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公开(公告)号:US20190265775A1
公开(公告)日:2019-08-29
申请号:US16308237
申请日:2017-06-09
Applicant: INGENICO GROUP
Inventor: Eric Philibert , Slimane Ay
IPC: G06F1/3234 , G06F1/3206
Abstract: A printed circuit including a microcontroller having at least one main element, termed a core, and at least one peripheral unit. The printed circuit has a selective power supply management for managing the power supply of the microcontroller. The selective management receives a command to shutdown the microcontroller coming from an internal shutdown function of the microcontroller, and reversibly cuts the power supply to the at least one peripheral unit while maintaining the power supply to the core.
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公开(公告)号:US10955902B2
公开(公告)日:2021-03-23
申请号:US16308237
申请日:2017-06-09
Applicant: INGENICO GROUP
Inventor: Eric Philibert , Slimane Ay
IPC: G06F1/32 , G06F1/3234 , G06F1/3206 , G07G1/00 , G06Q20/20 , G07G1/12
Abstract: A printed circuit including a microcontroller having at least one main element, termed a core, and at least one peripheral unit. The printed circuit has a selective power supply management for managing the power supply of the microcontroller. The selective management receives a command to shutdown the microcontroller coming from an internal shutdown function of the microcontroller, and reversibly cuts the power supply to the at least one peripheral unit while maintaining the power supply to the core.
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公开(公告)号:US10561024B2
公开(公告)日:2020-02-11
申请号:US15691149
申请日:2017-08-30
Applicant: INGENICO GROUP
Inventor: Eric Philibert , Richard Allirot
Abstract: A flexible printed circuit board is proposed. The flexible printed circuit board includes at least one soldering element possessing a soldering face, accessible from a first face of the flexible printed circuit board, and a heating face, accessible from a second face of the flexible printed circuit board. Such a flexible printed circuit board includes a main part including the soldering element, and at least one foldable part, extending from the main part and being configured to pass: from a non-folded state, in which the at least one foldable part does not cover the heating face of the at least one soldering element; to a folded state in which the at least one foldable part covers the heating face of the at least one soldering element.
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公开(公告)号:US20180063969A1
公开(公告)日:2018-03-01
申请号:US15691149
申请日:2017-08-30
Applicant: INGENICO GROUP
Inventor: Eric Philibert , Richard Allirot
CPC classification number: H05K3/363 , H01R12/62 , H01R12/65 , H05K1/0275 , H05K1/028 , H05K2201/0394 , H05K2201/055 , H05K2201/058 , H05K2201/09445 , H05K2201/10977
Abstract: A flexible printed circuit board is proposed. The flexible printed circuit board includes at least one soldering element possessing a soldering face, accessible from a first face of the flexible printed circuit board, and a heating face, accessible from a second face of the flexible printed circuit board. Such a flexible printed circuit board includes a main part including the soldering element, and at least one foldable part, extending from the main part and being configured to pass: from a non-folded state, in which the at least one foldable part does not cover the heating face of the at least one soldering element; to a folded state in which the at least one foldable part covers the heating face of the at least one soldering element.
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