公开(公告)号：US10717641B2

公开(公告)日：2020-07-21

申请号：US15846990

申请日：2017-12-19

Applicant: InvenSense, Inc.

Inventor： Alexander Castro ,  Chae Ahn

IPC: B81B3/00 ,  B81B7/00 ,  G01L1/10 ,  B81C99/00

Abstract: In some embodiments, a sensor includes a microelectromechanical system (MEMS) structure, a cover, and a bump stop. The MEMS structure is configured to move responsive to electromechanical stimuli. The cover is positioned on the MEMS structure. The cover is configured to mechanically protect the MEMS structure. The bump stop is disposed on a substrate and the bump stop is configured to stop the MEMS structure from moving beyond a certain point. The bump stop is further configured to stop the MEMS structure from making physical contact with the substrate. Moreover, the cover is configured to apply a force to the MEMS structure responsive to a voltage being applied to the cover.