公开(公告)号：US11327050B2

公开(公告)日：2022-05-10

申请号：US15900668

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Rajesh Kumar Neerukatti ,  Naga Sivakumar Yagnamurthy ,  David C. McCoy ,  Pramod Malatkar ,  Frank P. Prieto

IPC: G01N29/44 ,  G01N29/14

Abstract: Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.

公开(公告)号：US10957656B2

公开(公告)日：2021-03-23

申请号：US16641601

申请日：2017-09-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Pramod Malatkar ,  Chia-Pin Chiu ,  Mohit Mamodia ,  Mark J. Gallina ,  Rajesh Kumar Neerukatti ,  Joseph Bautista ,  Michael Gregory Drake

IPC: H01L23/40 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

Abstract: Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.

公开(公告)号：US20190257793A1

公开(公告)日：2019-08-22

申请号：US15900668

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Rajesh Kumar Neerukatti ,  Naga Sivakumar Yagnamurthy ,  David C. McCoy ,  Pramod Malatkar ,  Frank P. Prieto

IPC: G01N29/14 ,  G01N29/44

Abstract: Disclosed herein are systems and methods for mechanical failure monitoring, detection, and classification in electronic assemblies. In some embodiments, a mechanical monitoring apparatus may include: a fixture to receive an electronic assembly; an acoustic sensor; and a computing device communicatively coupled to the acoustic sensor, wherein the acoustic sensor is to detect an acoustic emission waveform generated by a mechanical failure of the electronic assembly during testing.