公开(公告)号：US09516752B2

公开(公告)日：2016-12-06

申请号：US13846218

申请日：2013-03-18

Applicant: Intel Corporation

Inventor： Patricia A Brusso ,  Mitul B Modi ,  Carolyn R. McCormick ,  Ruben Cadena ,  Sankara J Subramanian ,  Edward L. Martin

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  G06F1/16 ,  H01L23/00

CPC classification number: H05K1/115 ,  G06F1/16 ,  H01L24/81 ,  H01L24/90 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/90 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2203/1105 ,  Y02P70/613 ,  H01L2924/00

Abstract: An underfill device and method have been are provided. Advantages of devices and methods shown include dissipation of stresses at an interface between components such as a chip package and an adjacent circuit board. Another advantage includes faster manufacturing time and ease of manufacture using underfill devices and methods shown. An underfill assembly can be pre made with conductive structures included within the underfill assembly. Steps such as flowing epoxy and curing can be eliminated or performed concurrently with other manufacturing steps.

公开(公告)号：US09704811B1

公开(公告)日：2017-07-11

申请号：US14978294

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Rajendra C. Dias ,  Joshua D Heppner ,  Mitul B Modi ,  Anna M. Prakash

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L23/60 ,  H01L21/4825 ,  H01L21/56 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49524 ,  H01L23/552 ,  H01L24/27 ,  H01L24/33 ,  H01L2224/97 ,  H01L2924/3025

Abstract: An electric device and method of fabrication of that electric device is disclosed. The electric device includes one or more electrical devices attached to a substrate. The electric device further includes one or more grounding pads attached to the substrate. The electric device further includes a perforated conductive material placed on the substrate. The electric device further includes a molding compound deposited to cover the perforated conductive material, the one or more devices, and the one or more grounding pads.