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公开(公告)号：US10037947B1
公开(公告)日：2018-07-31
申请号：US15495014
申请日：2017-04-24
Applicant: Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
Inventor： Michael A. Tischler , Philippe M. Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC: H01L33/00 , H01L21/00 , H01L23/538 , H01L33/50 , H01L23/14
CPC classification number: H01L23/5387 , H01L25/0753 , H01L33/44 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2933/0041
Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
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公开(公告)号：US09252373B2
公开(公告)日：2016-02-02
申请号：US14704334
申请日：2015-05-05
Applicant: Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
Inventor： Michael A. Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
IPC: H01L33/00 , H01L21/00 , H01L51/00 , H01L23/498 , H01L23/538
CPC classification number: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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公开(公告)号：US20150014708A1
公开(公告)日：2015-01-15
申请号：US14334189
申请日：2014-07-17
Applicant: Ingo Speier , Ian Ashdown , Philippe Schick
Inventor： Ingo Speier , Ian Ashdown , Philippe Schick
CPC classification number: H01L25/167 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/09701 , H01L2924/00
Abstract: In various embodiments, packages include one or more lighting devices having electrical contact points, a flexible substrate for supporting the lighting devices, a plurality of electrically conductive traces defined on the substrate and electrically connected to the contact points of the lighting devices, and an adhesive layer mounting each of the lighting devices on the substrate.
Abstract translation: 在各种实施例中，包装包括具有电接触点的一个或多个照明装置，用于支撑照明装置的柔性基板，限定在基板上并电连接到照明装置的接触点的多个导电迹线，以及粘合剂 将每个照明装置的层安装在基板上。
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公开(公告)号：US08933479B2
公开(公告)日：2015-01-13
申请号：US14215963
申请日：2014-03-17
Applicant: Michael A. Tishcler , Ian Ashdown
Inventor： Michael A. Tishcler , Ian Ashdown
CPC classification number: H01L33/32 , H01L24/97 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/56 , H01L2224/13 , H01L2224/48091 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
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公开(公告)号：US20140264404A1
公开(公告)日：2014-09-18
申请号：US14185229
申请日：2014-02-20
Applicant: Ian Ashdown , Michael A. Tischler , Philippe M. Schick , Tom Pinnington , Henry Ip
Inventor： Ian Ashdown , Michael A. Tischler , Philippe M. Schick , Tom Pinnington , Henry Ip
CPC classification number: H01L33/505 , H01L23/495 , H01L27/15 , H01L27/156 , H01L33/32 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/07811 , H01L2924/00014 , H01L2924/00
Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
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Patent Agency Ranking
公开(公告)号：US20140231854A1
公开(公告)日：2014-08-21
申请号：US14215963
申请日：2014-03-17
Applicant: Michael A. Tishcler , Ian Ashdown
Inventor： Michael A. Tishcler , Ian Ashdown
CPC classification number: H01L33/32 , H01L24/97 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/56 , H01L2224/13 , H01L2224/48091 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
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公开(公告)号：US20140231848A1
公开(公告)日：2014-08-21
申请号：US14051577
申请日：2013-10-11
Applicant: Michael A. Tischler , Ian Ashdown
Inventor： Michael A. Tischler , Ian Ashdown
IPC: H01L33/50
CPC classification number: H01L33/32 , H01L24/97 , H01L33/50 , H01L33/502 , H01L33/508 , H01L33/56 , H01L2224/13 , H01L2224/48091 , H01L2924/01322 , H01L2924/07802 , H01L2924/07811 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
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公开(公告)号：US08686625B1
公开(公告)日：2014-04-01
申请号：US13863926
申请日：2013-04-16
Applicant: Ian Ashdown , Michael A. Tischler , Philippe M. Schick , Tom Pinnington , Henry Ip
Inventor： Ian Ashdown , Michael A. Tischler , Philippe M. Schick , Tom Pinnington , Henry Ip
CPC classification number: H01L33/505 , H01L23/495 , H01L27/15 , H01L27/156 , H01L33/32 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/07811 , H01L2924/00014 , H01L2924/00
Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
Abstract translation: 根据某些实施例，至少部分围绕发光管芯的荧光体元件成形为影响色温发散。
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公开(公告)号：US20140078725A1
公开(公告)日：2014-03-20
申请号：US14037799
申请日：2013-09-26
Applicant: Ian Ashdown , Philippe M. Schick , Ingo Speier , Wallace Scott
Inventor： Ian Ashdown , Philippe M. Schick , Ingo Speier , Wallace Scott
CPC classification number: F21S19/005 , F21S8/06 , F21V7/0083 , F21V23/0464 , F21V23/0471 , F21V23/06 , F21W2131/405 , F21Y2103/10 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , G02C11/04 , G03B15/03 , G03B17/565
Abstract: In accordance with certain embodiments, interior spaces are illuminated with a combination of harvested sunlight and artificial light emitted by one or more light-emitting elements.
Abstract translation: 根据某些实施例，内部空间被收集的太阳光和由一个或多个发光元件发射的人造光的组合照射。
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公开(公告)号：US20120217496A1
公开(公告)日：2012-08-30
申请号：US13466288
申请日：2012-05-08
Applicant: Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
Inventor： Michael Tischler , Philippe Schick , Ian Ashdown , Calvin Wade Sheen , Paul Jungwirth
CPC classification number: F21K9/66 , F21K9/20 , F21K9/275 , F21K9/278 , F21K9/64 , F21K9/65 , F21V3/02 , F21V9/30 , F21V23/003 , F21V23/02 , F21V29/74 , F21Y2115/10 , G02F1/133603 , H01L23/367 , H01L23/4985 , H01L23/5387 , H01L24/32 , H01L24/83 , H01L25/0753 , H01L27/156 , H01L31/0468 , H01L33/0025 , H01L33/06 , H01L33/08 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/36 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/0097 , H01L2224/06102 , H01L2224/16225 , H01L2224/2929 , H01L2224/32225 , H01L2224/73204 , H01L2224/83385 , H01L2224/83851 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01058 , H01L2924/01063 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/10253 , H01L2924/10321 , H01L2924/10322 , H01L2924/10323 , H01L2924/10324 , H01L2924/10328 , H01L2924/10329 , H01L2924/1033 , H01L2924/10331 , H01L2924/10332 , H01L2924/10333 , H01L2924/10334 , H01L2924/10335 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/381 , H02S30/00 , H05B33/0854 , H05B37/0218 , H05B37/0227 , H05B37/0245 , H05K1/189 , H05K3/323 , H05K2201/09036 , H05K2201/10106 , H05K2203/302 , H01L2924/01015 , H01L2924/01031 , H01L2924/01051 , H01L2924/3512 , H01L2924/00 , H01L2924/00014
Abstract: In accordance with certain embodiments, an unpackaged inorganic LED die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the unpackaged inorganic LED die or non-coplanarity of the contacts thereof.
Abstract translation: 根据某些实施例，未封装的无机LED管芯具有压敏激光粘合剂直接粘附到屈服基底上，尽管未封装的无机LED裸片的表面具有任何非平面性，也不与其接触的非共面性。
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