公开(公告)号：US20190104607A1

公开(公告)日：2019-04-04

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K3/22

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/40 ,  H05K1/111 ,  H05K1/18 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/10159 ,  H05K2201/10409 ,  H05K2201/1059 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K2203/167

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US20190099820A1

公开(公告)日：2019-04-04

申请号：US15723105

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: B23K3/08 ,  H05K3/34

Abstract: The disclosed apparatus may include (1) a removable stiffening brace that (A) temporarily interfaces with a bottom surface of a circuit board during a reflow process in which at least one component is soldered to the circuit board and (B) provides structural support to the circuit board to prevent the circuit board from warping during the reflow process and (2) at least one fastener that secures the removable stiffening brace to the bottom surface of the circuit board during the reflow process. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10588213B2

公开(公告)日：2020-03-10

申请号：US15723098

申请日：2017-10-02

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Gautam Ganguly ,  Marc D. Hartranft

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H01L23/40 ,  H01L23/36

Abstract: The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

公开(公告)号：US10242941B1

公开(公告)日：2019-03-26

申请号：US15671083

申请日：2017-08-07

Applicant: Juniper Networks, Inc.

Inventor： Peng Su ,  Helen L. Turner ,  Marc D. Hartranft ,  Gautam Ganguly ,  Guhan Subbarayan

IPC: H01L23/04 ,  H01L23/498 ,  H01L21/768 ,  H05K3/34 ,  H05K3/24

Abstract: The disclosed apparatus may include (1) a stiffening brace that (A) is coupled to a top surface of a lidless integrated circuit and (B) includes at least one joint and (2) a removable lid that (A) interfaces with the stiffening brace at the joint, (B) temporarily sits atop the stiffening brace during a reflow process in which a bottom surface of the lidless integrated circuit is soldered to a circuit board, and (C) provides structural support to the lidless integrated circuit to impede the lidless integrated circuit from warping during the reflow process. Various other apparatuses, systems, and methods are also disclosed.