,  Hung Lin ,  Chien Wang ,  Bor Wang

Inventor： Kuang Lee ,  Hung Lin ,  Chien Wang ,  Bor Wang

IPC: B05D5/06 ,  B29C45/00 ,  B29C39/14 ,  B29C55/02 ,  B29C71/02

CPC classification number: G02B1/10 ,  B29C45/0001 ,  B29C55/04 ,  B29K2023/38 ,  B29K2105/0085 ,  B29K2995/0032 ,  B29L2011/00 ,  G02B1/14 ,  G02B5/30 ,  G02B5/3083

Abstract: Disclosed is a method of manufacturing an optical film, in which a transparent cycloolefin copolymer (COC) material is used as a raw material thereof and solved in a solvent to constitute a solution for forming the optical film. The thus formed optical film may have optical characteristics similar to those of prior-art optical film. Therefore, a retardation film or a protective film may be manufactured using cheaper and more accessible raw materials.

Abstract translation: 公开了一种制造光学膜的方法，其中使用透明环烯烃共聚物（COC）材料作为其原料，并溶解在溶剂中以构成用于形成光学膜的溶液。 这样形成的光学膜可以具有与现有技术的光学膜相似的光学特性。 因此，可以使用更便宜且更易接近的原料来制造延迟膜或保护膜。

公开(公告)号：US08324837B2

公开(公告)日：2012-12-04

申请号：US12461603

申请日：2009-08-18

Applicant: Hung Lin

Inventor： Hung Lin

IPC: G05F1/00

CPC classification number: H05B33/0827

Abstract: A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns are oppositely formed on the electrical insulation board. Each wire pattern is connected to the corresponding power wire and has a matrix main loop having closed loops and a plurality of sub-wires formed inside the corresponding closed loop. A plurality of LEDs are respectively mounted on the corresponding closed loop and electrically connect with the two sub-wires of the two wire patterns. When a DC power supply is inputted to the power wires, a current of the DC power supply uniformly flows through the matrix main loop and the sub-wires, so that the LEDs electrically connected to the corresponding sub-wires receive approximately equal current to further emit light with uniform brightness.

Abstract translation: 平行LED发光装置的并联发光电路的电路板具有电绝缘板，两线图案和至少两根电源线。 在电绝缘板上相反地形成两个线图形。 每个导线图案连接到相应的电源线，并且具有闭合环的矩阵主环和形成在相应闭环内的多个子线。 多个LED分别安装在相应的闭环上并与两个线图案的两个子线电连接。 当直流电源被输入到电源线时，直流电源的电流均匀地流过矩阵主回路和副线，使得与相应子线电连接的LED接近大致相等的电流 发光均匀亮度。

公开(公告)号：US20050231621A1

公开(公告)日：2005-10-20

申请号：US10827333

申请日：2004-04-20

Applicant: Wen Su ,  Chun Hsu ,  Hung Lin ,  Kai Hsiao

Inventor： Wen Su ,  Chun Hsu ,  Hung Lin ,  Kai Hsiao

IPC: H04N5/363 ,  H04N5/374 ,  H04N5/378 ,  H04N5/335

CPC classification number: H04N5/3575 ,  H04N5/3745 ,  H04N5/378

Abstract: The present invention describes an integrated image detecting apparatus with low noise, which transforms optical current to voltage and comprises an optical detecting element, an integrated circuit, a correlated double sampling circuit, and an output circuit. The present invention is a CMOS process and is designed for different CMOS image application systems, which keeps the advantages of low power consumption and better integration. Shifts of circuit characteristics caused by process variation are furthermore eliminated.

Abstract translation: 本发明描述了一种具有低噪声的集成图像检测装置，其将光电流转换成电压，并且包括光学检测元件，集成电路，相关双采样电路和输出电路。 本发明是CMOS工艺，被设计用于不同的CMOS图像应用系统，其保持低功耗和更好的集成的优点。 进一步消除了由过程变化引起的电路特性的变化。

公开(公告)号：US20160198539A1

公开(公告)日：2016-07-07

申请号：US14589015

申请日：2015-01-05

Applicant: Hung Lin

Inventor： Hung Lin

IPC: H05B33/08

CPC classification number: H05B33/0857 ,  H05B33/0824

Abstract: A board-mounted parallel circuit structure with efficient power utilization includes a first substrate, a first constant voltage layer and a second constant voltage layer. The first and second constant voltage layers are connected to a power supply respectively through two power connection points. The first constant voltage layer has at least one insulating zone. Each insulating zone has a light-emitting unit formed therein. One electrode of the light-emitting unit is connected to the first constant voltage layer, and the other electrode thereof is connected to the second constant voltage layer through a conducting wire. When the power supply outputs a low voltage to the first constant voltage layer, resistance values everywhere on the first constant voltage layer are identical. Accordingly, given any distance between a light-emitting unit and a corresponding power connection point, lighting efficiency of the light-emitting unit is not affected and effective power utilization can be ensured.

