公开(公告)号：US10971951B2

公开(公告)日：2021-04-06

申请号：US15779508

申请日：2015-12-24

Applicant: INTEL CORPORATION

Inventor： Shaorong Zhou ,  Songnan Yang ,  Hong W. Wong ,  Peipei Ding ,  Xiaoguo Liang ,  Ze An Xia

IPC: H02J50/12 ,  H02J7/00 ,  H02J7/02

Abstract: A universal power adapter may be provided to provide both a wireless charging signal and a DC signal for wired charging. The universal power adapter may include an AC/DC converter device, a first power circuit, a second power circuit, and a jack to provide a wireless charging signal and a DC signal. The AC/DC converter device to provide a DC signal based on an AC signal received from an external power source. The first power circuit to receive the DC signal and to provide a wireless charging signal based on the DC signal. The second power circuit to receive the DC signal and to provide a DC signal based on the DC signal. The jack may provide both the wireless charging signal and the DC signal.

公开(公告)号：US20210127529A1

公开(公告)日：2021-04-29

申请号：US17110068

申请日：2020-12-02

Applicant: Intel Corporation

Inventor： Timothy Glen Hanna ,  Suchismita Sarangi ,  Carl D. Williams ,  Jordan Johnson ,  Juan G. Cevallos Palomeque ,  Mark E. Sprenger ,  Peipei Ding ,  Christian Amoah-Kusi ,  Sean T. Sivapalan ,  Rithi S. Soeung ,  Curtis A. Valentine

IPC: H05K7/20

Abstract: An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.