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公开(公告)号：US09613886B2
公开(公告)日：2017-04-04
申请号：US14472390
申请日：2014-08-29
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Chia-Hsin Chao , Shu-Mei Yang , Chun-Hsing Lee , Chien-Chun Lu
IPC: G02B6/12 , H01L23/48 , H01L21/306 , H01L27/02 , H01L33/20 , H01L33/62 , H01L21/768 , H01L23/00 , H01S5/02 , H01S5/024 , H01S5/026 , H01S5/34 , G02B6/34 , H01L29/861 , H01L23/60 , H01L23/13 , H01L23/14 , H01L23/498 , H01L21/48 , H01L25/16
CPC classification number: H01L23/481 , G02B6/12 , G02B6/34 , G02B2006/12061 , H01L21/30604 , H01L21/486 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L23/60 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/80 , H01L25/167 , H01L27/0255 , H01L29/861 , H01L33/20 , H01L33/62 , H01L2224/04 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06102 , H01L2224/08148 , H01L2224/08238 , H01L2224/16148 , H01L2224/16238 , H01L2224/29294 , H01L2224/32148 , H01L2224/32238 , H01L2224/48091 , H01L2224/48105 , H01L2224/48148 , H01L2224/48229 , H01L2224/73265 , H01L2224/80801 , H01L2224/80805 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83805 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2933/0066 , H01S5/0208 , H01S5/02469 , H01S5/026 , H01S5/34 , H01L2924/00 , H01L2224/80 , H01L2924/00012 , H01L2224/45099
Abstract: An optical coupling module includes a silicon photonic substrate, and an optical waveguide module. The silicon photonic substrate has a first surface and a first grating on the first surface for diffracting the light which passes through the grating. The optical waveguide module is disposed on the silicon photonic substrate, wherein the optical waveguide module includes an optical waveguide having an end disposed in corresponding to the first grating of the silicon photonic substrate. Otherwise, the optical waveguide module has a reflective surface coupled to the end of the optical waveguide and adapted to reflect the light emerging from or incident into the grating to form an optical path between the silicon photonic substrate and the optical waveguide for transmitting the light.
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公开(公告)号：US09438063B2
公开(公告)日：2016-09-06
申请号：US14197229
申请日：2014-03-05
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Mu-Tao Chu , Yu-Chen Yu , Wen-Yih Liao , Ming-Hsien Wu
CPC classification number: H02J50/30 , H02J5/005 , H02J7/025 , H02J7/34 , H02J7/35 , H02J17/00 , H02J50/20 , H02J50/40 , Y02E10/766
Abstract: A charge apparatus including a natural energy conversion module, an energy converter, an energy transmitter, an energy receiver, and an electricity storage device is provided. The natural energy conversion module receives the natural energy and converts the natural energy into a first electric energy. The energy converter is electrically connected to the natural energy conversion module and converts the first electric energy into a wireless energy. The energy transmitter is electrically connected to the energy converter and transmits the wireless energy. The energy receiver receives the wireless energy and converts the wireless energy into a second electric energy to charge an external apparatus. The energy transmitter monitors the current charge status of the external apparatus so as to adjust transmitting the wireless energy. The electricity storage device is electrically connected to the natural energy conversion module to store the first electric energy.
Abstract translation: 提供了包括自然能量转换模块，能量转换器，能量发射器，能量接收器和蓄电装置的充电装置。 天然能量转换模块接收天然能量并将天然能量转化为第一电能。 能量转换器电连接到自然能量转换模块，并将第一电能转换为无线能量。 能量发射器电连接到能量转换器并传输无线能量。 能量接收器接收无线能量并将无线能量转换成第二电能以对外部设备充电。 能量发射器监视外部设备的当前充电状态，以便调整传输无线电能。 蓄电装置电连接到自然能转换模块以存储第一电能。
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公开(公告)号：US08981391B2
公开(公告)日：2015-03-17
申请号：US13923376
申请日：2013-06-21
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Chia-Hsin Chao , Kuang-Yu Tai , Wen-Yung Yeh
CPC classification number: H01L27/156 , G02F1/157 , G02F2001/13324 , G02F2201/44 , H01L27/32 , H01L27/3209 , H01L27/3211 , H01L27/322 , H01L27/3232 , H01L27/3283 , H01L51/5284 , H01L2251/5323
Abstract: A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%.