Abstract translation: 具有高效功率利用的板上并联电路结构包括第一基板，第一恒压层和第二恒压层。 第一和第二恒压层通过两个电源连接点分别连接到电源。 第一恒压层具有至少一个绝缘区。 每个绝缘区具有形成在其中的发光单元。 发光单元的一个电极连接到第一恒压层，另一个电极通过导线连接到第二恒压层。 当电源向第一恒压层输出低电压时，第一恒压层上的任何地方的电阻值相同。 因此，给予发光单元和对应的电源连接点之间的任何距离，发光单元的照明效率不受影响并且可以确保有效的功率利用。

公开(公告)号：US08410709B2

公开(公告)日：2013-04-02

申请号：US13172065

申请日：2011-06-29

Applicant: Hung Lin

Inventor： Hung Lin

IPC: H05B37/00 ,  H05B41/00 ,  H05K1/00

CPC classification number: H05B33/0827

Abstract: A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns are oppositely formed on the electrical insulation board. Each wire pattern is connected to the corresponding power wire and has a matrix main loop having closed loops and a plurality of sub-wires formed inside the corresponding closed loop. A plurality of LEDs are respectively mounted on the corresponding closed loop and electrically connect with the two sub-wires of the two wire patterns. When a DC power supply is inputted to the power wires, a current of the DC power supply uniformly flows through the matrix main loop and the sub-wires, so that the LEDs electrically connected to the corresponding sub-wires receive approximately equal current to further emit light with uniform brightness.

Abstract translation: 平行LED发光装置的并联发光电路的电路板具有电绝缘板，两线图案和至少两根电源线。 在电绝缘板上相反地形成两个线图形。 每个导线图案连接到相应的电源线，并且具有闭合环的矩阵主环和形成在相应闭环内的多个子线。 多个LED分别安装在相应的闭环上并与两个线图案的两个子线电连接。 当直流电源被输入到电源线时，直流电源的电流均匀地流过矩阵主回路和副线，使得与相应子线电连接的LED接近大致相等的电流 发光均匀亮度。

公开(公告)号：US20110043131A1

公开(公告)日：2011-02-24

申请号：US12461603

申请日：2009-08-18

Applicant: Hung Lin

Inventor： Hung Lin

IPC: H05B37/02

CPC classification number: H05B33/0827

Abstract: A circuit board of a parallel light-emitting circuit of parallel LED light-emitting device has an electrical insulation board, two wire patterns and at least two power wires. The two wire patterns are oppositely formed on the electrical insulation board. Each wire pattern is connected to the corresponding power wire and has a matrix main loop having closed loops and a plurality of sub-wires formed inside the corresponding closed loop. A plurality of LEDs are respectively mounted on the corresponding closed loop and electrically connect with the two sub-wires of the two wire patterns. When a DC power supply is inputted to the power wires, a current of the DC power supply uniformly flows through the matrix main loop and the sub-wires, so that the LEDs electrically connected to the corresponding sub-wires receive approximately equal current to further emit light with uniform brightness.

Abstract translation: 平行LED发光装置的并联发光电路的电路板具有电绝缘板，两线图案和至少两根电源线。 在电绝缘板上相反地形成两个线图形。 每个导线图案连接到相应的电源线，并且具有闭合环的矩阵主环和形成在相应闭环内的多个子线。 多个LED分别安装在相应的闭环上并与两个线图案的两个子线电连接。 当直流电源被输入到电源线时，直流电源的电流均匀地流过矩阵主回路和副线，使得与相应子线电连接的LED接近大致相等的电流 发光均匀亮度。

