公开(公告)号：US09907163B2

公开(公告)日：2018-02-27

申请号：US15418991

申请日：2017-01-30

Applicant: Japan Display Inc.

Inventor： Yuuki Nishimoto

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0281 ,  H05K1/0271 ,  H05K1/115 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A flexible circuit board includes a base material including a first surface and a second surface opposite the first surface, the base material including a conductor layer, a first insulating film covering the first surface of the base material and formed with a first opening, a first insulating member formed inside the first opening and formed with a connection port to expose the conductor layer, the first insulating member having a thermal expansion coefficient smaller than that of the first insulating film, a second insulating film covering the second surface of the base material and formed with a second opening overlapping at least a portion of the first opening in a plan view, and a second insulating member formed inside the second opening and having a thermal expansion coefficient smaller than that of the first insulating film.

公开(公告)号：US09891486B2

公开(公告)日：2018-02-13

申请号：US15087163

申请日：2016-03-31

Applicant: Japan Display Inc.

Inventor： Yuuki Nishimoto

IPC: H05K1/00 ,  G02F1/1345

CPC classification number: G02F1/13452

Abstract: A display device includes a display panel and a flexible wiring board, an end portion of which is joined to the display panel. The flexible wiring board includes a flexible base substrate in which a through-hole is formed in a position not overlapping the display panel of an extending portion extending from the end portion joined to the display panel in plan view, a first wiring pattern formed to close the through-hole on one surface of the flexible base substrate, and a first resin layer having more flexibility than the flexible base substrate and formed to fill the through-hole formed in the flexible base substrate.