公开(公告)号：US11815414B2

公开(公告)日：2023-11-14

申请号：US17348940

申请日：2021-06-16

Applicant: Infineon Technologies AG

Inventor： Emanuel Stoicescu ,  Matthias Boehm ,  Stefan Jahn ,  Erhard Landgraf ,  Michael Weber ,  Janis Weidenauer

IPC: G01L19/14 ,  H01L23/053 ,  G01L19/00 ,  H01L21/56 ,  H01L23/24 ,  H01L23/495 ,  H01L23/60 ,  H01L23/00

CPC classification number: G01L19/147 ,  G01L19/0061 ,  H01L21/56 ,  H01L23/053 ,  H01L23/24 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/60 ,  H01L24/45 ,  H01L2224/4813 ,  H01L2224/4848 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

公开(公告)号：US11287344B2

公开(公告)日：2022-03-29

申请号：US16896628

申请日：2020-06-09

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L9/12 ,  G01L19/14 ,  G01L19/00

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

公开(公告)号：US20160169763A1

公开(公告)日：2016-06-16

申请号：US14945661

申请日：2015-11-19

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L19/00 ,  G01L9/00

CPC classification number: G01L19/0084 ,  G01L19/147 ,  G01L19/148

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

Abstract translation: 公开了一种包括壳体，压力传感器芯片以及集成无源器件（IDP）芯片和分立无源器件中的一个或多个的压力传感器模块。 压力传感器芯片和一个或多个IPD芯片和分立无源器件布置在壳体内。

公开(公告)号：US11659345B2

公开(公告)日：2023-05-23

申请号：US17518108

申请日：2021-11-03

Applicant: Infineon Technologies AG

Inventor： Victor Popescu-Stroe ,  Matthias Boehm

IPC: H04R29/00 ,  H04R1/04 ,  H04R1/08 ,  H04R3/00

CPC classification number: H04R29/004 ,  H04R1/04 ,  H04R1/08 ,  H04R3/005 ,  H04R2420/09

Abstract: A method includes providing a first data channel configured for a transmission of acoustic data between a first microphone and a controller, providing a second data channel configured for a transmission of acoustic data between a second microphone and the controller, and transmitting non-acoustic data generated by the first microphone via the second data channel.

公开(公告)号：US11067466B2

公开(公告)日：2021-07-20

申请号：US16159918

申请日：2018-10-15

Applicant: Infineon Technologies AG

Inventor： Emanuel Stoicescu ,  Matthias Boehm ,  Stefan Jahn ,  Erhard Landgraf ,  Michael Weber ,  Janis Weidenauer

IPC: G01L19/14 ,  H01L23/053 ,  G01L19/00 ,  H01L21/56 ,  H01L23/24 ,  H01L23/495 ,  H01L23/60 ,  H01L23/00

Abstract: A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.

公开(公告)号：US20200370983A1

公开(公告)日：2020-11-26

申请号：US16896628

申请日：2020-06-09

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L19/00 ,  G01L19/14

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

公开(公告)号：US20180364123A1

公开(公告)日：2018-12-20

申请号：US16114543

申请日：2018-08-28

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L19/00 ,  G01L19/14

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

公开(公告)号：US11832070B2

公开(公告)日：2023-11-28

申请号：US17552817

申请日：2021-12-16

Applicant: Infineon Technologies AG

Inventor： Victor Popescu-Stroe ,  Matthias Boehm

IPC: H04R3/00 ,  H04R1/40 ,  G10L21/0216

CPC classification number: H04R3/005 ,  G10L21/0216 ,  H04R1/406 ,  G10L2021/02166 ,  H04R2499/13

Abstract: A microphone device includes a number N of at least two serially coupled microphones forming a microphone chain. The microphones are configured to transmit data to a controller via the microphone chain. The microphone chain is configured to output time-multiplexed data transmitted by the microphones.

公开(公告)号：US11506560B2

公开(公告)日：2022-11-22

申请号：US16271090

申请日：2019-02-08

Applicant: Infineon Technologies AG

Inventor： Victor Popescu-Stroe ,  Emanuel Stoicescu ,  Matthias Boehm ,  Constantin Crisu ,  Uwe Fakesch ,  Stefan Jahn ,  Erhard Landgraf ,  Janis Weidenauer ,  Bernhard Winkler

IPC: G01L19/04 ,  G01L27/00

Abstract: Examples provide for an apparatus, method, and computer program for comparing the output of sensor cells in an arrangement of sensor cells in an area A, including a set of at least two measurement units. A measurement unit includes at least two sensor cells, wherein at least one sensor cell of at least one measurement unit includes a sensitive sensor cell, which is sensitive with respect to a measured quantity. The sensor cells are intermixed with each other. The apparatus further includes means for selecting output signals of sensor cells of the arrangement and means for determining a measured quantity or determining an intact sensor cell by comparing output signals of different measurement units.

公开(公告)号：US10677675B2

公开(公告)日：2020-06-09

申请号：US16114543

申请日：2018-08-28

Applicant: Infineon Technologies AG

Inventor： Mathias Vaupel ,  Matthias Boehm ,  Steven Gross ,  Markus Loehndorf ,  Stephan Schmitt ,  Horst Theuss ,  Helmut Wietschorke

IPC: G01L9/12 ,  G01L19/14 ,  G01L19/00

Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.