Patent search ap:("James Jen-Ho Wang") AND inv:"James Jen-Ho Wang" Page 1

1.

发明授权
Inductor, transformer, and method 有权

公开(公告)号：US09799448B2

公开(公告)日：2017-10-24

申请号：US14505474

申请日：2014-10-02

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01F27/29 , H01F41/04 , H01F27/28

CPC classification number: H01F41/042 , H01F27/2804 , H01F27/29

Abstract: In accordance with an embodiment, a circuit element includes a flexible foldable substrate having portions of a first inductor formed on first and second major surfaces of the flexible substrate. In accordance with another embodiment, a first electrically conductive trace having a first terminal, a second terminal, and a first annular-shaped portion between the first terminal and the second terminal is formed on a first portion of the first major surface. A second electrically conductive trace having a first terminal, a second terminal, a first annular-shaped portion between the first terminal and the second terminal of the second electrically conductive trace, and a second annular-shaped portion between the first terminal and the second terminal of the second electrically conductive trace is formed on the second major surface. The first electrically conductive trace is coupled to the second electrically conductive trace by a thru-via.

2.

发明申请
Programmable anti-fuse wire bond pads 审中-公开
Title translation: 可编程抗熔丝接合焊盘

公开(公告)号：US20120061796A1

公开(公告)日：2012-03-15

申请号：US12807756

申请日：2010-09-14

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L23/525 , H01L21/768

CPC classification number: H01L23/5252 , H01L23/522 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/02166 , H01L2224/04042 , H01L2224/05551 , H01L2224/05552 , H01L2224/05563 , H01L2224/05624 , H01L2224/05647 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48453 , H01L2224/48463 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01L2924/01024 , H01L2924/01046 , H01L2924/00 , H01L2224/45015 , H01L2924/207

Abstract: A mechanically programmable anti-fuse is configured in a thick, top metallic layer of a semiconductor. The metallic layer is selected of a material that possesses malleable properties. The metal anti-fuse programming pad is surrounded, either wholly or in part, by a pad segment. An intervening space between the anti-fuse pad and the pad segment is selected from a predetermined value such that capillary pressure, exerted when a ball-bond is placed atop the anti-fuse pad and the pad segment, causes the pads to deform and shorts to the anti-fuse pad to the pad segment. The shorting, created during the wire bonding process, programs the anti-fuse.

Abstract translation: 机械可编程的反熔丝被配置在半导体的厚的顶部金属层中。金属层选自具有韧性的材料。金属反熔丝编程焊盘全部或部分由焊盘段包围。反熔丝焊盘和焊盘部分之间的中间空间从预定值中选择，使得当将球接头放置在反熔丝焊盘和焊盘部分顶部时施加的毛细管压力导致焊盘变形和短路到反熔丝焊盘到焊盘段。在引线接合过程中产生的短路程序是防熔丝。

3.

发明申请
CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR 审中-公开
Title translation: 通过钝化和聚合物的接触及其方法

公开(公告)号：US20100015793A1

公开(公告)日：2010-01-21

申请号：US12569022

申请日：2009-09-29

Applicant: James Jen-Ho Wang , Paul T. Hui

Inventor： James Jen-Ho Wang , Paul T. Hui

IPC: H01L21/768

CPC classification number: H01L21/76801 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/19043 , H01L2924/00014 , H01L2924/00

Abstract: A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer and a polyimide layer separate the last interconnect layer and the bond pad. The passivation layer is patterned to form a first opening to contact the last interconnect layer. The polyimide layer is also patterned to leave a second opening that is inside and thus smaller than the first opening through the passivation. The barrier layer is then deposited in contact with the last interconnect layer and bounded by the polyimide layer. The bond pad is then formed in contact with the barrier, and a wire bond is then made to the bond pad.

Abstract translation: 半导体器件在最后的互连层和包含接合焊盘和最后互连层之间的阻挡金属的接合焊盘之间具有接触。钝化层和聚酰亚胺层都分离最后的互连层和接合焊盘。图案化钝化层以形成第一开口以接触最后的互连层。聚酰亚胺层也被图案化以留下内部的第二开口，因此比通过钝化的第一开口小。然后将阻挡层沉积成与最后的互连层接触并且被聚酰亚胺层界定。然后将接合焊盘形成为与阻挡层接触，然后对接合焊盘进行引线接合。

4.

发明授权
Electronic device including an inductor 失效
Title translation: 包括电感器的电子设备

公开(公告)号：US07619297B2

公开(公告)日：2009-11-17

申请号：US12390133

申请日：2009-02-20

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L29/00

CPC classification number: H01L23/5227 , H01F17/0033 , H01F2027/2814 , H01L23/552 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L27/092 , H01L2224/04042 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/48091 , H01L2224/4813 , H01L2224/4845 , H01L2224/48455 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599

Abstract: An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.

Abstract translation: 电子设备可以包括覆盖减震层的电感器。在一个方面，电子设备可以包括衬底，覆盖衬底的互连电平以及覆盖互连电平的减震层。电感器可以包括导电迹线和环形导线。导电迹线可以连接到震动吸收层上的导电迹线上。在另一方面，可以使用一种方法来形成包括电感器的电子设备。另一方面，电子设备可以是包括串联连接的线性电感器段的环形电感器。

5.