Abstract translation: 提供了包括基板，网状屏蔽图案和多个发光装置的显示面板。 网状屏蔽图案设置在基板上，以便在基板上限定多个像素区域。 发光装置设置在基板上。 发光装置的至少一个发光装置配置在像素区域的各像素区域中，像素区域的面积为A1，发光装置的面积为A2，A2的比例 到A1低于50％。
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4.发明申请公开(公告)号：US20190293954A1
公开(公告)日：2019-09-26
申请号：US16172882
申请日：2018-10-29
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Hsueh-Chih Chang , Mu-Tao Chu , Hung-Lieh Hu
Abstract: A light source module adapted to provide a superposition structured pattern includes a light emitting device adapted to provide a light beam, a light guiding element including a polarizing beam splitter to separate the light beam into a first light beam and a second light beam, a first diffractive element configured to convert the first light beam into a first structured light, and a second diffractive element configured to convert the second light beam into a second structured light. Polarization states of the first light beam and the second light beam are different. The first and second structured lights are projected into a projection region, and overlapped and imaged as a superposition structured pattern. The projection region has sub-projection regions arranged in a matrix and adjacent to each other, and the pattern distribution of the superposition structured pattern in each sub-projection region is different from each other.
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公开(公告)号：US09653382B2
公开(公告)日：2017-05-16
申请号：US14864810
申请日：2015-09-24
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Yen-Hsiang Fang , Chia-Hsin Chao , Yao-Jun Tsai , Yi-Chen Lin
IPC: H01S5/024 , H01S5/026 , H01S5/34 , H01L23/48 , H01L21/306 , H01L27/02 , H01L33/20 , H01L33/62 , H01L21/768 , H01L23/00 , H01S5/02 , G02B6/12 , G02B6/34 , H01L29/861 , H01L23/60 , H01L23/13 , H01L23/14 , H01L23/498 , H01L21/48 , H01L25/16
CPC classification number: H01L23/481 , G02B6/12 , G02B6/34 , G02B2006/12061 , H01L21/30604 , H01L21/486 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L23/60 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/80 , H01L25/167 , H01L27/0255 , H01L29/861 , H01L33/20 , H01L33/62 , H01L2224/04 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06102 , H01L2224/08148 , H01L2224/08238 , H01L2224/16148 , H01L2224/16238 , H01L2224/29294 , H01L2224/32148 , H01L2224/32238 , H01L2224/48091 , H01L2224/48105 , H01L2224/48148 , H01L2224/48229 , H01L2224/73265 , H01L2224/80801 , H01L2224/80805 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83805 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2933/0066 , H01S5/0208 , H01S5/02469 , H01S5/026 , H01S5/34 , H01L2924/00 , H01L2224/80 , H01L2924/00012 , H01L2224/45099
Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.
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Patent Agency Ranking
公开(公告)号：US20130341659A1
公开(公告)日：2013-12-26
申请号：US13923376
申请日：2013-06-21
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Chia-Hsin Chao , Kuang-Yu Tai , Wen-Yung Yeh
IPC: H01L27/15
CPC classification number: H01L27/156 , G02F1/157 , G02F2001/13324 , G02F2201/44 , H01L27/32 , H01L27/3209 , H01L27/3211 , H01L27/322 , H01L27/3232 , H01L27/3283 , H01L51/5284 , H01L2251/5323
Abstract: A display panel including a substrate, a meshed shielding pattern, and a plurality of light-emitting devices is provided. The meshed shielding pattern is disposed on the substrate so as to define a plurality of pixel regions on the substrate. The light-emitting devices are disposed on the substrate. At least one light-emitting device of the light-emitting devices is disposed in each pixel region of the pixel regions, wherein an area of the pixel region is A1, an area of the light-emitting device is A2, and a ratio of A2 to A1 is below 50%.