公开(公告)号：US20070177064A1

公开(公告)日：2007-08-02

申请号：US11484235

申请日：2006-07-10

Applicant: Hung Lin ,  San Kuo

Inventor： Hung Lin ,  San Kuo

IPC: H04N5/64

CPC classification number: H01Q1/125 ,  H01Q3/04

Abstract: A supporting structure comprises a base, a moveable unit and a first fine-tuning unit. The base comprises a body, a shaft, a first pivoting portion and a first groove, wherein the first pivoting portion and the first groove are disposed on the body. The moveable unit comprises a second pivoting portion and a positioning element, wherein the shaft passes the first and second pivoting portions to connect the moveable unit and the base, and the positioning element passes the first groove to position the moveable unit on the base. The first fine-tuning unit connects the base and the moveable unit, wherein the first fine-tuning unit rotates the moveable unit relative to the base.

Abstract translation: 支撑结构包括基座，可移动单元和第一微调单元。 基座包括主体，轴，第一枢转部分和第一凹槽，其中第一枢转部分和第一凹槽设置在主体上。 可移动单元包括第二枢转部分和定位元件，其中轴穿过第一和第二枢转部分以连接可移动单元和基座，并且定位元件通过第一凹槽以将可移动单元定位在基座上。 第一微调单元连接基座和可移动单元，其中第一微调单元相对于基座旋转可移动单元。

公开(公告)号：US20080036067A1

公开(公告)日：2008-02-14

申请号：US11882820

申请日：2007-08-06

Applicant: Hung Lin

Inventor： Hung Lin

IPC: H01L23/02

CPC classification number: H01L23/49575 ,  H01L23/525 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides a package structure with lead-frame on stacked chips, comprising: a lead-frame, composed of a plurality of outer leads arranged in rows facing each other and a plurality of inner leads arranged in rows facing each other formed by a plurality of wires, wherein the plurality of inner leads are divided into first inner leads and second inner leads, and the length of the first inner leads is greater than that of the second inner leads; and a plurality of semiconductor chip devices. The active surface of each chip faces upward and chips are misaligned to form offset stacked structure, wherein the semiconductor chip device stacked uppermost is fixedly connected under said first inner leads, and the plurality of semiconductor chip devices are electrically connected to the first inner leads and the second inner leads on the same side edge.

Abstract translation: 本发明提供了一种在堆叠芯片上具有引线框架的封装结构，包括：引线框架，由相互排列成行的多个外引线和由彼此面对的多个内引线组成， 多个线，其中所述多个内引线被分成第一内引线和第二内引线，并且所述第一内引线的长度大于所述第二内引线的长度; 和多个半导体芯片器件。 每个芯片的有源表面朝上并且芯片不对准以形成偏移堆叠结构，其中堆叠在最上面的半导体芯片器件固定地连接在所述第一内引线下方，并且多个半导体芯片器件电连接到第一内引线， 第二个内引线在同一侧边。

公开(公告)号：US20060236522A1

公开(公告)日：2006-10-26

申请号：US11022357

申请日：2004-12-22

Applicant: Hung Lin

Inventor： Hung Lin

IPC: B21D39/03 ,  B21B1/46

CPC classification number: B21D53/70 ,  B25G1/00 ,  B25G1/105 ,  B29C45/14377 ,  B29C45/14467 ,  B29L2031/283 ,  G09F3/00 ,  G09F23/00 ,  Y10T29/49826 ,  Y10T29/4998 ,  Y10T29/49982

Abstract: A method for manufacturing a tool handle includes preparing a handle member having one or more projections, attaching a panel onto the projection of the handle member, attaching a covering onto the panel and the projection, the covering includes a peripheral flange. An outer sleeve is then molded onto the handle member, and is engaged with the peripheral flange of the covering, to retain the covering and the panel to the handle member. A peripheral groove may be formed on the handle member and around the projection, to receive the peripheral flange of the covering. A concave chamber may be formed in the covering, to receive the panel and the projection of the handle member.

Abstract translation: 一种用于制造工具手柄的方法，包括制备具有一个或多个突起的手柄构件，将面板附接到手柄构件的突起上，将覆盖物附接到面板和突起上，该覆盖物包括周边凸缘。 然后将外套件模制到手柄构件上，并与外壳的周边凸缘接合，以将盖子和面板保持在手柄构件上。 周边槽可以形成在手柄构件上并且围绕突起部分，以接纳覆盖物的周边凸缘。 可以在覆盖物中形成凹室，以容纳面板和手柄构件的突出部。