公开(公告)号：US20240297119A1

公开(公告)日：2024-09-05

申请号：US18573116

申请日：2021-12-22

Applicant: Intel Corporation

Inventor： Srikant Nekkanty ,  Karumbu Meyyappan ,  Andres Ramirez Macias ,  Zhe Chen ,  Jeffory L. Smalley ,  Zhichao Zhang ,  Steven A. Klein ,  Eric Erike

IPC: H01L23/532 ,  H01L23/32 ,  H01L23/40 ,  H01L23/498 ,  H01L23/528

CPC classification number: H01L23/53209 ,  H01L23/32 ,  H01L23/4093 ,  H01L23/49811 ,  H01L23/5283

Abstract: An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal. In selected examples, the interconnect socket (102, 302, 402) includes a resilient material spacer (130, 230, 330, 430) located between pins (110, 210, 310, 410) in an array of pins (110, 210, 310, 410). In selected examples, the electronic device (1000) includes configurations to aid in de-socketing.

公开(公告)号：US11862547B2

公开(公告)日：2024-01-02

申请号：US16804516

申请日：2020-02-28

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Zhe Chen ,  Srikant Nekkanty ,  Sriram Srinivasan

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/58

CPC classification number: H01L23/49838 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/58

Abstract: Embodiments include assemblies. An assembly includes a substrate having a first interconnect and a second interconnect. The first interconnect has a first conductive pad and a second conductive pad, and the second interconnect has a third conductive pad and a fourth conductive pad. The assembly includes a socket over the substrate. The socket has a first pin, a second pin, and a base layer with a first pad and a second pad. The first and second pins are vertically over the respective first and second interconnects. The first pad is directly coupled to the first pin and fourth conductive pad, while the second pad is directly coupled to the second pin and second conductive pad. The first pad is positioned partially within a footprint of the third conductive pad, and the second pad is positioned partially within a footprint of the first conductive pad.

公开(公告)号：US20220407254A1

公开(公告)日：2022-12-22

申请号：US17352103

申请日：2021-06-18

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Zhe Chen ,  Steven A. Klein ,  Feifei Cheng ,  Srikant Nekkanty ,  Kemal Aygun ,  Michael E. Ryan ,  Pooya Tadayon

IPC: H01R12/72 ,  H01R43/16 ,  H01R13/17

Abstract: A microelectronic socket structure and a method of forming the same. The socket structure comprises: a socket structure housing defining a cavity therein; and an interconnection structure including: a contact element disposed at least in part within the cavity, and configured to be electrically coupled to a corresponding microelectronic package, the contact element corresponding to one of a signal contact element or a ground contact element; and a conductive structure disposed at least in part within the cavity, electrically coupled to the contact element, and having an outer contour that is non-conformal with respect to an outer contour of the contact element.

公开(公告)号：US12126103B2

公开(公告)日：2024-10-22

申请号：US17131686

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Zhe Chen ,  Ahmet C. Durgun ,  Zhichao Zhang

IPC: H01R12/71 ,  H01R12/70 ,  H01R13/24 ,  H01R13/6585 ,  H01R13/6594 ,  H01R13/6597 ,  H01R33/76

CPC classification number: H01R12/714 ,  H01R12/7076 ,  H01R13/2407 ,  H01R13/6585 ,  H01R13/6594 ,  H01R13/6597 ,  H01R33/76 ,  H01R13/2471

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.