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公开(公告)号：US10578647B2
公开(公告)日：2020-03-03
申请号：US15720742
申请日：2017-09-29
Applicant: Intel Corporation
Inventor： Todd Albertson , Jin Yang , Donald E. Edenfeld
Abstract: Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.
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公开(公告)号：US20190101569A1
公开(公告)日：2019-04-04
申请号：US15720742
申请日：2017-09-29
Applicant: Intel Corporation
Inventor： Todd Albertson , Jin Yang , Donald E. Edenfeld
Abstract: Embodiments may include systems and methods for manufacturing a probe for wafer sorting or die testing. A probe for wafer sorting or die testing may include a probe body and a probe tip. The probe body may include a probe core and a probe plating layer around the probe core. The probe core may include a first material, and the probe plating layer may include a second material. The probe tip may be next to the probe core of the probe body and may include the first material. In addition, the probe tip may have an end surface that is smaller than a surface of the probe core, and larger than a single point. A probe-manufacturing device may include a forging unit, a clipping unit, and an actuation mechanism to control the forging unit and the clipping unit. Other embodiments may be described and/or claimed.
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