Abstract translation: 提供了包括基板，网状屏蔽图案和多个发光装置的显示面板。 网状屏蔽图案设置在基板上，以便在基板上限定多个像素区域。 发光装置设置在基板上。 发光装置的至少一个发光装置配置在像素区域的各像素区域中，像素区域的面积为A1，发光装置的面积为A2，A2的比例 到A1低于50％。
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公开(公告)号：US20130214302A1
公开(公告)日：2013-08-22
申请号：US13762395
申请日：2013-02-08
Applicant: Industrial Technology Research Institute
Inventor： Wen-Yung Yeh , Kuo-Tung Tiao , Chia-Hsin Chao , Hsi-Hsuan Yen , Ming-Hsien Wu , Jui-Ying Lin , Ying-Chien Chu
IPC: H01L33/48
CPC classification number: H01L33/48 , F21K9/90 , F21Y2113/20 , F21Y2115/10 , H01L24/95 , H01L25/0753 , H01L33/20 , H01L33/483 , H01L33/60 , H01L2224/95136 , H01L2924/12041 , H01L2924/00
Abstract: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.
Abstract translation: 发光元件的制造方法。 提供基板。 多个第一凹部和多个第二凹部形成在基板上，其中每个第一凹部的体积与每个第二凹部的体积不同。 提供了多个第一发光二极管芯片和多个第二发光二极管芯片，其中每个第一发光二极管芯片的体积对应于每个第一凹部的体积，并且每个第二发光二极管芯片的体积 对应于每个第二凹部的体积。 将第一发光二极管芯片移动到基板上，使得第一发光二极管芯片进入第一凹部，并且将第二发光二极管芯片移动到基板上，使得第二发光二极管芯片进入第一凹部 。
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公开(公告)号：US09281451B2
公开(公告)日：2016-03-08
申请号：US13762395
申请日：2013-02-08
Applicant: Industrial Technology Research Institute
Inventor： Wen-Yung Yeh , Kuo-Tung Tiao , Chia-Hsin Chao , Hsi-Hsuan Yen , Ming-Hsien Wu , Jui-Ying Lin , Ying-Chien Chu
IPC: H01L33/48 , H01L25/075 , H01L23/00 , H01L33/20 , H01L33/60 , F21K99/00 , F21Y101/02 , F21Y113/02
CPC classification number: H01L33/48 , F21K9/90 , F21Y2113/20 , F21Y2115/10 , H01L24/95 , H01L25/0753 , H01L33/20 , H01L33/483 , H01L33/60 , H01L2224/95136 , H01L2924/12041 , H01L2924/00
Abstract: A fabricating method of light emitting element. A substrate is provided. A plurality of first concaves and a plurality of second concaves are formed on the substrate, wherein a volume of each first concave is different from a volume of each second concave. A plurality of first light emitting diode chips and a plurality of second light emitting diode chips are provided, wherein a volume of each first light emitting diode chip is corresponding to the volume of each first concave, and a volume of each second light emitting diode chip is corresponding to the volume of each second concave. The first light emitting diode chips are moved onto the substrate such that the first light emitting diode chips go into the first concaves, and the second light emitting diode chips are moved onto the substrate such that the second light emitting diode chips go into the first concaves.
