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公开(公告)号:US20240397662A1
公开(公告)日:2024-11-28
申请号:US18200994
申请日:2023-05-23
Applicant: Intel Corporation
Inventor: Jeff Ku , Mark McDonald , Min Suet Lim , Tongyan Zhai , Shantanu D. Kulkarni , Arnab A. Sen , Juha Paavola
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for accessories for electronic devices and removable fan cartridges for electronic devices. An example electronic device accessory includes a backplate panel removably couplable to a first chassis of a first electronic device to replace a portion of a first cover of the first chassis and removably couplable to a second chassis of a second electronic device to replace a portion of a second cover of the second chassis. The example electronic device accessory also includes a mating device to releasably couple the backplate panel to the first chassis and independently releasably couple the backplate panel to the second chassis and a fan coupled to the backplate panel. The fan is to increase a Z height of the first electronic device when the backplate panel is coupled to the first electronic device and increase a Z height of the second electronic device when the backplate panel is coupled to the second electronic device.
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公开(公告)号:US09807285B2
公开(公告)日:2017-10-31
申请号:US14668675
申请日:2015-03-25
Applicant: INTEL CORPORATION
Inventor: Amin Godil , Shantanu D. Kulkarni , Ralph Miele , Andrew Larson
IPC: H05K7/20 , H04N5/225 , B23P15/26 , G06F1/20 , H01L23/473
CPC classification number: H04N5/2252 , B23P15/26 , G06F1/20
Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to thermally couple a device comprising one or more cameras and circuitry with a housing to house the device, receive thermal energy generated by at least one of the one or more cameras and the circuitry. Further, embodiments may include transferring the thermal energy absorbed from a surface of the device to a surface of the housing and absorbing movement of the housing such that the movement of the housing does not cause substantial movement of the device.
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公开(公告)号:US11324139B2
公开(公告)日:2022-05-03
申请号:US16881409
申请日:2020-05-22
Applicant: Intel Corporation
Inventor: Sumita Basu , Shantanu D. Kulkarni , Prosenjit Ghosh , Konstantin I. Kouliachev
IPC: H05K7/20 , F28D15/02 , G06F1/20 , H05K1/02 , H01L21/48 , H01L23/427 , H01L23/538 , H05K1/18 , H05K3/00 , F28D15/04 , F28F13/16 , F28C3/08 , G06F1/16 , H05K5/00 , F28D21/00 , F21V8/00 , G02F1/1333
Abstract: An example apparatus is disclosed that includes a base and a wickless capillary driven constrained vapor bubble heat pipe carried by the base. The wickless capillary driven constrained vapor bubble heat pipe includes a capillary, and the capillary has a longitudinal axis and a cross-sectional shape orthogonal to the longitudinal axis. The cross-sectional shape includes a first curved wall, a second curved wall, a first corner between a first straight wall and a second straight wall, and a second corner between a third straight wall and a fourth straight wall.
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公开(公告)号:US20220059625A1
公开(公告)日:2022-02-24
申请号:US17520562
申请日:2021-11-05
Applicant: Intel Corporation
Inventor: Ramon C. Cancel Olmo , Evrim Binboga , Vivek Paranjape , Satish Prathaban , Shantanu D. Kulkarni , Kunjal S. Parikh , Siddhartha Saxena
Abstract: Cameras are located within the display area of a display. In-display cameras allow for thinner display bezels. In-display cameras allow for the creation of ultra-high resolution images. The ability to capture an object from multiple perspectives allows for holographic image recording and playback. Multiple views of an image can be captured with varying depths of focus, allowing an image's depth of field to be adjusted during post processing. In-display cameras can also be used for user authentication, touch detection and three-dimensional gesture recognition. Thermal sensors located within the display area allow for control of the display temperature, improved control over system performance, and compensation for micro-LED degradation that can occur due to aging or increased temperature. Microlens assemblies located above pixels can adjust the viewing cone angle of the display or a portion of the display and microassemblies located under individual pixels or pixel arrays can adjust a viewing angle.
