公开(公告)号：US11196165B2

公开(公告)日：2021-12-07

申请号：US16017093

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Sri Chaitra Chavali ,  Siddharth Alur ,  Sheng Li

IPC: H01Q9/04 ,  H01L23/66 ,  H01Q5/35 ,  H01Q1/22

Abstract: Embodiments include antennas, methods of forming antennas, and a semiconductor package. An antenna includes a feed port disposed in a substrate, and the feed port having a first patch and a second patch. The first patch is disposed on a top surface of substrate, and the second patch is disposed on a bottom surface of substrate. The antenna includes a photoimageable dielectric (PID) disposed on the bottom surface of substrate, where PID surrounds the second patch. The antenna includes a third patch disposed on PID, where the third patch is below the second patch. The antenna includes a cavity disposed between the second and third patches, where the cavity is enclosed by PID and third patch. An additional antenna includes a patch disposed on a first substrate, and a feed port disposed in a second substrate. This antenna includes a composite layer disposed between the first and second substrates.

公开(公告)号：US11508636B2

公开(公告)日：2022-11-22

申请号：US16024697

申请日：2018-06-29

Applicant: Intel Corporation

Inventor： Andrew Brown ,  Ji Yong Park ,  Siddharth Alur ,  Cheng Xu ,  Amruthavalli Alur

IPC: H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: Embodiments include an electronic package and methods of forming an electronic package. In an embodiment, the electronic package comprises a substrate, and a plurality of conductive features formed over the substrate. In an embodiment, a bilayer build-up layer is formed over the plurality of conductive features. In an embodiment, the bilayer build-up layer comprises a first dielectric layer and a second dielectric layer. In an embodiment, a surface of the first dielectric layer comprises depressions. In an embodiment, the second dielectric layer is disposed in the depressions of the surface of the first dielectric layer.