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公开(公告)号:US12284920B2
公开(公告)日:2025-04-22
申请号:US18381104
申请日:2023-10-17
Applicant: InvenSense, Inc.
Inventor: Andre Guedes , Fabian Goericke , Stefon Shelton , Benedict Costello , David Horsley
IPC: H10N30/50 , H04R17/00 , H10N30/057 , H10N30/87 , H10N30/88
Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
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公开(公告)号:US20240049602A1
公开(公告)日:2024-02-08
申请号:US18381104
申请日:2023-10-17
Applicant: InvenSense, Inc.
Inventor: Andre Guedes , Fabian Goericke , Stefon Shelton , Benedict Costello , David Horsley
IPC: H10N30/50 , H04R17/00 , H10N30/057 , H10N30/87 , H10N30/88
CPC classification number: H10N30/50 , H04R17/00 , H10N30/057 , H10N30/871 , H10N30/883
Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
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公开(公告)号:US11508346B2
公开(公告)日:2022-11-22
申请号:US15987824
申请日:2018-05-23
Applicant: Invensense, Inc.
Inventor: Stefon Shelton , Andre Guedes , David Horsley
Abstract: A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an opening in the substrate. The substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT located within the cavity.
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公开(公告)号:US11844282B2
公开(公告)日:2023-12-12
申请号:US16802436
申请日:2020-02-26
Applicant: InvenSense, Inc.
Inventor: Andre Guedes , Fabian Goericke , Stefon Shelton , Benedict Costello , David Horsley
IPC: H01L41/083 , H10N30/50 , H04R17/00 , H10N30/057 , H10N30/87 , H10N30/88
CPC classification number: H10N30/50 , H04R17/00 , H10N30/057 , H10N30/871 , H10N30/883
Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
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公开(公告)号:US11711067B2
公开(公告)日:2023-07-25
申请号:US16794099
申请日:2020-02-18
Applicant: InvenSense, Inc.
Inventor: Stefon Shelton , Andre Guedes , Richard Przybyla , Meng-Hsiung Kiang , David Horsley
CPC classification number: H03H9/174 , B06B1/0603 , H03H9/02244 , H03H9/178 , H04R17/00 , H10N30/2047 , H10N30/853 , H10N30/8542 , H10N30/8554 , H03H2009/155
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
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