发明申请
FILM SENSORS ARRAY AND METHOD 审中-公开

公开(公告)号：US20180114784A1

公开(公告)日：2018-04-26

申请号：US15790057

申请日：2017-10-23

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L25/16 , G01K7/01 , H01L25/00 , H01L23/32 , H01L23/46

Abstract: In accordance with an embodiment, sensor structure has a first, second, and third laminated structures. The second laminated structure is positioned between the first laminated structure and the third laminated structure. The first laminated structure includes a first portion of a first sensing element and the third laminated structure includes a second portion of the first sensing element. The second laminated structure includes spacer elements that can be used to adjust the sensitivity of the sensor structure.

6.

发明申请
ELECTRONIC DEVICE INCLUDING AN INDUCTOR 失效
Title translation: 包括电感器的电子器件

公开(公告)号：US20090152676A1

公开(公告)日：2009-06-18

申请号：US12390133

申请日：2009-02-20

Applicant: James Jen-Ho Wang

Inventor： James Jen-Ho Wang

IPC: H01L23/52

CPC classification number: H01L23/5227 , H01F17/0033 , H01F2027/2814 , H01L23/552 , H01L24/05 , H01L24/06 , H01L24/48 , H01L24/49 , H01L27/092 , H01L2224/04042 , H01L2224/05554 , H01L2224/05644 , H01L2224/45015 , H01L2224/48091 , H01L2224/4813 , H01L2224/4845 , H01L2224/48455 , H01L2224/48463 , H01L2224/4847 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01016 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/20752 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599

Abstract: An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.

Abstract translation: 电子设备可以包括覆盖减震层的电感器。在一个方面，电子设备可以包括衬底，覆盖衬底的互连电平以及覆盖互连电平的减震层。电感器可以包括导电迹线和环形导线。导电迹线可以连接到震动吸收层上的导电迹线上。在另一方面，可以使用一种方法来形成包括电感器的电子设备。另一方面，电子设备可以是包括串联连接的线性电感器段的环形电感器。

7.

发明申请
CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR 有权
Title translation: 通过钝化和聚合物的接触及其方法

公开(公告)号：US20070275549A1

公开(公告)日：2007-11-29

申请号：US11419798

申请日：2006-05-23

Applicant: James Jen-Ho Wang , Paul T. Hui

Inventor： James Jen-Ho Wang , Paul T. Hui

IPC: H01L21/44

CPC classification number: H01L21/76801 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/45144 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/14 , H01L2924/19043 , H01L2924/00014 , H01L2924/00

Abstract: A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer and a polyimide layer separate the last interconnect layer and the bond pad. The passivation layer is patterned to form a first opening to contact the last interconnect layer. The polyimide layer is also patterned to leave a second opening that is inside and thus smaller than the first opening through the passivation. The barrier layer is then deposited in contact with the last interconnect layer and bounded by the polyimide layer. The bond pad is then formed in contact with the barrier, and a wire bond is then made to the bond pad.

Abstract translation: 半导体器件在最后的互连层和包含接合焊盘和最后互连层之间的阻挡金属的接合焊盘之间具有接触。钝化层和聚酰亚胺层都分离最后的互连层和接合焊盘。图案化钝化层以形成第一开口以接触最后的互连层。聚酰亚胺层也被图案化以留下内部的第二开口，因此比通过钝化的第一开口小。然后将阻挡层沉积成与最后的互连层接触并且被聚酰亚胺层界定。然后将接合焊盘形成为与阻挡层接触，然后对接合焊盘进行引线接合。

8.

发明授权
Semiconductor device with strain relieving bump design 有权
Title translation: 具有应变消除凸块设计的半导体器件

公开(公告)号：US06790759B1

公开(公告)日：2004-09-14

申请号：US10631102

申请日：2003-07-31

Applicant: James Jen-Ho Wang , Jin-Wook Jang , Alfredo Mendoza , Rajashi Runton , Russell Shumway

Inventor： James Jen-Ho Wang , Jin-Wook Jang , Alfredo Mendoza , Rajashi Runton , Russell Shumway

IPC: H01L2144

CPC classification number: H01L24/16 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/02335 , H01L2224/0401 , H01L2224/081 , H01L2224/1147 , H01L2224/13027 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00012

Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

Abstract translation: 提供半导体器件（51）。所述装置（51）包括其上具有接触垫（61）的模具（53），具有与所述接触垫（61）电连通的基部（64）的再分配导体（59）和横向延伸部分（63），与再分布导体（59）电连通的凸起触头（65）和设置在再分布导体（59）的横向延伸部分（63）和模具（...）之间的钝化层（57） 53）。优选地，再分配导体（59）被卷积并且适于在足够的应力下从钝化层（57）剥离或分层，使得其可以相对于钝化层（57）和基部（64）移动以减轻机械应力在基板（69）和模具（53）之间。容纳小CTE失配应变而不会发生故障的凸起和卷绕再分配导体（59）允许DCA倒装芯片可靠，无需底部填充或额外的组装过程。