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公开(公告)号：US20220279689A1
公开(公告)日：2022-09-01
申请号：US17663851
申请日：2022-05-18
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
IPC: H05K13/00 , B25B11/00 , B29C64/364
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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公开(公告)号：US11785754B2
公开(公告)日：2023-10-10
申请号：US17808035
申请日：2022-06-21
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
IPC: B23P19/00 , H05K13/04 , H05K13/00 , B25B11/00 , B29C64/364 , B41F15/08 , B33Y10/00 , B33Y80/00 , B41F15/18 , B41F15/34 , B41F15/46
CPC classification number: H05K13/0069 , B25B11/002 , B25B11/005 , B29C64/364 , B41F15/08 , B33Y10/00 , B33Y80/00 , B41F15/18 , B41F15/34 , B41F15/46 , H05K2203/0165
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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公开(公告)号：US20240248463A1
公开(公告)日：2024-07-25
申请号：US18560535
申请日：2022-05-11
Applicant: JABIL INC.
Inventor： Anwar A. Mohammed , Harpuneet Singh , Nicholas Randall Tokotch , Gary Rojo , Bonnie Lowell
IPC: G05B19/418 , H05K3/12
CPC classification number: G05B19/41875 , H05K3/1233 , G05B2219/32194 , G05B2219/37217
Abstract: An AI enhanced self-correcting and closed loop SMT manufacturing system for fabricating PCBAs. The system includes a screen printer for depositing solder paste on solder pads on a RGB, an SRI sub-system for inspecting the solder paste deposited on the PCB to identify defects, a pick-and-place machine for placing circuit components on the solder paste, an AOI sub-system for inspecting the PCB after the circuit components are placed on the PCB, and a reflow soldering oven for bonding component leads both electrically and mechanically to the pads on the PCB. An AI/ML analysis engine is responsive to process data and variables from each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven and provides downstream feedback signals to each of the screen printer, the SPI sub-system, the pick-and-place machine, the AOI sub-system and the reflow soldering oven for self-correction purposes.
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公开(公告)号：US20230363128A1
公开(公告)日：2023-11-09
申请号：US18352476
申请日：2023-07-14
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
IPC: H05K13/00 , B25B11/00 , B29C64/364 , B41F15/08
CPC classification number: H05K13/0069 , B25B11/005 , B29C64/364 , B25B11/002 , B41F15/08 , H05K2203/0165 , B33Y10/00
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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Patent Agency Ranking
公开(公告)号：US11477926B2
公开(公告)日：2022-10-18
申请号：US17015841
申请日：2020-09-09
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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公开(公告)号：US11903134B2
公开(公告)日：2024-02-13
申请号：US17663851
申请日：2022-05-18
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
IPC: B41F15/08 , B41F15/26 , H05K13/00 , B25B11/00 , B29C64/364 , B33Y10/00 , B33Y80/00 , B41F15/18 , B41F15/34 , B41F15/46
CPC classification number: H05K13/0069 , B25B11/002 , B25B11/005 , B29C64/364 , B41F15/08 , B33Y10/00 , B33Y80/00 , B41F15/18 , B41F15/34 , B41F15/46 , H05K2203/0165
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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公开(公告)号：US20220322587A1
公开(公告)日：2022-10-06
申请号：US17808035
申请日：2022-06-21
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
IPC: H05K13/00 , B25B11/00 , B29C64/364
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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公开(公告)号：US20220108965A1
公开(公告)日：2022-04-07
申请号：US17314356
申请日：2021-05-07
Applicant: JABIL INC.
Inventor： Anwar A. Mohammed , Harpuneet Singh
IPC: H01L23/00 , H01L23/498 , H01L21/50
Abstract: A ball grid array (BGA) including at least one BGA chip and a plurality of solder balls directly connected to a substrate, such as a printed circuit board (PCB), where the solder balls include an epoxy. A method for producing a BGA package including providing a BGA having a plurality of epoxy-containing solder balls, positioning the BGA on a substrate, such as a PCB, and applying heat to reflow the epoxy-containing solder balls and to create a connection between the BGA and the PCB.
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公开(公告)号：US20220078955A1
公开(公告)日：2022-03-10
申请号：US17015841
申请日：2020-09-09
Applicant: JABIL INC.
Inventor： Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
IPC: H05K13/00 , B25B11/00 , B29C64/364
Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
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