公开(公告)号：US12169340B2

公开(公告)日：2024-12-17

申请号：US18164000

申请日：2023-02-03

Applicant: InnoLux Corporation

Inventor： Ting-Wei Liang ,  Jiunn-Shyong Lin ,  I-An Yao ,  Tzu-Chieh Lai ,  Chung-Chun Cheng ,  Shih-Che Chen

IPC: G02F1/1343 ,  G02F1/1335 ,  G02F1/1345 ,  G02F1/1347

Abstract: An electronic device is provided. The electronic device includes a first panel. The first panel includes a first substrate, a second substrate, a liquid crystal layer, a first transparent electrode, a second transparent electrode, and a first signal line. The second substrate is opposite to the first substrate. The liquid crystal layer is disposed between the first substrate and the second substrate. The first transparent electrode is disposed between the first substrate and the liquid crystal layer. The second transparent electrode is disposed between the second substrate and the liquid crystal layer. The first signal line is electrically connected to the first transparent electrode and extending along a first direction. The impedance of the first signal line is less than the impedance of the first transparent electrode.

公开(公告)号：US20230170603A1

公开(公告)日：2023-06-01

申请号：US17975566

申请日：2022-10-27

Applicant: Innolux Corporation

Inventor： Chung-Chun Cheng ,  Chia-Chi Ho ,  Chia-Ping Tseng ,  Yan-Zheng Wu ,  Yao-Wen Hsu

IPC: H01Q1/22 ,  H01Q1/38

CPC classification number: H01Q1/2283 ,  H01Q1/38

Abstract: An electronic device including a substrate, a first metal pattern, a first insulating pattern, and a second metal pattern is provided. The first metal pattern is disposed on the substrate. The first insulating pattern is disposed on the first metal pattern. The second metal pattern is disposed on the first metal pattern and the first insulating pattern. The second metal pattern includes a first contact portion and a second contact portion. In a cross-sectional view, the first contact portion and the second contact portion are in contact with the first metal pattern, and the first insulating pattern is in contact with the first metal pattern and the second metal pattern between the first contact portion and the second contact portion.

公开(公告)号：US11798875B2

公开(公告)日：2023-10-24

申请号：US17535167

申请日：2021-11-24

Applicant: InnoLux Corporation

Inventor： Chung-Chun Cheng ,  Kuang-Ming Fan ,  Yao-Wen Hsu

IPC: H05K1/11 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L24/19 ,  H01L24/20 ,  H05K1/11 ,  H05K1/111 ,  H01L23/49822 ,  H01L2224/19 ,  H01L2224/214 ,  H05K1/0268 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/09372

Abstract: An electronic component includes: an insulating layer; and a first metal bump disposed on the insulating layer and provided with: a first metal layer disposed on the insulating layer; and a second metal layer disposed on the first metal layer, wherein, in a cross-sectional view of the electronic component, the first metal layer has a first width, the second metal layer has a second width, and the first width is smaller than the second width.