公开(公告)号：US09899282B2

公开(公告)日：2018-02-20

申请号：US15148144

申请日：2016-05-06

Applicant: Infineon Technologies Americas Corp.

Inventor： Wayne Partington

IPC: H01L23/057 ,  H01L23/24 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L23/42 ,  H05K1/02 ,  H01L25/16 ,  H01L25/18 ,  H05K1/11

CPC classification number: H01L23/057 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49838 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/162 ,  H01L25/18 ,  H05K1/0216 ,  H05K1/117 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10371 ,  H05K2201/10424

Abstract: A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon, a metallic case covering the suspended substrate, the suspended substrate being supported by a plurality of mechanical leads on opposing sides of the semiconductor package, at least one of the plurality of mechanical leads having a coefficient of thermal expansion (CTE) that substantially matches a CTE of the suspended substrate, where at least one of the plurality of mechanical leads is electrically connected to the suspended substrate, and where the plurality of mechanical leads absorb mechanical shocks so as to prevent damage to the semiconductor package. The semiconductor package also includes a thermal gel between the suspended substrate and the metallic case. The suspended substrate can be a printed circuit board. The metallic case includes mounting ears for transferring heat away from the semiconductor package.

公开(公告)号：US09887143B2

公开(公告)日：2018-02-06

申请号：US15081055

申请日：2016-03-25

Applicant: Infineon Technologies Americas Corp.

Inventor： Wayne Partington ,  Shunhe Xiong

IPC: H01L23/48 ,  H01L21/00 ,  H05K7/10 ,  H01L23/055 ,  H01L23/498 ,  H01L23/06 ,  H01L23/00 ,  H01L23/58

CPC classification number: H01L23/055 ,  H01L23/045 ,  H01L23/06 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/562 ,  H01L23/585 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85466 ,  H01L2224/85484 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01403 ,  H01L2924/01404 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/10344 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor package for mounting to a printed circuit board (PCB) includes a case comprising a ceramic base, a semiconductor die in the case, a mounting pad under the ceramic base and coupled to the semiconductor die through at least one opening in the ceramic base. The mounting pad includes at least one layer having a coefficient of thermal expansion (CTE) approximately matching a CTE of the ceramic base. The mounting pad includes at least one layer having a low-yield strength of equal to or less than 200 MPa. The mounting pad includes at least one copper layer and at least one molybdenum layer. The semiconductor package also includes a bond pad coupled to another mounting pad under the ceramic base through a conductive slug in the ceramic base.

公开(公告)号：US20170278764A1

公开(公告)日：2017-09-28

申请号：US15081055

申请日：2016-03-25

Applicant: Infineon Technologies Americas Corp.

Inventor： Wayne Partington ,  Shunhe Xiong

IPC: H01L23/055 ,  H01L23/58 ,  H01L23/00 ,  H01L23/498 ,  H01L23/06

CPC classification number: H01L23/055 ,  H01L23/045 ,  H01L23/06 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/562 ,  H01L23/585 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85466 ,  H01L2224/85484 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01403 ,  H01L2924/01404 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/10344 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/16195 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor package for mounting to a printed circuit board (PCB) includes a case comprising a ceramic base, a semiconductor die in the case, a mounting pad under the ceramic base and coupled to the semiconductor die through at least one opening in the ceramic base. The mounting pad includes at least one layer having a coefficient of thermal expansion (CTE) approximately matching a CTE of the ceramic base. The mounting pad includes at least one layer having a low-yield strength of equal to or less than 200 MPa. The mounting pad includes at least one copper layer and at least one molybdenum layer. The semiconductor package also includes a bond pad coupled to another mounting pad under the ceramic base through a conductive slug in the ceramic base.

公开(公告)号：US20170025319A1

公开(公告)日：2017-01-26

申请号：US15148144

申请日：2016-05-06

Applicant: Infineon Technologies Americas Corp.

Inventor： Wayne Partington

IPC: H01L23/057 ,  H01L23/00 ,  H01L25/07 ,  H01L23/498 ,  H01L25/065 ,  H01L23/24 ,  H01L23/367

CPC classification number: H01L23/057 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49838 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/162 ,  H01L25/18 ,  H05K1/0216 ,  H05K1/117 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10371 ,  H05K2201/10424

Abstract: A semiconductor package includes a suspended substrate having one or more semiconductor devices thereon, a metallic case covering the suspended substrate, the suspended substrate being supported by a plurality of mechanical leads on opposing sides of the semiconductor package, at least one of the plurality of mechanical leads having a coefficient of thermal expansion (CTE) that substantially matches a CTE of the suspended substrate, where at least one of the plurality of mechanical leads is electrically connected to the suspended substrate, and where the plurality of mechanical leads absorb mechanical shocks so as to prevent damage to the semiconductor package. The semiconductor package also includes a thermal gel between the suspended substrate and the metallic case. The suspended substrate can be a printed circuit board. The metallic case includes mounting ears for transferring heat away from the semiconductor package.

Abstract translation: 半导体封装包括其上具有一个或多个半导体器件的悬置衬底，覆盖悬置衬底的金属壳体，悬置衬底由半导体封装相对侧上的多个机械引线支撑，多个机械 具有基本上与悬浮基板的CTE匹配的热膨胀系数（CTE）的引线，其中多个机械引线中的至少一个电连接到悬置的基板，并且其中多个机械引线吸收机械冲击，以便 以防止损坏半导体封装。 半导体封装还包括在悬置基板和金属外壳之间的热凝胶。 悬挂的基板可以是印刷电路板。 金属外壳包括用于将热量从半导体封装传递的安装耳。