公开(公告)号：US10342132B2

公开(公告)日：2019-07-02

申请号：US15839419

申请日：2017-12-12

Applicant: INTEL CORPORATION

Inventor： Xiang Li ,  George Vergis ,  Slobodan Mrdjan

IPC: H05K7/00 ,  H05K5/00 ,  H05K1/14 ,  H05K1/02 ,  H05K3/46 ,  H01R12/70 ,  H01R12/55 ,  H01R12/52 ,  H01R12/73

Abstract: Embodiments of the present disclosure are directed towards a memory device insertable into a PCB, e.g., a motherboard of a computing device. In some embodiments, the memory device may include a first PCB having a first thickness, to house one or more memory modules disposed on at least one side of the first PCB. The memory device may further include a layer having a second thickness, which may be attached to the side of the first PCB in an area that is proximate to an edge of the first PCB, to form a memory device portion that may be insertable into a connector slot disposed on a second PCB. The insertable portion may have a thickness that comprises the first and second thicknesses, to fit into the connector slot of the second PCB. Other embodiments may be described and/or claimed.

公开(公告)号：US20190037695A1

公开(公告)日：2019-01-31

申请号：US15839419

申请日：2017-12-12

Applicant: INTEL CORPORATION

Inventor： Xiang Li ,  George Vergis ,  Slobodan Mrdjan

IPC: H05K1/14 ,  H05K1/02 ,  H05K3/46 ,  H01R12/73 ,  H01R12/70 ,  H01R12/55 ,  H01R12/52

CPC classification number: H05K1/14 ,  H01R12/52 ,  H01R12/55 ,  H01R12/7076 ,  H01R12/737 ,  H01R13/6466 ,  H05K1/0228 ,  H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K3/368 ,  H05K3/46 ,  H05K2201/041 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10545

Abstract: Embodiments of the present disclosure are directed towards a memory device insertable into a PCB, e.g., a motherboard of a computing device. In some embodiments, the memory device may include a first PCB having a first thickness, to house one or more memory modules disposed on at least one side of the first PCB. The memory device may further include a layer having a second thickness, which may be attached to the side of the first PCB in an area that is proximate to an edge of the first PCB, to form a memory device portion that may be insertable into a connector slot disposed on a second PCB. The insertable portion may have a thickness that comprises the first and second thicknesses, to fit into the connector slot of the second PCB. Other embodiments may be described and/or claimed.