公开(公告)号：US20230363128A1

公开(公告)日：2023-11-09

申请号：US18352476

申请日：2023-07-14

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B41F15/08

CPC classification number: H05K13/0069 ,  B25B11/005 ,  B29C64/364 ,  B25B11/002 ,  B41F15/08 ,  H05K2203/0165 ,  B33Y10/00

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US11477926B2

公开(公告)日：2022-10-18

申请号：US17015841

申请日：2020-09-09

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K3/30 ,  H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B33Y10/00 ,  B33Y80/00

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US11903134B2

公开(公告)日：2024-02-13

申请号：US17663851

申请日：2022-05-18

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: B41F15/08 ,  B41F15/26 ,  H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46

CPC classification number: H05K13/0069 ,  B25B11/002 ,  B25B11/005 ,  B29C64/364 ,  B41F15/08 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46 ,  H05K2203/0165

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20220322587A1

公开(公告)日：2022-10-06

申请号：US17808035

申请日：2022-06-21

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20220078955A1

公开(公告)日：2022-03-10

申请号：US17015841

申请日：2020-09-09

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US11785754B2

公开(公告)日：2023-10-10

申请号：US17808035

申请日：2022-06-21

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: B23P19/00 ,  H05K13/04 ,  H05K13/00 ,  B25B11/00 ,  B29C64/364 ,  B41F15/08 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46

CPC classification number: H05K13/0069 ,  B25B11/002 ,  B25B11/005 ,  B29C64/364 ,  B41F15/08 ,  B33Y10/00 ,  B33Y80/00 ,  B41F15/18 ,  B41F15/34 ,  B41F15/46 ,  H05K2203/0165

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

公开(公告)号：US20220279689A1

公开(公告)日：2022-09-01

申请号：US17663851

申请日：2022-05-18

Applicant: JABIL INC.

Inventor： Darin Burgess ,  Randy Crockett ,  Timothy DeRosett ,  Charles Santhakumar ,  Scott Klimczak ,  Anwar A. Mohammed ,  Luke Rodgers ,  Harpuneet Singh ,  Daniel Torres ,  Felipe Torres

IPC: H05K13/00 ,  B25B11/00 ,  B29C64/364

Abstract: Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.