公开(公告)号：US20220279689A1

公开(公告)日：2022-09-01

申请号：US17663851

申请日：2022-05-18

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20230363128A1

公开(公告)日：2023-11-09

申请号：US18352476

申请日：2023-07-14

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B41F15/08

CPC classification number: H05K13/0069 ,  B25B11/005 ,  B29C64/364 ,  B25B11/002 ,  B41F15/08 ,  H05K2203/0165 ,  B33Y10/00

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US11477926B2

公开(公告)日：2022-10-18

申请号：US17015841

申请日：2020-09-09

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K3/30 ,  H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B33Y10/00 ,  B33Y80/00

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20250041958A1

公开(公告)日：2025-02-06

申请号：US18717035

申请日：2022-12-07

Applicant: JABIL INC.

Inventor： Charles Santhakumar ,  Harpuneet SINGH ,  Anwar A. MOHAMMED ,  Michael TORREGROSSA

IPC: B23K1/08 ,  B23K1/00

Abstract: A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.

公开(公告)号：US11785754B2

公开(公告)日：2023-10-10

申请号：US17808035

申请日：2022-06-21

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: B23P19/00 ,  H05K13/04 ,  H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B41F15/08 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46

CPC classification number: H05K13/0069 ,  B25B11/002 ,  B25B11/005 ,  B29C64/364 ,  B41F15/08 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46 ,  H05K2203/0165

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20250033131A1

公开(公告)日：2025-01-30

申请号：US18717046

申请日：2022-12-07

Applicant: JABIL INC.

Inventor： Charles Santhakumar ,  Harpuneet SINGH ,  Anwar A. MOHAMMED ,  Michael TORREGROSSA

IPC: B23K3/04 ,  B23K3/06 ,  B23K3/08 ,  B23K101/42 ,  F27B9/24 ,  F27B9/40 ,  F27D19/00 ,  G01N21/956 ,  G01N23/18 ,  H05K3/12 ,  H05K3/30 ,  H05K13/04

Abstract: A reflow soldering oven for soldering and/or bonding component leads both electrically and mechanically to pads on a PCB in an SMT manufacturing system. The soldering oven includes at least one thermal infrared camera that generates thermal images of the PCB to provide thermal imaging processing to monitor and correct temperature deviations in real time. The oven generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling and to initiate changes like temperature control or the oven belt-speed monitoring to offer self-correcting capabilities.

公开(公告)号：US11903134B2

公开(公告)日：2024-02-13

申请号：US17663851

申请日：2022-05-18

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: B41F15/08 ,  B41F15/26 ,  H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46

CPC classification number: H05K13/0069 ,  B25B11/002 ,  B25B11/005 ,  B29C64/364 ,  B41F15/08 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46 ,  H05K2203/0165

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20220322587A1

公开(公告)日：2022-10-06

申请号：US17808035

申请日：2022-06-21

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20220078955A1

公开(公告)日：2022-03-10

申请号：US17015841

申请日：2020-09-09

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.