公开(公告)号：US11791237B2

公开(公告)日：2023-10-17

申请号：US16019899

申请日：2018-06-27

Applicant: Intel Corporation

Inventor： Peng Li ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal ,  Ken Hackenberg

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L24/29

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

公开(公告)号：US11710672B2

公开(公告)日：2023-07-25

申请号：US16504734

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Frederick W. Atadana ,  Elah Bozorg-Grayeli

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L21/50 ,  H01L21/56 ,  H01L23/42

CPC classification number: H01L23/10 ,  H01L21/50 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/16152

Abstract: Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.

公开(公告)号：US20210013117A1

公开(公告)日：2021-01-14

申请号：US16504698

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/433 ,  H01L21/48

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

公开(公告)号：US12062592B2

公开(公告)日：2024-08-13

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/538 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/16157 ,  H01L2224/16227

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US20200381332A1

公开(公告)日：2020-12-03

申请号：US16423700

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Sergio Antonio Chan Arguedas ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Peng Li

IPC: H01L23/373 ,  H01L23/367

Abstract: Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.

公开(公告)号：US11710677B2

公开(公告)日：2023-07-25

申请号：US16505052

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Elah Bozorg-Grayeli

IPC: H01L23/40 ,  H01L23/367 ,  H01L21/48 ,  F28F3/10

CPC classification number: H01L23/40 ,  F28F3/10 ,  H01L21/4882 ,  H01L23/3675 ,  F28F2230/00

Abstract: Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.

公开(公告)号：US20210013115A1

公开(公告)日：2021-01-14

申请号：US16504734

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Taylor William Gaines ,  Ken Hackenberg ,  Frederick W. Atadana ,  Elah Bozorg-Grayeli

IPC: H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L21/50

Abstract: Embodiments may relate to a microelectronic package comprising an integrated heat spreader (IHS) coupled with a package substrate. A sealant may be positioned between, and physically coupled to, the IHS and the package substrate. The sealant may at least partially extend from a footprint of the IHS. Other embodiments may be described or claimed.

公开(公告)号：US20200373220A1

公开(公告)日：2020-11-26

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US12272614B2

公开(公告)日：2025-04-08

申请号：US16423700

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Sergio Antonio Chan Arguedas ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Peng Li

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/36

Abstract: Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.

公开(公告)号：US11798861B2

公开(公告)日：2023-10-24

申请号：US16504698

申请日：2019-07-08

Applicant: Intel Corporation

Inventor： Peng Li ,  Kelly P. Lofgreen ,  Manish Dubey ,  Bamidele Daniel Falola ,  Ken Hackenberg ,  Shenavia S. Howell ,  Sergio Antonio Chan Arguedas ,  Yongmei Liu ,  Deepak Goyal

IPC: H01L23/34 ,  H01L21/48 ,  H01L23/433 ,  H01L23/367

CPC classification number: H01L23/345 ,  H01L21/4871 ,  H01L23/367 ,  H01L23/433

Abstract: Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.