公开(公告)号：US09390998B2

公开(公告)日：2016-07-12

申请号：US13399952

申请日：2012-02-17

Applicant: Ilyas Mohammed ,  Liang Wang ,  Gabriel Z. Guevara

Inventor： Ilyas Mohammed ,  Liang Wang ,  Gabriel Z. Guevara

IPC: H01L23/62 ,  H01L23/373

CPC classification number: H01L23/3735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Heat spreading substrate. In accordance with an embodiment of the present invention, an apparatus includes a thermally conductive, electrically insulating regular solid, a first electrically conductive coating mechanically coupled to a first edge of the regular solid and a second electrically conductive coating mechanically coupled to a second edge of the regular solid. The first and the second electrically conductive coatings are electrically isolated from one another and the faces of the first electrically conductive coating, the second electrically conductive coating and the regular solid are substantially co-planar. The primary and secondary surfaces of the regular solid may be free of electrically conductive materials.

Abstract translation: 散热基板。 根据本发明的实施例，一种装置包括导热的，电绝缘的规则固体，机械耦合到正常固体的第一边缘的第一导电涂层和机械耦合到第二边缘的第二导电涂层 正规固体。 第一和第二导电涂层彼此电隔离，并且第一导电涂层，第二导电涂层和常规固体的表面基本上是共面的。 正规固体的主表面和次表面可以不含导电材料。

公开(公告)号：US20160070393A1

公开(公告)日：2016-03-10

申请号：US14480628

申请日：2014-09-08

Applicant: Sumit Sharma ,  Chris Singleton ,  Piyush Savalia ,  Prasad Panchalan ,  Shila Nabanja ,  Sylvia Hou-Yan Cheng ,  Ilyas Mohammed

Inventor： Sumit Sharma ,  Chris Singleton ,  Piyush Savalia ,  Prasad Panchalan ,  Shila Nabanja ,  Sylvia Hou-Yan Cheng ,  Ilyas Mohammed

IPC: G06F3/047 ,  G06F3/044 ,  G09G5/00

CPC classification number: G06F3/047 ,  A61B5/002 ,  A61B5/02055 ,  A61B5/02438 ,  A61B5/0245 ,  A61B5/0531 ,  A61B5/1123 ,  A61B5/4812 ,  A61B5/681 ,  A61B5/7264 ,  A61B5/7445 ,  A61B5/7475 ,  A61B2560/0468 ,  A61B2560/0475 ,  A61B2562/0215 ,  A61B2562/12 ,  G04G17/04 ,  G04G17/06 ,  G04G17/08 ,  G04G21/08 ,  G06F1/163 ,  G06F1/1643 ,  G06F1/1656 ,  G06F1/1684 ,  G06F3/011 ,  G06F3/044 ,  G09G2380/02 ,  G09G2380/08

Abstract: Embodiments relate generally to electrical and electronic hardware, computer software, wired and wireless network communications, and computing devices, and, in particular, to a wearable device implementing a touch-sensitive interface in a metal pod cover and/or bioimpedance sensing to determine physiological characteristics, such as heart rate. According to an embodiment, a wearable device includes a selectably opaque surface configured to emit arrangements of light to form a display, and a touch-sensitive I/O control circuit coupled to the selectably opaque surface to detect a capacitance value as an input signal to modify the display. Also, the wearable device can include one or more straps coupled to a wearable pod, at least one of the one or more straps including electrodes for sensing a physiological characteristic. A display controller can be configured to display a representation as a function of a value of the physiological characteristic via the selectably opaque surface.

