公开(公告)号：US11885736B2

公开(公告)日：2024-01-30

申请号：US17993024

申请日：2022-11-23

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: G01N21/17 ,  G01N29/24 ,  G01R33/028 ,  B81C1/00

CPC classification number: G01N21/1702 ,  B81C1/00119 ,  G01N29/2418 ,  G01R33/0286 ,  B81C2203/0118 ,  B81C2203/035 ,  G01N2021/1704 ,  G01N2291/021

Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.

公开(公告)号：US11519847B2

公开(公告)日：2022-12-06

申请号：US16778692

申请日：2020-01-31

Applicant: Infineon Technologies AG

Inventor： Horst Theuss

IPC: G01N21/17 ,  G01N29/24 ,  G01R33/028 ,  B81C1/00

Abstract: A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.

公开(公告)号：US20220155261A1

公开(公告)日：2022-05-19

申请号：US17591714

申请日：2022-02-03

Applicant: Infineon Technologies AG

Inventor： Stefan Kolb ,  Alfons Dehe ,  Jochen Huber ,  Franz Jost ,  Horst Theuss ,  Juergen Woellenstein

IPC: G01N29/30 ,  G01N29/24

Abstract: An apparatus for in-situ calibration of a photoacoustic sensor includes a measurement device configured to measure an electric signal at an IR emitter of the photoacoustic sensor, wherein the IR emitter generates an electromagnetic spectrum based on the electric signal; and a calibration unit including processing circuitry, configured to compare the electric signal with a comparison value to generate a comparison result used as calibration information. When performing the in-situ calibration, the calibration unit is configured to adjust the electric signal based on the calibration information, or the calibration unit is configured to process an output signal of the photoacoustic sensor based on the calibration information to obtain an adjusted output signal of the photoacoustic sensor.

公开(公告)号：US11302668B2

公开(公告)日：2022-04-12

申请号：US16720867

申请日：2019-12-19

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Stephan Bradl ,  Stefan Miethaner ,  Alexander Heinrich ,  Horst Theuss ,  Peter Scherl

IPC: H01L21/677 ,  H01L21/56 ,  H01L21/67 ,  H01L21/48 ,  H01L21/78 ,  H01L23/00 ,  H01L23/495 ,  H01L23/31

Abstract: A method of producing packaged semiconductor devices includes providing a first packaging substrate panel, providing a second packaging substrate panel, and moving the first and second packaging substrate panels through an assembly line that comprises a plurality of package assembly tools using a control mechanism. First type packaged semiconductor devices are formed on the first packaging substrate panel and second type packaged semiconductor devices are formed on the second packaging substrate panel. The control mechanism moves both of the first and packaging substrate panels through the assembly line in a non-linear manner. The first and second packaged semiconductor devices differ with respect to at least one of: lead configuration, and encapsulant configuration.

公开(公告)号：US10802124B2

公开(公告)日：2020-10-13

申请号：US15390060

申请日：2016-12-23

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss

IPC: H01L41/00 ,  G01S7/521 ,  B81B7/00 ,  H01L41/09 ,  G01S15/08 ,  G01S15/10 ,  G10K11/00 ,  H01L41/053

Abstract: Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver.

公开(公告)号：US10678046B2

公开(公告)日：2020-06-09

申请号：US15959628

申请日：2018-04-23

Applicant: Infineon Technologies AG

Inventor： Cyrus Ghahremani ,  Horst Theuss

IPC: G02B26/08 ,  B81B7/00 ,  B81C1/00 ,  G01S7/486 ,  G02B26/10 ,  G01S7/481 ,  G02B27/00

Abstract: A microelectromechanical system (MEMS) package assembly and a method of manufacturing the same are provided for Light Detection and Ranging (LIDAR) systems. A MEMS package assembly includes a MEMS chip including a front-side surface and a back-side surface, the MEMS chip further including a LIDAR MEMS mirror configured to receive light and reflect the light as reflected light; and a cavity cap disposed on the front-side surface of the MEMS chip and forms a cavity that surrounds the LIDAR MEMS mirror such that the LIDAR MEMS mirror is sealed from an environment, the cavity cap having an asymmetrical shape such that a transmission surface of the cavity cap, through which the light and the reflected light is transmitted, is tilted at a tilt angle with respect to the front-side surface of the MEMS chip.

