公开(公告)号：US12205854B2

公开(公告)日：2025-01-21

申请号：US18369847

申请日：2023-09-19

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Kuang-Chiang Huang ,  Yu-Ting Liu ,  Yi-Hung Lin ,  Cheng-En Cheng

IPC: H01L21/66 ,  H01L21/48 ,  H01L23/00

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.

公开(公告)号：US20250014913A1

公开(公告)日：2025-01-09

申请号：US18893927

申请日：2024-09-23

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Wen-Hsiang Liao ,  Cheng-Chi Wang ,  Yi-Chen Chou ,  Fuh-Tsang Wu ,  Ker-Yih Kao

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/48 ,  H01L23/31

Abstract: An electronic device includes a wafer, a redistribution layer and a multi-layer insulating structure. The redistribution layer is disposed on the wafer. The multi-layer insulating structure is disposed between the wafer and the redistribution layer. The multi-layer insulating structure includes a first layer and a second layer. A Young's modulus of the first layer is different from a Young's modulus of the second layer.

公开(公告)号：US12095152B2

公开(公告)日：2024-09-17

申请号：US18315662

申请日：2023-05-11

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Tang-Chin Hung ,  Chia-Chi Ho ,  I-Yin Li

IPC: H01Q1/38 ,  G02B6/24 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q3/44

CPC classification number: H01Q1/36 ,  H01Q9/0407 ,  G09G2300/0876 ,  H01Q3/44

Abstract: An electronic device is provided. The electronic device includes a substrate, a conductive layer, an insulating layer, and a modulating material. The conductive layer is disposed on the substrate and has a first opening penetrating through the conductive layer. The insulating layer is disposed on the conductive layer and includes a second opening penetrating through the insulating layer. The first opening of the conductive layer and the second opening of the insulating layer are at least partially overlapped. The modulating material is disposed on the insulating layer.

公开(公告)号：US20230410731A1

公开(公告)日：2023-12-21

申请号：US18460609

申请日：2023-09-04

Applicant: Innolux Corporation

Inventor： Kazuyuki Hashimoto ,  Yi-Hung Lin ,  Kung-Chen Kuo

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/0852 ,  G09G2300/0861 ,  G09G2310/0267 ,  G09G2310/06 ,  G09G2310/08

Abstract: An electronic device is provided. The electronic device includes a pixel array, a gate driver and a bias control signal driver. The pixel array includes a pixel unit. The gate driver is configured to generate a plurality of gate control signals. The bias control signal driver is electrically connected to the pixel unit and the gate driver. The bias control signal driver is configured to generate a bias signal to drive the pixel unit according to a part of the plurality of gate control signals.

公开(公告)号：US20220305754A1

公开(公告)日：2022-09-29

申请号：US17683370

申请日：2022-03-01

Applicant: Innolux Corporation

Inventor： Chia-Chi Ho ,  Yi-Hung Lin ,  Hsiu-Yi Tsai

IPC: B32B3/30 ,  B32B3/26 ,  B32B7/12

Abstract: The disclosure provides an adjusting device having an active region and a peripheral region adjacent to the active region. The adjusting device includes a first substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer, and a sealant layer. The first insulating layer is disposed on the first conducting layer and includes a first opening disposed in the peripheral region. The second conducting layer is disposed on the first conducting layer and electrically connected to the first conducting layer through the first opening. The second insulating layer includes multiple first protruding structures disposed in the peripheral region and on the first insulating layer. The sealant layer is disposed in the peripheral region and on the second insulating layer. The first opening is disposed between two of the first protruding structures.

公开(公告)号：US20220181167A1

公开(公告)日：2022-06-09

申请号：US17523919

申请日：2021-11-11

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Wen-Hsiang Liao ,  Cheng-Chi Wang ,  Yi-Chen Chou ,  Fuh-Tsang Wu ,  Ker-Yih Kao

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/48

Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

公开(公告)号：US11152694B2

公开(公告)日：2021-10-19

申请号：US16543798

申请日：2019-08-19

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chih-Chi Chen ,  Tang-Chin Hung ,  I-Yin Li

IPC: H01Q1/36

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a second substrate, a liquid-crystal layer, a buffer layer, and an alignment layer. The first conductive layer is disposed on the first substrate, and the first conductive layer has an opening. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The buffer layer is disposed in the opening and adjacent to an overlapping region of the first conductive layer and the second conductive layer. The alignment layer is disposed between the first conductive layer and the liquid-crystal layer.

公开(公告)号：US11139562B2

公开(公告)日：2021-10-05

申请号：US16546504

申请日：2019-08-21

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Tang-Chin Hung ,  Chia-Chi Ho ,  I-Yin Li

IPC: H01Q1/38 ,  H01Q1/36 ,  H01Q9/04 ,  H01Q3/44

Abstract: An antenna device is provided. The antenna device includes a first substrate, a first conductive layer, a first insulating structure, a second substrate, a second conductive layer and a liquid-crystal layer. The first conductive layer is disposed on the first substrate. The first insulating structure is disposed on the first conductive layer, and the first insulating structure includes a first region and a second region. The second substrate is disposed opposite to the first substrate. The second conductive layer is disposed on the second substrate. The liquid-crystal layer is disposed between the first conductive layer and the second conductive layer. The thickness of the first region is less than the thickness of the second region, and at least a portion of the first region is disposed in an overlapping region of the first conductive layer and the second conductive layer.

公开(公告)号：US10903559B2

公开(公告)日：2021-01-26

申请号：US16047127

申请日：2018-07-27

Applicant: InnoLux Corporation

Inventor： Yi-Hung Lin ,  Chin-Lung Ting ,  Hui-Min Huang ,  Tang-Chin Hung

IPC: H01Q1/36 ,  H01Q1/40 ,  H01Q9/04 ,  H01Q3/34

Abstract: A method for manufacturing a liquid-crystal antenna device is provided. The method includes step (a) providing a first mother substrate. The first mother substrate includes a first region and a second region. The first region has a plurality of first sides. An extension line of at least one of the first sides divides the second region into a first part and a second part. The method also includes the following steps: (b) forming a first electrode layer on the first region and the second region, and (c) cutting the first mother substrate along the first sides of the first region.

公开(公告)号：US20190035715A1

公开(公告)日：2019-01-31

申请号：US16018003

申请日：2018-06-25

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.