Abstract translation: 实施例一般涉及电气和电子硬件，计算机软件，有线和无线网络通信以及计算设备，特别涉及在金属舱盖和/或生物阻抗感测中实现触敏界面的可穿戴设备，以确定生理 特点，如心率。 根据实施例，可穿戴设备包括可选择地不透明表面，其被配置为发射光的布置以形成显示器，以及耦合到可选择地不透明表面的触敏I / O控制电路，以检测电容值作为输入信号 修改显示。 此外，可穿戴设备可以包括耦合到可佩戴的荚的一个或多个带，所述一个或多个带中的至少一个带包括用于感测生理特征的电极。 显示控制器可以被配置为经由可选择地不透明的表面显示作为生理特征的值的函数的表示。

公开(公告)号：US09125333B2

公开(公告)日：2015-09-01

申请号：US13183870

申请日：2011-07-15

Applicant: Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

Inventor： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/40

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

Abstract translation: 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US08988895B2

公开(公告)日：2015-03-24

申请号：US13215725

申请日：2011-08-23

Applicant: Ilyas Mohammed ,  Belgacem Haba

Inventor： Ilyas Mohammed ,  Belgacem Haba

IPC: H05K7/04 ,  H01B7/00 ,  H01R43/00 ,  H01L21/50 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01R12/52

CPC classification number: H05K3/4602 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01R12/523 ,  H05K2201/10378 ,  H05K2203/0235 ,  Y10T29/49176

Abstract: An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.

Abstract translation: 公开了一种互连元件，其包括多个拉制的金属导体，电介质层和在其上具有多个可湿接触点的相对表面。 导体可以包括具有沿导体的第一和第二端之间的方向定向的长度的晶粒。 用于绝缘导体的电介质层可以具有第一和第二相对表面，并且在第一和第二表面之间可以具有小于1毫米的厚度。 一个或多个导体可以被配置为将信号传送到微电子元件或从微电子元件传送信号。 可以使用第一和第二可湿触点将互连元件接合到微电子元件和电路板中的至少一个。 可湿性触点可以匹配微电子元件的表面处的元件触点的空间分布或暴露在微电子元件以外的部件的表面处的电路触点。

公开(公告)号：US08937361B2

公开(公告)日：2015-01-20

申请号：US13114243

申请日：2011-05-24

Applicant: Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

Inventor： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

Abstract: A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

Abstract translation: 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US08916781B2

公开(公告)日：2014-12-23

申请号：US13296785

申请日：2011-11-15

Applicant: Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Cyprian Emeka Uzoh

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H05K1/00 ,  H01L23/498 ,  H01R12/71 ,  H05K3/42

CPC classification number: H05K1/0271 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R12/714 ,  H05K1/114 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09645 ,  H05K2201/10378 ,  H05K2203/0242 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.

Abstract translation: 互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。 该元件由热膨胀系数小于10ppm /℃的材料构成。 至少一些导体沿开口的至少一个内表面延伸。 导体在第一表面限定多个可润湿的第一接触。 第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。

公开(公告)号：US08853558B2

公开(公告)日：2014-10-07

申请号：US12965192

申请日：2010-12-10

Applicant: Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

Inventor： Debabrata Gupta ,  Yukio Hashimoto ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Rajesh Katkar

IPC: H05K1/16 ,  H01L25/10 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L24/14 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/528 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13647 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic assembly includes a first surface and a first thin conductive element exposed at the first surface and having a face comprising first and second regions. A first conductive projection having a base connected to and covering the first region of the face extends to an end remote from the base. A first dielectric material layer covers the second region of the first thin element and contacts at least the base of the first conductive projection. The assembly further includes a second substrate having a second face and a second conductive projection extending away from the second face. A first fusible metal mass connects the first projection to the second projection and extends along an edge of the first projection towards the first dielectric material layer.

Abstract translation: 微电子组件包括第一表面和暴露在第一表面处并具有包括第一和第二区域的面的第一薄导电元件。 具有连接到并覆盖面的第一区域的基部的第一导电突起延伸到远离基部的一端。 第一介电材料层覆盖第一薄元件的第二区域并且至少与第一导电突起的基部接触。 组件还包括具有第二面的第二衬底和远离第二面延伸的第二导电突起。 第一可熔金属块将第一突起连接到第二突起并沿着第一突起的边缘朝着第一介电材料层延伸。

公开(公告)号：US08835228B2

公开(公告)日：2014-09-16

申请号：US13477532

申请日：2012-05-22

Applicant: Ilyas Mohammed

Inventor： Ilyas Mohammed

IPC: H01L23/48

CPC classification number: H01L23/5226 ,  H01L21/563 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76892 ,  H01L23/5389 ,  H01L24/06 ,  H01L24/18 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/49 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/48 ,  H01L2224/49 ,  H01L2224/73267 ,  H01L2225/06524 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/182 ,  H01L2924/191 ,  H01L2924/19107 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2203/1461 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01049

Abstract: A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are uncovered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.

