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    Electronic devices having multiple alignment layers
    1.
    发明授权
    Electronic devices having multiple alignment layers 有权

    公开(公告)号：US12222605B2

    公开(公告)日：2025-02-11

    申请号：US18512050

    申请日：2023-11-17

    Applicant: InnoLux Corporation

    Inventor： Jen-Hai Chi ,  Chean Kee

    IPC: G02F1/1337 ,  G02F1/1333 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347

    Abstract: An electronic device includes a first substrate, a second substrate on the first substrate, a third substrate between the first substrate and the second substrate, a first optical media layer between the first substrate and the third substrate, and a second optical media layer between the second substrate and the third substrate. A sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion. Another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion.

    ELECTRONIC DEVICES HAVING MULTIPLE ALIGNMENT LAYERS
    2.
    发明申请
    ELECTRONIC DEVICES HAVING MULTIPLE ALIGNMENT LAYERS 有权

    公开(公告)号：US20250138369A1

    公开(公告)日：2025-05-01

    申请号：US19007586

    申请日：2025-01-02

    Applicant: InnoLux Corporation

    Inventor： Jen-Hai Chi ,  Chean Kee

    IPC: G02F1/1337 ,  G02F1/1333 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347

    Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, a third substrate disposed between the first substrate and the second substrate, an optical media layer disposed between the first substrate and the third substrate, and a first glue disposed between the second substrate and the third substrate. In a cross-sectional view of the electronic device, a sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion, and another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion opposite to the recessed portion.

    Bonding pad structure
    3.
    发明授权
    Bonding pad structure 有权

    公开(公告)号：US11406015B2

    公开(公告)日：2022-08-02

    申请号：US16884323

    申请日：2020-05-27

    Applicant: InnoLux Corporation

    Inventor： Yu-Ting Liu ,  Yeong-E Chen ,  Chean Kee

    IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

    Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

    ELECTRONIC DEVICES HAVING MULTIPLE ALIGNMENT LAYERS
    5.
    发明申请
    ELECTRONIC DEVICES HAVING MULTIPLE ALIGNMENT LAYERS 有权

    公开(公告)号：US20230004033A1

    公开(公告)日：2023-01-05

    申请号：US17942191

    申请日：2022-09-12

    Applicant: InnoLux Corporation

    Inventor： Jen-Hai Chi ,  Chean Kee

    IPC: G02F1/1337 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347 ,  G02F1/1333

    Abstract: A method for forming an electronic device including two stacked liquid crystal cells is disclosed. A first liquid crystal cell including two substrates is provided. A second liquid crystal cell is formed by disposing another substrate to one of the substrates of the first liquid crystal cell. Subsequently, a cutting step is performed to cut off unnecessary portions of the substrates of the first liquid crystal cell and the second liquid crystal cell. Before bonding the another substrate, a pre-cutting step is performed to form at least a pre-cutting mark on the substrate on which the another substrate is bonded in order to facilitate removal of unnecessary portions of the substrates.

    Bonding pad structure
    6.
    发明授权
    Bonding pad structure 有权

    公开(公告)号：US12075566B2

    公开(公告)日：2024-08-27

    申请号：US17851246

    申请日：2022-06-28

    Applicant: InnoLux Corporation

    Inventor： Yu-Ting Liu ,  Yeong-E Chen ,  Chean Kee

    IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/113 ,  H05K1/028 ,  H05K1/11 ,  H05K1/18 ,  H05K2201/0338 ,  H05K2201/10128

    Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

    Electronic devices having multiple alignment layers
    8.
    发明授权
    Electronic devices having multiple alignment layers 有权

    公开(公告)号：US11474398B2

    公开(公告)日：2022-10-18

    申请号：US15931594

    申请日：2020-05-14

    Applicant: InnoLux Corporation

    Inventor： Jen-Hai Chi ,  Chean Kee

    IPC: G02F1/1337 ,  G02F1/1339 ,  G02F1/1343 ,  G02F1/1347 ,  G02F1/1333

    Abstract: An electronic device includes a first substrate, a second substrate disposed opposite to the first substrate, and a third substrate disposed between the first substrate and the second substrate, wherein the third substrate has a first surface closer to the first substrate and a second surface closer to the second substrate. A first alignment layer having a first alignment direction is disposed on a surface of the first substrate. A second alignment layer is disposed on a surface of the second substrate. A third alignment layer having a third alignment direction is disposed on a first surface of the third substrate, and a fourth alignment layer is disposed on the second surface of the third substrate. The third alignment direction is perpendicular to the first alignment direction.

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