公开(公告)号：US10141199B2

公开(公告)日：2018-11-27

申请号：US15251058

申请日：2016-08-30

Applicant: Infineon Technologies AG

Inventor： Charles Rimbert-Riviere ,  Jean-Laurent Deborde ,  Martin Haller ,  Nils Alexander Sanetra ,  Vasile Vartolomei

IPC: B23K1/19 ,  H01L21/48 ,  B23K1/00 ,  H01L23/373 ,  H01L23/00 ,  B23K103/00 ,  B23K101/40 ,  B23K103/12 ,  B23K103/18

Abstract: A method for soldering an insulating substrate onto a substrate mounting portion of a carrier by a predefined solder is provided. The insulating substrate includes a dielectric insulation carrier, a top side, and a bottom side opposite to the top side. The method includes selecting the insulating substrate based on a criterion which indicates that the insulating substrate, if it has the solidus temperature of the solder, has a positive unevenness. The insulating substrate is soldered on the bottom side to the substrate mounting portion, such that, after the soldering, the solidified solder extends continuously from the bottom side of the insulating substrate as far as the substrate mounting portion. The top side of the insulating substrate is populated with at least one semiconductor chip.

公开(公告)号：US20240404925A1

公开(公告)日：2024-12-05

申请号：US18205129

申请日：2023-06-02

Applicant: Infineon Technologies AG

Inventor： Marco Bäßler ,  Martin Haller

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01R12/58

Abstract: A molded power semiconductor package includes a mold compound having first and second opposing main surfaces and an edge between the first and second main surfaces. Power semiconductor dies are embedded in the mold compound. A metallic frame embedded in the mold compound is electrically connected to the power semiconductor dies. Pins protrude from the first main surface of the mold compound, each pin being secured to a respective contact area of the metallic frame that is exposed by an opening in the mold compound at the first main surface. One or more of the openings extends to the edge of the mold compound to form an open channel from each contact area exposed by the one or more of the openings to the edge of the mold compound. Additional package embodiments and methods of production are also described.

公开(公告)号：US20170062241A1

公开(公告)日：2017-03-02

申请号：US15251058

申请日：2016-08-30

Applicant: Infineon Technologies AG

Inventor： Charles Rimbert-Riviere ,  Jean-Laurent Deborde ,  Martin Haller ,  Nils Alexander Sanetra ,  Vasile Vartolomei

IPC: H01L21/48 ,  B23K1/19 ,  B23K1/00 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L21/4882 ,  B23K1/0016 ,  B23K1/19 ,  B23K2101/40 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/52 ,  H01L23/3735 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/3511 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: A method for soldering an insulating substrate onto a substrate mounting portion of a carrier by a predefined solder is provided. The insulating substrate includes a dielectric insulation carrier, a top side, and a bottom side opposite to the top side. The method includes selecting the insulating substrate based on a criterion which indicates that the insulating substrate, if it has the solidus temperature of the solder, has a positive unevenness. The insulating substrate is soldered on the bottom side to the substrate mounting portion, such that, after the soldering, the solidified solder extends continuously from the bottom side of the insulating substrate as far as the substrate mounting portion. The top side of the insulating substrate is populated with at least one semiconductor chip.

Abstract translation: 提供了通过预定的焊料将绝缘基板焊接到载体的基板安装部分上的方法。 绝缘基板包括介电绝缘载体，顶侧和与顶侧相对的底侧。 该方法包括基于表示绝缘基板（如果其具有焊料的固相线温度）具有正的不均匀性的标准来选择绝缘基板。 绝缘基板在底侧被焊接到基板安装部分，使得在焊接之后，固化的焊料从绝缘基板的底侧连续延伸到基板安装部分。 绝缘基板的顶面上装有至少一个半导体芯片。