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公开(公告)号:US11211433B2
公开(公告)日:2021-12-28
申请号:US16866515
申请日:2020-05-04
Applicant: Intel Corporation
Inventor: Ramon C. Cancel Olmo , Evrim Binboga , Vivek Paranjape , Satish Prathaban , Shantanu D. Kulkarni , Kunjal S. Parikh , Siddhartha Saxena
Abstract: Cameras are located within the display area of a display. In-display cameras allow for thinner display bezels. In-display cameras allow for the creation of ultra-high resolution images. The ability to capture an object from multiple perspectives allows for holographic image recording and playback. Multiple views of an image can be captured with varying depths of focus, allowing an image's depth of field to be adjusted during post processing. In-display cameras can also be used for user authentication, touch detection and three-dimensional gesture recognition. Thermal sensors located within the display area allow for control of the display temperature, improved control over system performance, and compensation for micro-LED degradation that can occur due to aging or increased temperature. Microlens assemblies located above pixels can adjust the viewing cone angle of the display or a portion of the display and microassemblies located under individual pixels or pixel arrays can adjust a viewing angle.
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公开(公告)号:US20170318702A1
公开(公告)日:2017-11-02
申请号:US15392589
申请日:2016-12-28
Applicant: Intel Corporation
Inventor: Sumita Basu , Shantanu D. Kulkarni , Prosenjit Ghosh , Konstantin I. Kouliachev
IPC: H05K7/20 , H05K3/00 , H01L21/48 , H01L23/538 , H01L23/427 , H05K1/02 , H05K1/18
Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
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7.
公开(公告)号:US20170314874A1
公开(公告)日:2017-11-02
申请号:US15393258
申请日:2016-12-29
Applicant: Intel Corporation
Inventor: Sumita Basu , Shantanu D. Kulkarni , Prosenjit Ghosh , Konstantin I. Kouliachev
CPC classification number: H05K7/20336 , F28C3/08 , F28D15/0233 , F28D15/025 , F28D15/0275 , F28D15/0283 , F28D15/046 , F28D2021/0029 , F28F13/16 , F28F2215/06 , G02B6/0085 , G02F1/133385 , G06F1/1601 , G06F1/20 , G06F1/203 , H01L21/4846 , H01L21/4871 , H01L23/427 , H01L23/5389 , H05K1/0203 , H05K1/185 , H05K3/0017 , H05K3/0044 , H05K5/0017 , H05K7/20318 , H05K7/20809 , H05K2201/064
Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.
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公开(公告)号:US20250008685A1
公开(公告)日:2025-01-02
申请号:US18216049
申请日:2023-06-29
Applicant: Intel Corporation
Inventor: Jeff Ku , Nirmala Bailur , Min Suet Lim , Tongyan Zhai , Chee Chun Yee , Ruander Cardenas , Lance Lin , Eng Huat Goh , Javed Shaikh , Jun Liao , Kavitha Nagarajan , Tin Poay Chuah , Martin M. Chang , Shantanu D. Kulkarni , Telesphor Kamgaing
Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for cooling electronic devices. An example apparatus includes a fan module for an electronic device. The fan module includes a first cover; a second cover; an input/output (IO) board adjacent the second cover, the second cover and IO board beneath the first cover; and a fan between the first cover and the second cover, the fan to operate above the second cover and a portion of the IO board.
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公开(公告)号:US11917888B2
公开(公告)日:2024-02-27
申请号:US17520562
申请日:2021-11-05
Applicant: Intel Corporation
Inventor: Ramon C. Cancel Olmo , Evrim Binboga , Vivek Paranjape , Satish Prathaban , Shantanu D. Kulkarni , Kunjal S. Parikh , Siddhartha Saxena
Abstract: Cameras are located within the display area of a display. In-display cameras allow for thinner display bezels. In-display cameras allow for the creation of ultra-high resolution images. The ability to capture an object from multiple perspectives allows for holographic image recording and playback. Multiple views of an image can be captured with varying depths of focus, allowing an image's depth of field to be adjusted during post processing. In-display cameras can also be used for user authentication, touch detection and three-dimensional gesture recognition. Thermal sensors located within the display area allow for control of the display temperature, improved control over system performance, and compensation for micro-LED degradation that can occur due to aging or increased temperature. Microlens assemblies located above pixels can adjust the viewing cone angle of the display or a portion of the display and microassemblies located under individual pixels or pixel arrays can adjust a viewing angle.
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10.
公开(公告)号:US10917994B2
公开(公告)日:2021-02-09
申请号:US15393258
申请日:2016-12-29
Applicant: Intel Corporation
Inventor: Sumita Basu , Shantanu D. Kulkarni , Prosenjit Ghosh , Konstantin I. Kouliachev
IPC: H05K7/20 , F28D15/02 , G06F1/20 , H05K1/02 , H01L21/48 , H01L23/427 , H01L23/538 , H05K1/18 , H05K3/00 , F28D15/04 , F28F13/16 , F28C3/08 , G06F1/16 , H05K5/00 , F28D21/00 , F21V8/00 , G02F1/1333
Abstract: A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.
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