Abstract translation: 制造微电子单元的方法包括在包括可图案化金属元件的结构的导电接合表面的形式的第一表面上形成多个引线接合。 线接合形成有与第一表面和远离第一表面的端表面接合的基底。 线接合具有在基部和端面之间延伸的边缘表面。 该方法还包括在导电层的第一表面的一部分上方并且在引线接合部分之上形成电介质封装层，使得引线接合的未封装部分由未被所述边缘表面覆盖的端面或边缘表面的部分限定 封装层。 金属元件被图案化以在引线键合下形成第一导电元件，并且通过封装层的一部分彼此绝缘。

公开(公告)号：US08652935B2

公开(公告)日：2014-02-18

申请号：US12970529

申请日：2010-12-16

Applicant: Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

Inventor： Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

IPC: H01L21/30

CPC classification number: H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second substrates having a coefficient of thermal expansion less than 10 parts per million/° C., at least one of the confronting surfaces having a plurality of channels extending from an edge of such surface, such that the dielectric material between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material flows into at least some of the channels.

Abstract translation: 接合第一和第二微电子元件的方法包括将含有有源电路元件的第一衬底与第二衬底压在一起，在相应衬底的相对表面之间具有可流动介电材料，第一和第二衬底中的每一个具有热系数 膨胀小于10ppm /℃，至少一个相对表面具有从该表面的边缘延伸的多个通道，使得由相对表面限定的平面之间的电介质材料至少基本上不含 空隙并且具有超过一微米的厚度，并且至少一些介电材料流入至少一些通道。

公开(公告)号：US20140035153A1

公开(公告)日：2014-02-06

申请号：US13563085

申请日：2012-07-31

Applicant: Ilyas Mohammed

Inventor： Ilyas Mohammed

IPC: H01L23/48 ,  H01L21/50

CPC classification number: H01L25/0657 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/91 ,  H01L24/92 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/0233 ,  H01L2224/02371 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/24011 ,  H01L2224/24147 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/821 ,  H01L2224/83855 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2924/00014 ,  H05K3/4661 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A microelectronic package includes first and second encapsulated microelectronic elements, each of which includes a semiconductor die having a front face and contacts thereon. An encapsulant contacts at least an edge surface of each semiconductor die and extends in at least one lateral direction therefrom. Electrically conductive elements extend from the contacts and over the front face to locations overlying the encapsulant. The first and second microelectronic elements are affixed to one another such that one of the front or back surfaces of one of the first and second semiconductor dies is oriented towards one of the front or back surfaces of the other of the first and second semiconductor dies. A plurality of electrically conductive interconnects extend through the encapsulants of the first and second microelectronic elements and are electrically connected with at least one semiconductor die of the first and second microelectronic elements by the conductive elements.

Abstract translation: 微电子封装包括第一和第二封装微电子元件，每个元件包括具有正面和与其接触的半导体管芯。 密封剂与每个半导体管芯的至少边缘表面接触并且沿至少一个横向方向延伸。 导电元件从触头延伸并且在正面上延伸到覆盖密封剂的位置。 第一和第二微电子元件彼此固定，使得第一和第二半导体管芯中的一个的前表面或后表面中的一个朝向第一和第二半导体管芯中的另一个的前表面或后表面中的一个。 多个导电互连件延伸穿过第一和第二微电子元件的密封剂，并且通过导电元件与第一和第二微电子元件的至少一个半导体管芯电连接。