公开(公告)号：US11958073B2

公开(公告)日：2024-04-16

申请号：US18151482

申请日：2023-01-09

Applicant: Japan Display Inc.

Inventor： Takanobu Takenaka ,  Atsushi Takeda

IPC: B05D1/00 ,  B05D1/36 ,  H10K71/16

CPC classification number: B05D1/60 ,  B05D1/36 ,  H10K71/16 ,  B05D2401/33

Abstract: According to one embodiment, a deposition method includes preparing a processing substrate in which a lower electrode, a rib, and a partition including a lower portion and an upper portion arranged on the lower portion and protruding from a side surface of the lower portion are formed above a substrate, setting a spread angle of vapor of a first material emitted from a first deposition head to a first angle, and depositing the first material on the processing substrate, and setting a spread angle of vapor of a second material emitted from a second deposition head to a second angle larger than the first angle, and depositing the second material on the processing substrate on which the first material is deposited.