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公开(公告)号:US12294368B2
公开(公告)日:2025-05-06
申请号:US17485119
申请日:2021-09-24
Applicant: Intel Corporation
Inventor: Rahul Pal , Dheeraj Subbareddy , Mahesh Kumashikar , Dheemanth Nagaraj , Rajesh Vivekanandham , Anshuman Thakur , Ankireddy Nalamalpu , Md Altaf Hossain , Atul Maheshwari
IPC: H03K19/177 , G06F15/78 , G06F30/34 , H03K19/17758 , H03K19/17796 , H03K19/08
Abstract: The present disclosure is directed to 3-D stacked architecture for Programmable Fabrics and Central Processing Units (CPUs). The 3-D stacked orientation enables reconfigurability of the fabric, and allows the fabric to function using coarse-grained and fine-grained acceleration for offloading CPU processing. Additionally, the programmable fabric may be able to function to interface with multiple other compute chiplet components in the 3-D stacked orientation. This enables multiple compute components to communicate without the need for offloading the data communications between the compute chiplets.
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公开(公告)号:US12206410B2
公开(公告)日:2025-01-21
申请号:US18169988
申请日:2023-02-16
Applicant: Intel Corporation
Inventor: Dheeraj Subbareddy , Md Altaf Hossain , Ankireddy Nalamalpu , Robert Sankman , Ravindranath Mahajan , Gregg William Baeckler
IPC: H03K19/1776 , H01L23/367 , H01L25/18
Abstract: A programmable device may have logic circuitry formed in a top die and memory and specialized processing blocks formed in a bottom die, where the top die is stacked directly on top of the bottom die in a face-to-face configuration. The logic circuitry may include logic sectors, logic array blocks, logic elements, and other types of logic regions. The memory blocks may include large banks of multiport memory for storing data. The specialized processing blocks may include multipliers, adders, and other arithmetic components. The logic circuitry may access the memory and specialized processing blocks via an address encoded scheme. Configured in this way, the maximum operating frequency of the programmable device can be optimized such that critical paths will no longer need to traverse any unused memory and specialized processing blocks.
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公开(公告)号:US11901299B2
公开(公告)日:2024-02-13
申请号:US18079753
申请日:2022-12-12
Applicant: Intel Corporation
Inventor: Md Altaf Hossain , Ankireddy Nalamalpu , Dheeraj Subbareddy , Robert Sankman , Ravindranath V. Mahajan , Debendra Mallik , Ram S. Viswanath , Sandeep B. Sane , Sriram Srinivasan , Rajat Agarwal , Aravind Dasu , Scott Weber , Ravi Gutala
IPC: H01L23/538 , H01L25/18 , H01L23/00 , H01L23/48
CPC classification number: H01L23/5385 , H01L23/5386 , H01L24/16 , H01L24/17 , H01L25/18 , H01L23/481 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2924/381
Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.
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公开(公告)号:US11714941B2
公开(公告)日:2023-08-01
申请号:US17392218
申请日:2021-08-02
Applicant: Intel Corporation
Inventor: Chee Hak Teh , Ankireddy Nalamalpu , Md Altaf Hossain , Dheeraj Subbareddy , Sean R. Atsatt , Lai Guan Tang
IPC: G06F30/34 , H03K19/17736 , H04L12/43 , G06F15/78 , H03K19/17796
CPC classification number: G06F30/34 , G06F15/7825 , H03K19/17744 , H03K19/17796 , H04L12/43
Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.
