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公开(公告)号:US20220402752A1
公开(公告)日:2022-12-22
申请号:US17351865
申请日:2021-06-18
Applicant: Infineon Technologies AG
Inventor: Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz
Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
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2.
公开(公告)号:US20210385584A1
公开(公告)日:2021-12-09
申请号:US17354412
申请日:2021-06-22
Applicant: Infineon Technologies AG
Inventor: Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz , Pradyumna Mishra , Daniel Neumaier , David Tumpold
Abstract: A combined MicroElectroMechanical structure (MEMS) includes a first piezoelectric membrane having one or more first electrodes, the first piezoelectric membrane being affixed between a first holder and a second holder; and a second piezoelectric membrane having an inertial mass and one or more second electrodes, the second piezoelectric membrane being affixed between the second holder and a third holder.
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公开(公告)号:US20230294976A1
公开(公告)日:2023-09-21
申请号:US18065978
申请日:2022-12-14
Applicant: Infineon Technologies AG
Inventor: Abhiraj Basavanna , Somu Goswami , Andreas Bogner
CPC classification number: B81B3/0072 , B81C1/00666 , B81B2201/0235 , B81B2201/0264 , B81B2201/0285 , B81B2203/0127
Abstract: A semiconductor device for use in a sensor device has a deformable membrane for the measurement of an acceleration, a vibration, or a pressure. The semiconductor device includes a deformable membrane having a membrane border; a structure holding the deformable membrane in correspondence of the membrane border; at least one electric contact to obtain an electric signal indicative of deformation of the deformable membrane; and mass elements suspended from the membrane.
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4.
公开(公告)号:US11693021B2
公开(公告)日:2023-07-04
申请号:US17354412
申请日:2021-06-22
Applicant: Infineon Technologies AG
Inventor: Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz , Pradyumna Mishra , Daniel Neumaier , David Tumpold
IPC: G01P15/08 , G01P15/09 , G01P15/18 , G01H11/08 , H10N30/30 , B81B3/00 , H04R17/02 , H04R1/28 , H04R1/04 , H04R7/18 , H04R17/10
CPC classification number: G01P15/0802 , G01H11/08 , G01P15/09 , G01P15/18 , H04R1/28 , H04R17/02 , H10N30/302 , H10N30/308 , B81B3/0021 , B81B2201/0235 , B81B2201/0257 , B81B2203/0127 , G01P2015/084 , H04R1/04 , H04R7/18 , H04R17/10 , H04R2201/003
Abstract: A MEMS vibration sensor includes a piezoelectric membrane including a segmented electrode affixed to a holder; and an inertial mass affixed to the piezoelectric membrane, wherein the segmented electrode includes four segmentation zones, wherein, in an X-direction, a signal from a first segmentation zone is equal to a signal from a third segmentation zone, a signal from a second segmentation zone is equal to a signal from a fourth segmentation zone, and the signal from the first segmentation zone and the signal from the second segmentation zone have opposite signs, and wherein, in a Y-direction, a signal from the first segmentation zone is equal to the signal from the second segmentation zone, the signal from the third segmentation zone is equal to the signal from the fourth segmentation zone, and the signal from first segmentation zone and the signal from the third segmentation zone have opposite signs.
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公开(公告)号:US11691871B2
公开(公告)日:2023-07-04
申请号:US17351865
申请日:2021-06-18
Applicant: Infineon Technologies AG
Inventor: Somu Goswami , Christian Bretthauer , Matthias Friedrich Herrmann , Gunar Lorenz
CPC classification number: B81B7/008 , H04R3/002 , B81B2201/0257 , B81B2201/0285 , H04R2201/003
Abstract: A MEMS vibration sensor includes a membrane having an inertial mass, the membrane being affixed to a holder of the MEMS vibration sensor; and a segmented backplate spaced apart from the membrane, the segmented backplate being affixed to the holder.
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