公开(公告)号：US10747277B2

公开(公告)日：2020-08-18

申请号：US16226360

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Shantanu D Kulkarni ,  Gavin Sung

IPC: G06F1/20 ,  H05K7/20

Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.

公开(公告)号：US20190129480A1

公开(公告)日：2019-05-02

申请号：US16226360

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Shantanu D Kulkarni ,  Gavin Sung

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.