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公开(公告)号:US20230049681A1
公开(公告)日:2023-02-16
申请号:US17973428
申请日:2022-10-25
Applicant: Intel Corporation
Inventor: Jeffrey Chromczak , Chooi Pei Lim , Lai Guan Tang , Chee Hak Teh , MD Altaf Hossain , Dheeraj Subbareddy , Ankireddy Nalamalpu
IPC: G06F1/10 , H01L23/31 , H01L23/00 , H01L23/538
Abstract: An integrated circuit die includes input buffer circuits that are enabled during an input mode of operation in response to first control signals to transmit input signals into the integrated circuit die from conductive bumps. Each of the input buffer circuits is coupled to one of the conductive bumps. The integrated circuit die also includes output buffer circuits that are each coupled to one of the conductive bumps. The output buffer circuits are enabled during an output mode of operation in response to second control signals to transmit output signals from the integrated circuit die to the conductive bumps. The input buffer circuits are disabled from transmitting signals during the output mode of operation in response to the first control signals. The output buffer circuits are disabled from transmitting signals during the input mode of operation in response to the second control signals.
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公开(公告)号:US20210013887A1
公开(公告)日:2021-01-14
申请号:US17033524
申请日:2020-09-25
Applicant: Intel Corporation
Inventor: Sharath Raghava , Ankireddy Nalamalpu , Dheeraj Subbareddy , Harsha Gupta , James Ball , Kavitha Prasad , Sean R. Atsatt
IPC: H03K19/17736 , H03K19/17796 , H04L12/24
Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.
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公开(公告)号:US20200226313A1
公开(公告)日:2020-07-16
申请号:US16833122
申请日:2020-03-27
Applicant: Intel Corporation
Inventor: Chee Hak Teh , Ankireddy Nalamalpu , MD Altaf Hossain , Dheeraj Subbareddy , Sean R. Atsatt , Lai Guan Tang
IPC: G06F30/34 , H03K19/17736 , H04L12/43 , G06F15/78 , H03K19/17796
Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.
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公开(公告)号:US20200186149A1
公开(公告)日:2020-06-11
申请号:US16788760
申请日:2020-02-12
Applicant: Intel Corporation
Inventor: Dheeraj Subbareddy , MD Altaf Hossain , Ankireddy Nalamalpu , Robert Sankman , Ravindranath Mahajan , Gregg William Baeckler
IPC: H03K19/1776 , H01L25/18 , H01L23/367
Abstract: A programmable device may have logic circuitry formed in a top die and memory and specialized processing blocks formed in a bottom die, where the top die is stacked directly on top of the bottom die in a face-to-face configuration. The logic circuitry may include logic sectors, logic array blocks, logic elements, and other types of logic regions. The memory blocks may include large banks of multiport memory for storing data. The specialized processing blocks may include multipliers, adders, and other arithmetic components. The logic circuitry may access the memory and specialized processing blocks via an address encoded scheme. Configured in this way, the maximum operating frequency of the programmable device can be optimized such that critical paths will no longer need to traverse any unused memory and specialized processing blocks.
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公开(公告)号:US10649927B2
公开(公告)日:2020-05-12
申请号:US16211868
申请日:2018-12-06
Applicant: Intel Corporation
Inventor: Sharath Raghava , Dheeraj Subbareddy , Kavitha Prasad , Ankireddy Nalamalpu , Harsha Gupta
Abstract: A central processing unit (CPU) may be directly coupled to an accelerator dual in-line memory module (DIMM) card that is plugged into a DIMM slot. The CPU may include a master memory controller that sends requests or offloads tasks to the accelerator DIMM card via a low-latency double data rate (DDR) interface. The acceleration DIMM card may include a slave memory controller for translating the received requests, a decoder for decoding the translated requests, control circuitry for orchestrating the data flow within the DIMM card, hardware acceleration resources that can be dynamically programmed to support a wide variety of custom functions, and input-output components for interfacing with various types of non-volatile and/or volatile memory and for connecting with other types of storage and processing devices.
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公开(公告)号:US20190138680A1
公开(公告)日:2019-05-09
申请号:US16235933
申请日:2018-12-28
Applicant: Intel Corporation
Inventor: Chee Hak Teh , Ankireddy Nalamalpu , MD Altaf Hossain , Dheeraj Subbareddy , Sean R. Atsatt , Lai Guan Tang
IPC: G06F17/50 , H03K19/177 , G06F15/78 , H04L12/43
Abstract: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.
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