公开(公告)号：US10527589B2

公开(公告)日：2020-01-07

申请号：US15258646

申请日：2016-09-07

Applicant: Infineon Technologies AG

Inventor： Stefan Kolb ,  Alfons Dehe ,  Jochen Huber ,  Franz Jost ,  Horst Theuss ,  Juergen Woellenstein

IPC: G01N29/30 ,  G01N29/24

Abstract: An apparatus for in-situ calibration of a photoacoustic sensor is provided. The apparatus includes a light emitter to emit light along a transmission path to a gas and an acoustic sensor element configured to detect an acoustic signal emitted from the gas based on the received light. Furthermore, the apparatus includes a sensing unit configured to detect the light transmitted along the transmission path and to provide an output signal, and a calibration unit to receive the output signal from the sensing unit and to provide a calibration information based on the output signal received from the sensing unit.

公开(公告)号：US10451543B2

公开(公告)日：2019-10-22

申请号：US15349438

申请日：2016-11-11

Applicant: Infineon Technologies AG

Inventor： Thomas Mueller ,  Horst Theuss ,  Klaus Elian ,  Rainer Markus Schaller ,  Stefan Kolb

IPC: G01N21/17 ,  A61B5/00 ,  G01N29/032 ,  G01N29/22 ,  G01N29/24 ,  G01N29/48 ,  G01N33/00

Abstract: A photo-acoustic gas sensor is disclosed. The photo-acoustic gas sensor includes a substrate, a light emitter unit supported by the substrate, the light emitter unit including a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit supported by the substrate, the detector unit including a microphone, wherein the beam of light pulses traverses an area intended to accommodate the gas and the microphone can receive a signal oscillating with the repetition frequency.

公开(公告)号：US10117621B2

公开(公告)日：2018-11-06

申请号：US15141996

申请日：2016-04-29

Applicant: Infineon Technologies AG

Inventor： Jan Berger ,  Bernhard Wedl ,  Dirk Hammerschmidt ,  Walther Pachler ,  Horst Theuss ,  Harald Witschnig

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/145 ,  A61B5/026 ,  A61B5/024 ,  A61B5/05 ,  A61B5/01 ,  A61B5/0215

Abstract: An implantable device includes a body part and a piezoelectric part. The body part is configured to grasp a pulsatile organic or inorganic tissue. The piezoelectric part is mechanically coupled to the body part and is configured to convert a varying shear force transferred from the body part to the piezoelectric part into voltage. An implantable system, comprises the implantable device and a stent like object configured to be inserted and deployed within a pulsatile or static tissue. The implantable device is configured to form a sealed junction with the pulsatile tissue while pressing against an outer circumference area of the stent.

公开(公告)号：US20180295458A1

公开(公告)日：2018-10-11

申请号：US15946443

申请日：2018-04-05

Applicant: Infineon Technologies AG

Inventor： Matthias Steiert ,  Horst Theuss

IPC: H04R31/00 ,  B81B7/00 ,  B81C1/00 ,  H04R19/04 ,  H04R19/02 ,  H04R7/06

Abstract: A method for producing a MEMS sound transducer element includes, inter alia, providing a first substrate. The first substrate has a first substrate side, an opposite second substrate side and a membrane layer arranged on the first substrate side. A further method step includes performing a first etching from the second substrate side in a first surface section that is situated opposite the membrane layer, as far as a first depth. A further method step includes performing a second etching of the first substrate from the second substrate side in a second surface section in order to expose the membrane layer in the first surface section and to produce a back volume for the membrane layer, where the second surface section is larger than the first surface section and includes the first surface section.