Abstract translation: 发光元件的制造方法。 提供基板。 多个第一凹部和多个第二凹部形成在基板上，其中每个第一凹部的体积与每个第二凹部的体积不同。 提供了多个第一发光二极管芯片和多个第二发光二极管芯片，其中每个第一发光二极管芯片的体积对应于每个第一凹部的体积，并且每个第二发光二极管芯片的体积 对应于每个第二凹部的体积。 将第一发光二极管芯片移动到基板上，使得第一发光二极管芯片进入第一凹部，并且将第二发光二极管芯片移动到基板上，使得第二发光二极管芯片进入第一凹部 。
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公开(公告)号：US20160020578A1
公开(公告)日：2016-01-21
申请号：US14864810
申请日：2015-09-24
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Yen-Hsiang Fang , Chia-Hsin Chao , Yao-Jun Tsai , Yi-Chen Lin
CPC classification number: H01L23/481 , G02B6/12 , G02B6/34 , G02B2006/12061 , H01L21/30604 , H01L21/486 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L23/60 , H01L24/05 , H01L24/06 , H01L24/08 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/80 , H01L25/167 , H01L27/0255 , H01L29/861 , H01L33/20 , H01L33/62 , H01L2224/04 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/06102 , H01L2224/08148 , H01L2224/08238 , H01L2224/16148 , H01L2224/16238 , H01L2224/29294 , H01L2224/32148 , H01L2224/32238 , H01L2224/48091 , H01L2224/48105 , H01L2224/48148 , H01L2224/48229 , H01L2224/73265 , H01L2224/80801 , H01L2224/80805 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83805 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1434 , H01L2933/0066 , H01S5/0208 , H01S5/02469 , H01S5/026 , H01S5/34 , H01L2924/00 , H01L2224/80 , H01L2924/00012 , H01L2224/45099
Abstract: A semiconductor laser structure is provided. The semiconductor laser comprises a central thermal shunt, a ring shaped silicon waveguide, a contiguous thermal shunt, an adhesive layer and a laser element. The central thermal shunt is located on a SOI substrate which has a buried oxide layer surrounding the central thermal shunt. The ring shaped silicon waveguide is located on the buried oxide layer and surrounds the central thermal shunt. The ring shaped silicon waveguide includes a P-N junction of a p-type material portion, an n-type material portion and a depletion region there between. The contiguous thermal shunt covers a portion of the buried oxide layer and surrounds the ring shaped silicon waveguide. The adhesive layer covers the ring shaped silicon waveguide and the buried oxide layer. The laser element covers the central thermal shunt, the adhesive layer and the contiguous thermal shunt.
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公开(公告)号：US20140217955A1
公开(公告)日：2014-08-07
申请号：US14197229
申请日：2014-03-05
Applicant: Industrial Technology Research Institute
Inventor： Jui-Ying Lin , Mu-Tao Chu , Yu-Chen Yu , Wen-Yih Liao , Ming-Hsien Wu
CPC classification number: H02J50/30 , H02J5/005 , H02J7/025 , H02J7/34 , H02J7/35 , H02J17/00 , H02J50/20 , H02J50/40 , Y02E10/766
Abstract: A charge apparatus including a natural energy conversion module, an energy converter, an energy transmitter, an energy receiver, and an electricity storage device is provided. The natural energy conversion module receives the natural energy and converts the natural energy into a first electric energy. The energy converter is electrically connected to the natural energy conversion module and converts the first electric energy into a wireless energy. The energy transmitter is electrically connected to the energy converter and transmits the wireless energy. The energy receiver receives the wireless energy and converts the wireless energy into a second electric energy to charge an external apparatus. The energy transmitter monitors the current charge status of the external apparatus so as to adjust transmitting the wireless energy. The electricity storage device is electrically connected to the natural energy conversion module to store the first electric energy.
Abstract translation: 提供了包括自然能量转换模块，能量转换器，能量发射器，能量接收器和蓄电装置的充电装置。 天然能量转换模块接收天然能量并将天然能量转化为第一电能。 能量转换器电连接到自然能量转换模块，并将第一电能转换为无线能量。 能量发射器电连接到能量转换器并传输无线能量。 能量接收器接收无线能量并将无线能量转换成第二电能以对外部设备充电。 能量发射器监视外部设备的当前充电状态，以便调整传输无线电能。 蓄电装置电连接到自然能转换模块以存储第一电能。
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