公开(公告)号：US11191169B2

公开(公告)日：2021-11-30

申请号：US17038982

申请日：2020-09-30

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/36 ,  H05K3/34 ,  H01L23/00 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00 ,  B23K101/42 ,  B23K103/08 ,  B32B37/06

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US11765837B2

公开(公告)日：2023-09-19

申请号：US17504812

申请日：2021-10-19

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/36 ,  H05K3/34 ,  H01L23/00 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00 ,  B23K101/42 ,  B23K103/08 ,  B32B37/06

CPC classification number: H05K3/3494 ,  B23K20/007 ,  B23K20/025 ,  B23K20/233 ,  B23K20/24 ,  B23K35/0222 ,  B23K35/3013 ,  H01L21/84 ,  H01L24/80 ,  H05K1/111 ,  H05K1/117 ,  H05K3/321 ,  H05K3/361 ,  H05K3/363 ,  H05K3/4015 ,  H05K13/0015 ,  B23K2101/42 ,  B23K2103/08 ,  B32B37/06 ,  H05K2203/049 ,  H05K2203/166 ,  Y02P70/50 ,  Y02P70/62

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US20240008189A1

公开(公告)日：2024-01-04

申请号：US18468984

申请日：2023-09-18

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/34 ,  H01L23/00 ,  H05K3/36 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00

CPC classification number: H05K3/3494 ,  H01L24/80 ,  H05K3/361 ,  H05K3/363 ,  B23K20/025 ,  B23K20/233 ,  H01L21/84 ,  H05K1/117 ,  B23K20/007 ,  B23K20/24 ,  B23K35/0222 ,  B23K35/3013 ,  H05K1/111 ,  H05K3/321 ,  H05K3/4015 ,  H05K13/0015 ,  B23K2101/42

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US20210014977A1

公开(公告)日：2021-01-14

申请号：US17038982

申请日：2020-09-30

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/34 ,  H01L23/00 ,  H05K3/36 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US12185476B2

公开(公告)日：2024-12-31

申请号：US18468984

申请日：2023-09-18

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/36 ,  B23K20/00 ,  B23K20/02 ,  B23K20/233 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H01L21/84 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K13/00 ,  B23K101/42 ,  B23K103/08 ,  B32B37/06

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US20220095463A1

公开(公告)日：2022-03-24

申请号：US17504812

申请日：2021-10-19

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/34 ,  H01L23/00 ,  H05K3/36 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US10813230B2

公开(公告)日：2020-10-20

申请号：US16561998

申请日：2019-09-05

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/36 ,  H05K3/34 ,  H01L23/00 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H05K1/11 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00 ,  B23K101/42 ,  B23K103/08

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US20190394885A1

公开(公告)日：2019-12-26

申请号：US16561998

申请日：2019-09-05

Applicant: Jabil Inc.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/34 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.

公开(公告)号：US10448517B2

公开(公告)日：2019-10-15

申请号：US15344101

申请日：2016-11-04

Applicant: JABIL INC.

Inventor： Wenlu Wang ,  Mark A. Tudman ,  Michael Piring Santos ,  Ross Kristensen Benz ,  Hien Ly ,  Gary Fang

IPC: H05K3/36 ,  H05K3/34 ,  B23K20/00 ,  B23K20/24 ,  B23K35/02 ,  B23K35/30 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K13/00 ,  B23K20/02 ,  B23K20/233 ,  H01L21/84 ,  H01L23/00 ,  B23K101/42 ,  B23K103/08

Abstract: A method and apparatus for multiple flexible circuit cable attachment is described herein. Gold bumps are bonded on interconnection pads of a substrate to create a columnar structure and solder or conductive epoxy is dispensed on the flexible cable circuit. The substrate and flexible cable circuit are aligned and pressed together using force or placement of a weight on either the substrate or flexible cable circuit. Appropriate heat is applied to reflow the solder or cure the epoxy. The solder wets to the substrate pads, assisted by the gold bumps, and have reduced bridging risk due to the columnar structure. A nonconductive underfill epoxy is applied to increase mechanical strength.