Miniature ultrasonic transducer package

    公开(公告)号:US11508346B2

    公开(公告)日:2022-11-22

    申请号:US15987824

    申请日:2018-05-23

    Abstract: A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an opening in the substrate. The substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT located within the cavity.

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